Low Temp SMD
and Thru-Hole Removal and BGA Pad Re-Dressing Solder
Now Available
Also in a Lead-Free and RoHS Compliant Formulation!
New!
Order Securely On-Line.
Rapid SMD & Thru-Hole Removal
Below 150° C (302° F)
Remove
SMD's At Temps Under 150°C: Our world-famous
LowMelt®
removes SMD's and Thru-Hole components at temperatures
300 to 400 degrees lower than other de-soldering
methods. SMD removal
all below 150°C! And
LowMelt®
is available
in both RoHS compliant (lead-free)
and in classic leaded alloys.
No Special
Nozzles Required! LowMelt®
removes SMD's and Thru-Hole chips without the need of
using a scorching, clumsy and expensive custom nozzle
for every single SMD! That's right...absolutely No
Nozzles!
The Science of LowMelt®
Makes It Easy! LowMelt®
allows rapid SMD and Thru-Hole removal
through the proven, decades-old process of
solder Co-Metalization with either a
just pre-heater placed below the PCB, or
with a simple soldering iron, or with
any heated desoldering tool or, yes,
even under a hot air nozzle.
LowMelt®
really works!
BGA Pad Re-Dressing! And LowMelt® DeSolder
is ideal for re-dressing BGA pads after component removal that does not require the use of problematic wick and hot contact soldering irons that degrade and lift pads.
Simpler? Safer? You bet!
The LowMelt®
process virtually guarantees:
1. You will never burn a PCB during rework again. 2. You will never lift a pad during rework again. 3. You will never need to use nozzles for SMD removal again. 4. You will never need a de-soldering tool for thru-hole removal again. 5. You will never degrade your semi-conductors with high temps again. 6. You will never need to use contact soldering irons and wick with BGA's.
LowMelt®
& AirBath™
Synergy!Zephyrtronics
pulls it all together with its harmonic combination of both
LowMelt®
DeSolderand our
ZT-1000 AirBath Preheaters creating a truly
easy-to-perform, comprehensive benchtop answer to SMD and Thru-Hole chip removal.
ZLM-0137 LOWMELT®
DE-SOLDER WIRE ( 137cm / 4.5 ft )
$32.95
ZLM-0243 LOWMELT® DE-SOLDER WIRE ( 243cm / 8 ft
)
$49.95
ZLM-0487 LOWMELT® DE-SOLDER WIRE (
487cm / 16 ft )
$96.95
ZLM-0975 LOWMELT® DE-SOLDER WIRE (
975cm / 32 ft )
$169.95
Lead-Free & Classic Lead Formulations:
LowMelt®
DeSolder is available in either our classic, leaded
LMSSeries
or in our lead-free,
ZLM
Series packed in our convenient storage tubes. (Each shipment includes a Cert
of Compliance from our Quality Group and MSDS)
Video
Demonstration: SMD Removal & LowMelt®
LowMelt® & Zephyrtronics AirBath™
Tested, Approved & Certified!
Raytheon---after
extensive testing and evaluation
of the
Zephyrtronics AirBath
combined with the
LowMelt®
DeSolder --- issued a
comprehensive, 108-page report
in 1999 entitled "New Rework
Method".
The Raytheon Test Report of our
submitted
Zephyrtronics AirBath and
LowMelt®
DeSolder for SMD removal
concluded,
"Finally, given the advantages
of lower temperatures for
rework, and the results of this
evaluation, the use of this
method and material for
reworking SMT and difficult
through-hole boards is
recommended."
This
"new process significantly reduces the necessary...actual rework hot gas and/or solder iron temperatures, and rework time. Additionally, the chances of board damage, pad and land damage, and component lead damage are significantly reduced...results essentially indicated that there were no negative impacts on solder joints or long-term reliability given the use of this new material and methodology."
Moreover, The Boeing®
Corporation in 1998 also subjected both
the Zephyrtronics AirBath and DeSolder
Wire to extensive testing concluding
"the
Zephyrtronics AirBath System is
certified."
A Brief Historical Perspective:
While a more primitive usage of low
temperature solder alloys for component
removal has been around since the 1960's
within the electronic industry, only
recently has the process that was
originally pioneered and described by
the late Joseph Funari and subsequently,
by William C. Ward of IBM truly come of
age. Indeed, even a Russian patent was
issued many decades ago combining both a
low melting point solder with a
soldering iron to remove electronic
components.
Still, while using a hot soldering iron
(with typical temperatures of 700° F or
higher) to "mix" low temperature alloys
into existing solder joints usually will
work in removing most surface mount
devices, caution dictates that any
extended time of application of the hot
soldering iron directly to the delicate
pads and leads of an SMD can be damaging
to the chip's leads and hurt the pads,
thereby diminishing the benefits of
using a low temp alloy for de-soldering
in the first place.
Indeed, Dr. Charles Hutchins, a founder
of Surface Mount Technology Association
wrote that most all damage done to PCB's
during rework and repair was the direct
result of either high temperatures,
excessive hand pressure or the
combination of both.
"Given the advantages of lower temperatures for rework, and the
results of this evaluation, the use of this method and material
for reworking SMT and difficult through-hole boards is
recommended." --Raytheon®
Report
William C. Ward Article in IBM's
Technical Disclosure Bulletin Teaches
Low Temp Allows for Chip Removal
At
the 1996 Surface Mount International Exposition in Silicon
Valley, the superior and synergistic combination of convective
bottom pre-heating AirBath™ coupled with a targeted application
of
low temperature
melting solder alloy was first demonstrated to the
world resulting in an instant recognition by industry leaders,
and the patented AirBath concept from
Zephyrtronics was chosen as "The Best
New Product" of the year winning the prestigious Vision Award
for its contribution to Surface Mount Technology.
Certainly, the proven synergy of LowMelt® De-Soldering Wire and
the AirBath™ preheating systems make it a natural for any
electronic benchtop where prototyping and/or rework of PCB's is
performed.
The Zephyrtronics AirBath & LowMelt® DeSolder Test Results:
"No damage is incurred at the substrate, solder pads, component leads during the process...The Zephyrtronics AirBath System is certified."
---
Boeing®,
1998
LOWMELT®
DE-SOLDER WIRE
DESCRIPTION
ITEM
PRICE
BUY NOW
Classic,
Traditional
LowMelt®
De-Solder Wire
With Lead
LMS-0137 LOWMELT® DE-SOLDER WIRE ( 137cm / 4.5 ft )
$29.95
LMS-0243 LOWMELT® DE-SOLDER WIRE ( 243cm / 8 ft
)
$39.95
LMS-0487 LOWMELT® DE-SOLDER WIRE
(
487cm / 16 ft )
$74.45
LMS-0975 LOWMELT® DE-SOLDER WIRE (
975cm / 32 ft )
