THRU-HOLE DE-SOLDERING PROCESS

Thru-Hole De-Soldering Finally Made Really Easy!

Thru-Hole De-Soldering Without Lifting Pads & Traces!

Here’s how simple successful Thru-Hole De-soldering truly is: The Solution? Preheating! If a PCB Assembly can be made under 300°C in initial production, it can also be unmade and remade at similar temps!  Regardless of copper content, number of layers & heavy ground planes, all you need is a PCB fixture, an AirBath preheating unit, a dependable (non-clogging) desoldering tool & a few other choice items.

 

STEP 1: Secure your PCB into the ABC-1 Board Cradle and above the ZT-1 AirBath (not powered) as shown. Dip your brush into flux. (We recommend: No Clean Flux NCF-0014 and THB-0144 Thru-Hole Brush).


 

STEP 4b:  Heating the pin or lead. Position the De-Soldering Tip’s orifice onto the joint’s lead/stud. The solder will begin to melt. Now begin a rotating or oscillating motion with tip. Shortly, you wii “sense” the lead moving freely indicating solder is now molten through the entire hole.

STEP 2a:  Apply flux. Make application of flux to each targeted solder joint's lead and land interface that corresponds to the Thru-Hole device on the opposite side of PCB.



 

STEP 4c: Activate Vacuum! Upon sensing the lead is loose in the hole, and the solder is molten, lower tip to the pad & begin vacuum. Continue rotating motion to prevent “sweating” to sides of “plated thru-hole barrels”. Do not exert pressure to the pads during the process.

STEP 2b: Begin Preheating! Next,  begin the pre-heating process by flipping the rocker switch found on the AirBath to "Warm". (Typical preheating is done at 150°C).



 

STEP 4d:  After extracting solder from hole/barrel, lift the tip up off the pad and continue vacuum 3-4 extra seconds so solder travels to reservoir preventing clogging and accidental spilling of solder. Proceed to next joint. Turn off power when done.

STEP 3a: Apply LowMelt®. Note: The AirBath’s preheating advantage may permit you to skip to Step 4, but if you have heavy ground planes, high copper content or difficult PCB’s, consider this option: Take a strand of certified LowMelt® DeSolder Wire as shown.

 

STEP 5a:  Cool down & final cleaning.  Flip rocker switch of AirBath to “Cool” mode. This will cool down the PCB. Next, dip a brush into non-flammable flux remover. We recommend: NFR-0056.

STEP 3b: Melt LowMelt®. directly onto existing joints as needed. Co-metalization has begun! Because no two PCB’s are alike, some joints will require more LowMelt® (Note: Only use certified Zephyrtronics alloy).


 

STEP 5b: Clean PCB by brushing with Non-Flammable Flux Remover as PCB cools under the ZT-1 AirBath, (Clean as shown.  Inspect.  Turn off ZT-1 AirBath.  Flip PCB over and carefully extract component or connector.

STEP 4a:
Ready for DeSoldering! Using a MIL-Spec, Temp-Controlled Thru-Hole DeSoldering Tool (We recommend: the AT-86 Digital DeSoldering Station) and with the Digital Temp Set at no more than 300°C, take the Desoldering Pistol and lower the Desoldering Tip onto the solder joint stud.  Be Careful and do not lower tip to the pad at this point.