BGA Rework Station       Hot Air BGA Station    BGA, CSP, Micro BGA, QFN, SMD, QFP, PLCC, SOIC, More

ZT-7 BGA, CSP and SMT HOT AIR REFLOW CENTER
Your Comprehensive Solution for BGA, SMT, QFN & CSP Rework & Repair, Reballing, BGA  Alignment, Placement, Preheat & Reflow at the Bench

The Zephyrtronics ZT-7 System "makes mounting / removal of through-hole and surface mount components easier than routine benchtop methods" and "minimizes thermal stresses due to temperature differentials during assembly and rework" and "enables the mounting of Ball Grid Arrays and other hidden pin packages on site."  -- NASA Report, Jan. 9, 2004

 
  BGA Removal
 

Your search is over! Zephyrtronics, winner of the prestigious Vision Award for "Best New Product of the Year" at the Surface Mount International Expo in Silicon Valley, has manufactured and marketed the number one hot air bench top reflow system since 1998. The ZT-7000 BGA, CSP & SMT Hot Air Bench Top Reflow System is the very same one used by NASA and JPL for soldering BGA's on the two successful Mars Rovers, and by Raytheon on the Patriot and Tomahawk Missile programs.

 
Hot Air Rework, BGA & SMD Station
 

Meticulous Precision
Temp Controlled Hot Air

Align, Place & Reflow,
Desolder & Remove

 

NASA wrote that: the Zephyrtronics system makes "mounting and removal of through-hole and surface mount components easier  than routine bench-top methods" and "minimizes thermal stresses due to temperature differentials during assembly and rework" and "enables the mounting of BGA's and other hidden pin packages on site.”

Uncanny Simplicity & Reliability: The amazingly easy-to-operate ZT-7-MIL was developed for prototype work, low volume production, secondary operations, and rework of printed circuit board assemblies for BGA, CSP and/or SMT components.

 
 

The Zephyrtronics ZT-7-000 BGA, SMT & CSP Comprehensive Benchtop System Shown Above.

 

BGA Rework Action Video Demonstration:
The ZT-7 Reworking BGA's

 

With all of the critical process controls "built in," the ZT-7 System was engineered to eliminate the worry over compressed air hook-ups, air pressure settings, external fanning equipment, external and awkward foot pedals. The ZT-7 is a fully integrated system making the meticulous, temperature profiles of high volume production equipment now attainable right at the bench. 

So Many Utilities: Whether the application is of the high reliability such as space and military work or everyday rework of even commercial game entertainment systems such as the XBOX, the ZT-7 is at work even as you read this all over the world! No wonder the ZT-7 is now the number one hot air rework station in North America.

 

Just a Few of the ZT-7’s Novel Features: This remarkable bench system features closed loop electronic digital temperature control; a digital countdown timer with audible beeper for process and profile uniformity; a mobile heating zone with the unique capacity of both 1.) a "Z-Axis" to raise and lower the heating zone to the targeted component on the substrate; and 2.) a "Y-Axis" which retracts and returns the heat zone before and after reflow allowing the technician to align, flux, prep, clean, inspect without the heat zone interfering. (Both the Z and Y axis travel are made via precision linear ball bearing slides which mean smooth, accurate and repeatable performance.

Unique Retractable Heat-Zone & Single-Spot Alignment: Noteworthy is our exclusive, patent-protected "Single Spot Alignment, Placement & Reflow Feature" because the ZT-7System NEVER requires PCB movement once your chip has been aligned and placed. The ZT-7 brings the heat zone to the target unlike most other BGA "machines" with elaborate (and expensive!) vision alignment systems that constantly need calibrating and which remotely place the BGA or CSP, only to require the board and the loose components to be moved afterwards to a distant heat zone. (Who on earth thought of that?) And what's even better, the ZT-7 is universal for both BGA's & CSP's (No need for two machines!)

 

BGA Removal

BGA's and
GLOB TOPS

Align, Place & Reflow
or Desolder and Remove

SMD Removal

LEADLESS CHIP CARRIERS (LLC's)
Align, Place & Reflow
or Desolder and Remove

QFP Removal

QUAD FLAT PACK (QFP's) and SOL's
Align, Place & Reflow
or Desolder and Remove


Shielded Component Removal


SHIELDED COMPONENTS
Align, Place & Reflow
or Desolder & Remove


Socket Removal

SMT SOCKETS
Align, Place & Reflow
or Desolder & Remove

CSP Rework

CHIP SCALE PACKAGES (CSP's)
Align, Place & Reflow
or Desolder & Remove


Reballing BGA


RE-BALL BGA’S & CSP’S
Reball BGA's With Our BGA ReBalling Kit

BGA Nozzles
 

Quick, Easy & Accurate BGA Alignment: To learn how to align and place BGA’s & CSP’s to the substrate pads, to see how NASA "explains" this simple method of placing BGA's to the pads; and to learn how to redress your BGA & CSP pads without wick, click here: BGA Tasking.

Semi-Automatic De-Soldering: For de-soldering and removing chips, the ZT-7 features a semi-automatic spring-activated vacuum probe that lifts the BGA or SMD up off the PCB upon solder reflow eliminating technician guesswork and lifting pads. The solder reflows and the chip pops up into the nozzle! See the complete de-soldering process in this short, helpful Video: DeSoldering & Removing a BGA. The Demo is a "How To" showing board prep, aligning, flux application, chip removal, cleaning and touches on inspecting the PCB, familiarizing you with the ZT-7 in action!

 
 

Our Patented  BGA Alignment Template Eliminates Need for Pricey Split-Beam Vision Models.

 
 

Noteworthy! Extra Low Velocity Hot Air Flow from ZT-7 Reflow Nozzles: The ZT-7-MIL has less than 20 CFM of air velocity from its Reflow Nozzles. Why is that important? Three critical reasons: 1.) Our extra-low velocity heated air from the Reflow Nozzle prevents unwanted adjacent component reflow. With most BGA's surrounded by small chips, this is a great benefit; 2.) Our extra-low velocity heated air from the Reflow Nozzle prevents unwanted adjacent component reflow. With most BGA's surrounded by small chips, this is a great benefit; 2.) Our extra-low velocity heated air will not blow or scatter solder around the PCB; 3.) Our less-than-20 CFM air velocity from the nozzle prevents unwanted hydroplaning of small chips during reflow. Your chip stays put and is not blown out of alignment.

Our Secret? Low velocity air flow reflow from the nozzle is possible because Zephyrtronics has ample preheating air flow from below the PCB from our AirBaths. High volume, low temp preheat air flow from below translates into easy reflow from above!  And this is where nearly all the other SMT & BGA machines on the market really get it wrong because they have ineffective preheating (weak IR or hot plates) and therefore must compensate with high velocity air from their nozzles to achieve solder reflow. QFN's and E-Pads? Of course, our AirBath preheating advantage makes working with those pesky QFN packages easy as can be. Yes, those "e-pads" or "thermal pads" or "belly slugs" on the bottom side of the chip are no problem with your ZT-7 System! Even with the many RoHS lead-free solder alloys.

 
 


Extra Large
PCB's Are No Problem! The ZT-7 System easily accommodates  PCB's up to as large as 20.5 inches (52 cm) in depth (and without limitation in length). There are no "special models" as with other manufacturers. And of course, small PCB's are no problem either.

The Modularity of Zephyrtronics: Perhaps best of all, the ZT-7 System  was designed to work in concert with the popular ZT Series of AirBath Bottom-Side Preheat Systems and ABC-1 Board Cradle. Indeed, any of our AirBath Preheaters will nest perfectly with the ZT-7 System.

  Hot Air Rework Station  
 

The ZT-7 Handles Large PCB's Up to 20 1/2" (52 cm) Deep

 
 

The ZT-7 features two independent and 360° adjustments for both the nozzle and for the chip vacuum probe. Ideal when working with angled and/or skewed chips.

 
BGA Theta Adjustment, Hot Air Rework Station
 
 

A Wide Selection of SMD & BGA Nozzles Available at Low Cost: Since we are "the factory", we have been fabricating nozzles since 1998 and have a very large stock of nozzles on hand and "in stock"! Custom nozzles are no problem and require as little as 8 days and cost no more than our standard nozzles. A partial list (we have far too many to list) of our nozzles are provided here: BGA/CSP Nozzles & SMT Nozzles.

And all Zephyrtronics nozzles are permanently "stamped" with both the part number and the size of the nozzle for your quick reference! No more calipers and cross reference guessing which nozzle you have!

 
 

Front-Access Nozzle Dock Makes Changing Nozzles Quick & Easy. Nozzles "Lock In" Securely!

 
 

The ZT-7 Excels with Lead-Free Solder Alloys!  Because every ZT-7000 System includes the popular ZT-1-BGS-DPU "Big Grid" AirBath, working with lead-free alloys is a breeze. Unlike other "systems", with the ZT-7, one need not remove adjacent chips around the BGA before attempting to solder or desolder. The powerful capacity of the AirBath Bottom-Side Preheating System is the key element here.

Critical Post-Cooling Feature: And beyond the many benefits of bottom side convective preheating, the ZT-1 AirBath provides the essential "Post Cooling" of the PCB assembly after reflow. Post-cooling after reflow of Ball Grid Arrays & Chip Scale Packages is an absolute requirement to insure that the molten ball/pad interface cools quickly to avoid unwanted bridging and "opens". (Note: The importance of preheating and post-cooling at the benchtop and it many benefits is taught in our technical paper: Two Critical PCB Rework Processes: Pre-Heating and Post Cooling.)

Because the exit air temperatures of the ZT-7 and the ZT-1 are both electronically maintained by easy-to-use digital controllers on the front panels, technicians can confidently expect the same thermal profiles at the bench that are routinely achieved with high end, high volume production reflow equipment such as conveyor ovens, IR/Vapor reflow wave solder machines. Now aren't you glad you did not buy one of those other machines?

The ZT-7 Selected by NASA & JPL

 

NASA Launch

Don't let the simplicity and affordability of the ZT-7 lead you to underestimate its capacity, its power, its utility or its quality performance. This is the very same ZT-7 chosen by both NASA and JPL for soldering the BGA's and SMD's on the two high-reliability and highly successful Mars Rovers. Even the largest full metal-topped BGA's used on both of the Mars Rovers were soldered with the Zephyrtronics ZT-7 Hot-Air Reflow Center!

Indeed, NASA engineers prepared a 39 page document touting the ZT-7 system in a report for its employees which includes nearly 300 color photographs of how to set up and and technical tips for using the Zephyrtronics ZT-7. Zephyrtronics now includes this helpful report inside of every ZT-7 that we ship to our customers along with the Zephyrtronics detailed ZT-7 Owners Manual. We don't know of any other manufacturer of SMT or BGA reflow machines that can make that claim.

Additionally, the ZT-7 is used by engineers and technicians at Raytheon® at their Tomahawk and Patriot Missile projects and is also currently in use by Boeing®, Harvard, M.I.T., Sony®, Intel®, International Rectifier®, National Semiconductor, Xilinx®, LSI Logic®, Motorola®, Agilent® and many more of the world's most prestigious commercial, academic, military, medical and electronic campuses. It may very well be the number one selling SMT & BGA benchtop system sold in North America.

Easy to use? Absolutely. Affordable? Definitely. Dependable quality in performance? Well, the solder joints that were made with the Zephyrtronics ZT-7 by JPL employees were catapulted out of the atmosphere at 4 million Newtons (900,000 pounds) of thrust, traveled over 500 million kilometers (310 million miles)  at times as fast as 25,000 miles per hour, endured extreme thermal conditions coupled with exposure to gamma rays, survived the landing impact onto the red planet's surface and thereby permitting the two Rovers to perform admirably on the rugged terrain of Mars. How's that for quality solder joints?

 

SPIRIT

NASA Rework Report

OPPORTUNITY

mars photo

Launch the Rover 'Spirit'
 on June 10, 2003
Arrives on Mars Jan. 3, 2004

 

39-Page Rework Guide by NASA With 300 Photographs Ships With Every ZT-7 System

Launch of Rover 'Opportunity'
on
July 7, 2003
Arrives on Mars Jan. 24, 2004
 

Photography Courtesy
 of  NASA & JPL

 

And don’t overlook that the ZT-7-MIL is also your BGA Re-Balling solution

The ZT-7 BGA, CSP & SMT Hot Air Bench Top Reflow System is available from Zephyrtronics today. The ZT-7-MIL, the ZT-1-BGS-DPU, the ZT-1-HIS-DPU, and the ABC-1 can be purchased separately or as a complete system as shown below. For more detailed information on Zephyrtronics most popular systems, see our Zephyrtronics Systems Section.
 

  The BENEFITS of the ZT-7 REFLOW SYSTEM  
 
Timer, Hot Air Rework Station   Vacuum Probe, Hot Air Rework Station   Temperature Control, Digital Hot Air Rework Station

Unique, Digital, Adjustable Countdown Timer with Audible Beeper Helps
 Process Repeatability

 

Spring Activated Vacuum for Placing & Removing Chips. Probe features 360° Full Rotation for Component Theta Control.

 

Precision, Digital Temp Control Featuring Full Closed Loop Microprocessor Control With Set/Read Adjustments.

BGA Theta Adjustment, Hot Air Rework Station
Slideable Heat Zone, Hot Air Rework Station
  Comprehensive Hot Air Rework Station  

      Rapid, Easy Nozzle Docking!     
 No Tools Required. Nozzle Slides In & Out of Convenient Front Access Tray. Unique Lock Prevents Nozzle Movement.

   

Unique Y Axis for Heat Zone Permits Forward & Retractable Motion. Y Axis Allows Technician to Align, Place, Reflow, Clean and Inspect, at the Same Spot.

     
         

Hot Air Nozzle, Hot Air Rework Station

  Vacuum Lift-Off, Digital Hot Air Rework Station   Z-Axis, Digital Hot Air Rework Station

360° Nozzle Rotation for Skewed or Angled Components. Further, the ZT-7 Has a Component Theta Probe. (Double Theta Capacity.

 

Convenient and Easy to Access
Lighted Vacuum Switch Is Right
Where You Need it. No Need for Clumsy Foot Pedals.
 

 

Z-Axis Lever for Raises & Lowers Heat Zone To & From PCB Assy. Aligned BGA's Never Are Move Once Placed. Onto PCB.

 
 

THE ZEPHYRTRONICS ZT-7 REFLOW SYSTEM’S CAPACITY!

Types of Components Still More Applications Features & Benefits
BGA (Ball Grid Arrays) MLF (with Thermal Slug) BGA & CSP Accurate Alignment
Micro BGA RF Shields Low Temp Reflow
CSP (Chip Scale Packages) SMT Connectors Low Velocity Air Flow at Nozzle
Flip Chips Fiber Optic Components High Velocity Air Flow at Preheat
Glob Tops Barrel, Plugs & Pins Closed Loop Temp Control
Stacked Memory Chips Plastic Sockets Y Axis (Back & Forth Heat Zone)
LCC, QFP, PLCC Edge Connectors Z Axis (Up & Down Heat Zone)
SOIC, SOL, SOJ RF Connectors 360° Nozzle Control
LGA Thru-Hole Connectors Bottom & Top Side Post Cooling
QFN (with Thermal Slug) Conformal Coating Tasks Handles Up to 20 1/2” PCB’s
CGA, BCC, PGA Reballing BGA’s & CSP’s Duplicates Original Production Profiles
Full Metal Top BGA & CGA Redressing BGA & CSP Pads Digital Temp Control & Display
Metalic MCM Lead-Free Applications Digital Countdown Audible Timer
Cu Heat Sinking Power Amps Prototype & Design Lab Work Auto-Spring Chip Lift-Off in DeSoldering
Ceramic Capacitors (Down to 0201’s Low Volume Production Easy Front-Loading Nozzle Docking
SMT Resistors CPU Repair Lead-Free Capacity
Lead-Free Components Rework & Repair BGA, CSP, SMT Self-Contained Air Supply (No Hookups
All SMT Components! Cell Phone Repair Vacuum Suction Lifting for Chips
 
ZT-7 REFLOW SYSTEMS
Description Model Price
Digital Hot Air Rework Station The ZT-7000-120 System
Our 120 Volt Model for the U.S.A., Canada & Mexico

A Comprehensive BGA & SMT
Hot Air Bench Top Reflow System

Includes:
The ZT-7-MIL (Shown Above), Plus

The ZT-1-BGS-DPU-120 BigGrid™ AirBath Preheater
The ABC-1 Adjustable Board Cradle
LMK3000 Benchtop Supply Kit
AT-3-ECO Lighted Rectangular Magnifier
ZT-7-MIL-120
ZT-1-BGS-DPU-120
ABC-1
LMK3000
AT-3-ECO

$6,579

LIMITED
TIME
OFFER!

$5,995
The ZT-7000-230 System
Our 230 Volt Model for International Customers

A Comprehensive BGA & SMT
 Hot Air Bench Top Reflow System


Includes:
The ZT-7-MIL (Shown Above), Plus

The ZT-1-BGS-DPU-230 BigGrid™ AirBath Preheater
The ABC-1 Adjustable Board Cradle
LMK3000 Benchtop Supply Kit
ZT-7-MIL-230
ZT-1-BGS-DPU-230
ABC-1
LMK3000
 
$6,579

LIMITED
TIME
OFFER!

$5,995
Digital Hot Air Rework System The ZT-7001-120 System
Our 120 Volt Model for the U.S.A., Canada & Mexico
A Comprehensive BGA & SMT
Hot Air Bench Top Reflow System

Includes:
The ZT-7-MIL (Shown Above), Plus
The ZT-1-HIS-DPU AirBath Preheater
The ABC-1 Adjustable Board Cradle
LMK3000 Benchtop Supply Kit
AT-3-ECO Lighted Rectangular Magnifier
ZT-7-MIL-120
ZT-1-HIS-DPU-120
ABC-1
LMK3000
AT-3-ECO

$5,979

LIMITED
TIME
OFFER!

$5,495
The ZT-7001-230 System
Our 230 Volt Model for International Customers

A Comprehensive BGA & SMT
Hot Air Bench Top Reflow System


Includes:
The ZT-7-MIL (Shown Above), Plus

The ZT-1-HIS-DPU-230 AirBath Preheater
The ABC-1 Adjustable Board Cradle
LMK3000 Benchtop Supply Kit
ZT-7-MIL-230
ZT-1-HIS-DPU-230
ABC-1
LMK3000
$5,979

LIMITED
TIME
OFFER!

$5,495
BGA Rework Station The ZT-7-MIL-120 BGA/SMT Reflow Unit
Our 120 Volt Model for the U.S.A., Canada & Mexico

BGA & SMT Hot Air Benchtop Reflow Unit
ZT-7-MIL-120 ONLY
$3,995
The ZT-7-MIL-230 BGA/SMT Reflow Unit
Our 230 Volt Model for International Customers

BGA & SMT Hot Air Benchtop Reflow Unit
ZT-7-MIL-230 ONLY
$3,995
PCB Preheating Station The ZT-1-BGS-DPU-A1S AirBath Preheater
Our 120 Volt Model for the U.S.A., Canada & Mexico
AirBath Pre-Heating Unit &
The ABC-1 Adjustable Board Cradle
ZT-1-BGS-DPU-120
ABC-1
ONLY
$2,095
The ZT-1-BGS-DPU-A1S-230 AirBath Preheater
Our 230 Volt Model for International Customers
AirBath Pre-Heating Unit &
The ABC-1 Adjustable Board Cradle
ZT-1-BGS-DPU-230
ABC-1
ONLY
$2,095
PCB Preheating System The ZT-1-HIS-DPU-A1S AirBath Preheater
Our 120 Volt Model for the U.S.A., Canada & Mexico

AirBath Pre-Heating Unit &
The ABC-1 Adjustable Board Cradle
ZT-1-HIS-DPU-120
ABC-1
ONLY
$1,575
The ZT-1-HIS-DPU-A1S-230 AirBath Preheater
Our 230 Volt Model for International Customers

AirBath Pre-Heating Unit &
The ABC-1 Adjustable Board Cradle
ZT-1-HIS-DPU-230
ABC-1
ONLY
$1,575

CLICK HERE TO SEE OTHER SYSTEMS FROM ZEPHYRTRONICS

Hot Air Nozzles for the ZT-7 Systems
  Hot Air Nozzles, BGA, CSP, Micro BGA, SMD, SMT, QFN  

SMT Nozzles for the ZT-7 System         BGA Nozzles for the ZT-7 System

   

   
 

©1996 - 2010 Ameritronics®. All rights reserved. The information you receive online from Ameritronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Ameritronics® is the registered trademark property of JTI, Inc. "Zephyrtronics" and  "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" and "PostCooler" and "AirBath" and "Quatro" and "Full Metal Jacket" are the protected trademark property of JTI, Inc.

 
 

SMD Rework, SMT Rework
AirBath, SMD Rework Stations, Hot Air Pencil Soldering, BGA Rework Stations, CSP Rework Stations, Preheating Systems, PCB Preheaters, Pre-Heat SMT / SMD, Low Temp Rework, SMT DeSoldering Tools, Vacuum Pickup Tools, Circuit Board Holders, PCB Fixtures, Board Cradles, Rework Solder Paste,  No-Clean Solder Paste, Low Melt® De-Solder Wire, DeSolder Wire, Hot Air Rework Stations, Fume Extractors, SMT Dental Probes, SMT-SMD Rework Kit, BGA Rework Kit, LMK Kit, BGA Re-Balling Kit, SMD Tweezers, Power Palm Plunger

How To - SMT, CSP, BGA Rework
How To - BGA Alignment: How To - SMT Rework: How To - PCB Preheating, How To - BGA  & CSP Rework: How To - Quickly Solder SMD Packages Effectively: How To - CSP Alignment; How To - Lead-Free Rework; How To - SMD Removal Economical; How To - SMD Removal Professional: How To - Hot Air Pencil / AirPencil Soldering; How To - SMD Quick Chip Removal; How To - BGA Re-Balling; How To - Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP: How To - Solder & Rework Ceramic Capacitors: How To - Solder & Rework Glass Diodes

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Soldering Accessories, Solder Wire, No-Clean Solder Wire, Eutectic Solder Wire, Solder Wire Dispenser, Solder Paste, Lead-Free Solder Paste, Flux, Solder Paste Dispensers, LowMelt® DeSolder Wire, De-Solder Wire, Soldering Irons, Digital Soldering Station, Digital De-Soldering, MIL-Spec Soldering Station: ESD Soldering Station, Soldering Tips, Thru-Hole DeSoldering Tools, Desoldering Tip, Tips for Desoldering, De-Solder Wick, Smoke Extractors, Fume Extractor Filters, Carbon Activated Filters, SolderMill™, Pre-Heating Systems, Preheat Thru-Hole, PCB Pre-Heating, Flux Solvent, How To - Connector Rework; How To - PC/104 Soldering and Rework; How To - Thru-Hole / Through Hole Desolder / De-Solder; How To - Low Melt® Desolder Wire; How To- Stop Lifting Pads; How To- Desolder / De-Solder Heavy Ground Planes; How To - Lead-Free Soldering and De-Soldering; Preheaters for Lead-Free Rework and Soldering

Dispensing
Dispensing Systems, Dispensing Syringes, Dispensing Barrels, Tapered Tips,  Blunt Needles, Stainless Steel Needles, Dispensing Needles, Industrial Needles, Dispensing Tips, Dispensing Accessories, Solder Paste in Syringe, Lead-Free Solder Paste in Syringe, Paste Rack™ Solder Paste Holder, Dispensing Supplies, Power Palm Plunger, Manual Dispensing, Automatic Dispensing

Benchtop Accessories, Bench Supplies, Benchtop Tools
SMD Solder Paste,
Lead-Free Solder Paste, Solder Wire, LowMelt®, No-Clean Flux, BGA Flux, Rework Tack Flux, Non-Flammable Flux Remover, Inspection Equipment, Magnification Equipment, Magnifying Work Light, ESD Magnifier, Pen Vac, SMT Tweezers, Fume Extraction, SMD Tweezers, PC Board Fixtures, Hot Air Tips, AirTips, Replacement Soldering Sponges, Iron Plated Soldering Tips, Art Conservation Hot Air Tools, Foam Swabs, Anti-Static Foam Swabs, Thru-Hole Brushes, LMK Rework Kits