SMD Removal        LowMelt® DeSolder Wire         PCB Rework         Removes Chip          Quick SMT De-Soldering

LOWMELT® DE-SOLDER WIRE

Low Temp SMD and Thru Hole Removal Below 150°C (302°F) In Seconds!  Also Ideal for BGA Re-Dressing.

Now Available Also in a Lead-Free and RoHS Compliant Formulation!

Remove SMD's At Temps Under 150°C:  World-famous LowMelt® removes SMD's and Thru-Hole components at temperatures 300 to 400 degrees lower than most all de-soldering methods. SMD removal all below 150°C! And LowMelt® is available in both RoHS compliant (lead-free) and in classic leaded alloys. And we have no minimum orders!

No Special Nozzles Required!  LowMelt® removes SMD's and Thru-Hole chips without using a scorching, clumsy and expensive custom nozzle for every SMD! No nozzles! See the video demonstration below.

The Science of LowMelt® Makes It Easy!  LowMelt® allows rapid SMD and Thru-Hole by the proven, decades-old process of solder co-metalization with a pre-heater below the PCB, or with a simple soldering iron, or with any heated de-soldering tool or, yes, even under a hot air nozzle.

A Brief Historical Perspective: While a more primitive usage of low temperature solder alloys for component removal has been around since the 1960's within the electronic industry, only recently has the process that was originally pioneered and described by the late Joseph Funari and subsequently, by William C. Ward of IBM truly come of age. Indeed, even a Russian patent was issued many decades ago combining both a low melting point solder with a soldering iron to remove electronic components.

Still, while using a hot soldering iron (with typical temperatures of 700° F or higher) to "mix" low temperature alloys into existing solder joints usually will work in removing most surface mount devices, caution dictates that any extended time of application of the hot soldering iron directly to the delicate pads and leads of an SMD can be damaging to the chip's leads and hurt the pads, thereby diminishing the benefits of using a low temp alloy for de-soldering in the first place.

Indeed, Dr. Charles Hutchins, a founder of Surface Mount Technology Association wrote that most damage done to PCB's during rework or repair was the direct result of either high temperatures, excessive hand pressure or the combination of both.

At the 1996 Surface Mount International Exposition in Silicon Valley, the superior and synergistic combination of convective bottom pre-heating AirBath™ coupled with a targeted application of low temperature melting solder alloy was first demonstrated to the world resulting in an instant recognition by industry leaders, and the patented AirBath concept from Zephyrtronics was chosen as "The Best New Product" of the year winning the prestigious Vision Award for its contribution to Surface Mount Technology. Of course, now over 15 years later, the use of LowMelt® combined with the AirBath™ is commonplace at the electronic bench theater across the globe.

Certainly, the proven synergy of LowMelt® De-Soldering Wire and the AirBath™ preheating systems make it a natural for any electronic benchtop where prototyping and/or rework of PCB's is performed. Be sure to watch the video above.

And Ameritronics has no minimum orders! And we have lots of LowMelt® "in stock" at our factory in Los Angeles ready out to you today with your order. Give us a call or order here on-line.

William C. Ward Article in
 IBM's Technical Disclosure Bulletin Teaches Low Temp Chip Removal