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Align,
Place & Solder All SMD's & BGA's or
DeSolder & Remove
SMD's & BGA's in Minutes |
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BGA
Rework Hot Air Rework
Station SMD, CSP, QFN Soldering &
De-Soldering BGA Alignment Lead-Free Reflow
System |
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The
Programmable &
Comprehensive Hot Air Solution for BGA, CBGA, CCGA,
MLF, SMT,
µBGA
and CSP Rework &
Repair, Plus Reballing BGA's, BGA Alignment, Placement,
Preheat and Reflow at the Bench! |
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The Zephyrtronics ZT-7
System "makes mounting and removal of through-hole
and surface mount components easier
than routine benchtop methods" and "minimizes thermal stresses due to
temperature differentials during assembly and
rework" and "enables the mounting of Ball Grid
Arrays and other hidden pin packages on site."
-- NASA Report, Jan. 9, '04
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Our sophisticated,
fully
programmable, and yet so affordable
ZT-7 Systems
(starting
as low as only $2,750! See below) outperforms
other BGA and SMD Rework Stations priced over
$20,000!
Yes, you can align, place and solder your BGA's, SMD's, QFN's, LGA's -- or desolder
and automatically remove them
from the PCB without lifted pads or thermal
damage to your PCB or adjacent chips!
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The ZT-7
is the very same one used
by NASA and JPL on both successful Mars Rovers launched in 2003,
as well with the Phoenix project. Introduced in
1998, the patented, time-tested
ZT-7
made quality PCB prototype tasks and rework easily
achievable at the bench. And now, Zephyrtronics,
winner of the coveted Vision Award for Best New
Product at the Surface Mount International Expo in
Silicon Valley,
extends a
full 2-Year limited warranty with every
ZT-7. |
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31
Programmable Thermal Profiles With Full Ramp & Soak
Control. Program, Customize &
Store Your PCB Profiles |
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Programmable Up to 31 Custom Thermal Profiles! The
ZT-7 does not rely on do-it-yourself,
unrepeatable and unreliable "external taping" of
thermocouples to your PCB, but rather the temperature
control is integrated into the system with full
closed-loop sensing. Moreover, the
easy-to-access front
panel controller provides up to 31 custom thermal
profiles with multiple "ramp and soak and final
solder reflow" functions
allowing technicians to store those profiles for
different PCB's! Significantly, the
ZT-7
does not rely on unpredictable, unstable infrared (IR)
for either preheat or for solder reflow, but rather
utilizes the long-established (sixty years!), industry-preferred and
superior method of forced convection. |
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The Zephyrtronics ZT-7-000 BGA, SMT & CSP Comprehensive
Benchtop System Shown Above. |
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Video!
See the ZT-7
System in Action |
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Uncanny Simplicity & Reliability: The amazingly easy-to-operate ZT-7-MIL was developed for prototype work, low volume production, secondary operations, and rework of electronic printed circuit board assemblies (PCBA’s) at the benchtop for BGA, CSP and/or SMT components. With all of the critical process controls "built in," the Zephyrtronics ZT-7-MIL System was engineered to eliminate the worry over compressed air hook-ups, air pressure settings, external fanning equipment, external and awkward foot pedals.
Importantly, there are no exposed air hoses or
moving electrical cords as with other "systems". The ZT-7-MIL is a fully-integrated,
digital system making the meticulous, thermal profiles of high volume production equipment now attainable right at the bench
including temperature ramp, preheating, soaking, solder
reflow and cooling. And the ZT-7 is whisper quiet in
operation and features big LED digital display as
opposed to eye-straining LCD displays. |
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BGA's and
GLOB TOPS
Align, Place & Reflow
or Desolder & Remove
SHIELDED
COMPONENTS
Align, Place & Reflow
or Desolder & Remove |
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LEADLESS CHIP
CARRIERS
(LLC's)
Align, Place & Reflow
or Desolder & Remove
QUAD FLAT PACK
(QFP's) and
SOL's
Align, Place & Reflow
or Desolder & Remove |
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Here’s Just a Few of the ZT-7’s Novel Features: This remarkable benchtop system features closed loop electronic digital temperature control; a digital countdown timer with audible beeper for process and profile uniformity; a heating zone with the unique capacity of both 1.) a "Z-Axis" which raises and lowers the heating zone to the targeted component on the substrate; and 2.) a "Y-Axis" which retracts and returns the heat zone before and after reflow allowing the technician to align, flux, prep, clean, inspect without the heat zone interfering. (Both the Z and Y axis travel are made via precision linear ball bearing slides which mean smooth, accurate and repeatable performance.
So Many Utilities: Whether the application is of
the highest reliability possible such as space and
military work or everyday rework of even commercial game
entertainment systems such as the
XBOX360®
or the
PlayStation®,
the ZT-7 is at work even as you read
this all over the world!
Here’s Just a Few of the ZT-7’s Novel Features: This remarkable benchtop system features closed loop electronic digital temperature control; a digital countdown timer with audible beeper for process and profile uniformity; a heating zone with the unique capacity of both 1.) a "Z-Axis" which raises and lowers the heating zone to the targeted component on the substrate; and 2.) a "Y-Axis" which retracts and returns the heat zone before and after reflow allowing the technician to align, flux, prep, clean, inspect without the heat zone interfering. (Both the Z and Y axis travel are made via precision linear ball bearing slides which mean smooth, accurate and repeatable performance.
Oh, and the ZT-7 is not limited to only surface mount
devices, but also is a great rework tool for tough
through hole (PTH) de-soldering tasks with connectors,
sockets, metal shields, and PGA's.
Unique Retractable Heat-Zone & Single-Spot Alignment:
Most noteworthy is our exclusive and patent protected
"Single Spot Alignment, Placement and Reflow Feature"
due to the fact that the ZT-7000 System NEVER requires movement of the PCB Assy. once your BGA or CSP has been aligned and placed. The ZT-7-MIL brings the heat zone to the target unlike most other BGA "machines" which have elaborate (and expensive!) vision alignment systems that constantly need calibrating and which remotely place the BGA or CSP, only to require the board and the loose components to be moved afterwards to a distant heat zone. (Who on earth thought of that?) And what's even better, the ZT-7-MIL is universal for both BGA's & CSP's (You don't need to buy two different machines!)
Quick, Easy & Accurate BGA Alignment: To learn how to precisely align and place BGA’s & CSP’s to the substrate pads,
to see how NASA "explains" this simple
method of placing BGA's to the pads; and to learn how to redress your BGA & CSP pads
without de-soldering wick, click
on this link:
Re-Dressing Your BGA Pads.
Semi-Automatic De-Soldering: For de-soldering and
removing components, there is a semi-automatic spring-activated vacuum probe that lifts up the BGA, CSP or SMD up off the board once
the solder reflows taking any guesswork out of the program and insuring that you will not lift a pad.
The solder reflows and the chip pops up
into the nozzle! Video Demonstration!
Witness the actual desoldering process
as the BGA reflows and lifts off of the
PCB in this short, helpful
Video: DeSoldering
& Removing a BGA.
The Demo is a "How To" that shows board
prep, aligning, flux application, chip
removal, cleaning and touches on
inspecting the PCB and familiarizes you
with the ZT-7 in action! |
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SMT SOCKETS
Align, Place & Reflow
or Desolder & Remove
CHIP SCALE
PACKAGES (CSP's)
Align, Place & Reflow
or Desolder & Remove |
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PLCC'S and SOJ's
Align, Place & Reflow
or Desolder & Remove
Re-Ball
Your
BGA’S & CSP’S
(Click for Details) |
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Forced
Hot Air Convection is Superior to IR for PCB Prototyping
and Rework & Repair:
There are many
problems with the troublesome use of infrared (IR) when
working with PCB's, which is why it really never
completely caught on and why so many of these "systems"
have been the relegated to landfills around the globe.
Some of drawbacks, which have been enumerated in
articles in SMT Magazine, Circuits Assembly and in white
papers at electronic conventions range from component
shadowing and the lack of thermal ramping
due to the difficulty in obtaining repeatable
temperature control. IR "systems" rely too much on
technician guess work, including the idiotic requirement
of taping thermocouples to your PCB in order to have
sensing feedback. On the contrary, your
ZT-7 has built-in,
closed-loop, temperature sensing during both preheat and
soldering reflow. No "taping" required. To learn more about some of the
many troubles
with IR, as well as with other preheat and reflow
methods, please see the brief technical video which includes some of these
drawbacks here at the
Pitfalls of IR Preheating & Reflow
System Video |
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Noteworthy! Extra Low Velocity Hot Air
Flow from ZT-7 Reflow Nozzles:
The
ZT-7-MIL has
less than 18 CFM
of air velocity from its Reflow Nozzles.
Why is that important? Three critical reasons:
1.) Our extra-low velocity heated air from the
Nozzle prevents unwanted adjacent component
reflow. Today when caps and resistors typically
surround the BGA area, our extra-low air
velocity is a key advantage! 2.) Moreover,
the extra-low velocity heated air does not blow
or scatter solder around the PCB unlike other
hot air systems; and 3.) Our less-than-18 CFM of
air velocity at the nozzle helps prevent
hydroplaning of small chips during reflow. Your
chip stays put because we don’t blow it out of
alignment.
Our Secret? The low velocity air flow at the
nozzle is only possible because Zephyrtronics
has ample preheating air flow from below the PCB
from our AirBaths. High volume, low temp preheat
air flow from below translates into easy reflow
from above with only minimal air velocity at the
nozzle. And this is where nearly all the other
SMT & BGA machines on the market really get it
wrong because they have ineffective preheating
(weak IR or hot plates) and therefore must
compensate with high velocity air from their
nozzles to achieve solder reflow. QFN's and
E-Pads? Of course, our AirBath preheating
advantage makes working with those pesky QFN
packages easy as can be. Yes, those "e-pads" or
"thermal pads" or "belly slugs" on the bottom
side of the chip are no problem with your ZT-7
System! And this really becomes especially
important if you are thinking of using lead-free
solders. |
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Patented BGA Alignment
Template
Eliminates
Need for Cameras &
Expensive Split-Beam Vision
& Makes BGA Placing
So Easy to Do! |
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Extra Large Printed
Circuit Boards Are No Problem!
One question we hear a lot is: What is the maximum PCB
size that your system can handle. The ZT-7
System easily accommodates PCB Assemblies up to
as large as 20.5 inches (52 cm) in depth (and without limitation in length).
That means that there are no "special models"
or "wide body models" as are required with other
manufacturers of hot air reflow
equipment. Naturally, smaller
PCB's are no problem either. Part of the
innovation of the ABC Board
Cradle is that the PCB locking
knobs are not on the top, so
that gigantic PCB's can rest on
the flat, table top frame.
Brilliant!
The Modularity of Zephyrtronics:
Perhaps best of all, the
ZT-7
System
was designed to work in concert with
any of our popular
AirBath Bottom-Side Preheating Systems
and
the
ABC-1 Board Cradles.
Please note that all of our AirBaths nest perfectly
under the
ZT-7 bringing all of the many utilities
of our award-winning AirBaths.
Because the ABC Board Cradle is
independent from the ZT-7, it
facilitates working with multiple PCB's
as the technician can be preheating in
tandem other PCB's on another ABC cradle
and "swap" them back and forth speeding
up small production runs or multiple
chip removal. And, of course, the
system's modularity allows a technician
to use the ZT-7, the AirBath™ Preheater
and Board Cradle separately at different
benches if needed. To see more on the modularity of
the
ZT-7
System
see our
short
Video: DeSoldering
& Removing a BGA. |
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The ZT-7 Handles Large
PCB's
Up to 20 1/2" (52 cm) Deep |
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Easy Nozzle Docking With 360° Nozzle Theta Rotation
Adjustment: As shown in the
photo (right), nozzles are easily inserted and removed
from the dock without screwdrivers or tools. Slide the
nozzle into the tray and it locks in place. The ZT-7
features two
independent 360° adjustments for
both the nozzle and for the vacuum
probe. Ideal when working with angled
and/or skewed chips.
A Vast and Wide Selection of
SMD & BGA Nozzles Available at Low, Low Cost:
Since we are "the
factory", we have been fabricating nozzles for the ZT-7
since 1998 and have a very large stock of
nozzles from as large as 50mm x 50mm to as tiny as 2mm x
2mm IN STOCK!! Even Custom Nozzles are no problem and
require as little as 10 days and cost no more than our
standard stock nozzle. A partial list (we have far too
many to list) of our nozzles are
provided here:
BGA/CSP Nozzles &
SMT Nozzles.
All Zephyrtronics nozzles are
permanently "stamped" with both the part
number and the size of the nozzle for
your quick reference!
Critical Post-Cooling Feature: beyond the many benefits of bottom side convective preheating, the ZT-1 AirBath provides the essential "Post Cooling" of the PCB
assembly after reflow. Post-cooling after reflow of Ball Grid Arrays & Chip Scale Packages is an absolute requirement to insure that the molten ball/pad interface cools quickly to avoid unwanted bridging and "opens". (Note: The importance of preheating and post-cooling at the benchtop and it many benefits is taught in our technical paper:
Two Critical PCB Rework Processes: Pre-Heating and Post Cooling.) |
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Front-Access Nozzle Dock
Makes Changing Nozzles Quick & Easy.
Nozzles "Lock In" Securely! |
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 ...And
The ZT-7 Excels with Your RoHS Compliant, Lead-Free
Solder Alloys! Because every ZT-7000
Benchtop Hot Air System includes the popular ZT-1-BGS-DPU "Big Grid"
Pre-Heating AirBath,
working with lead-free alloys is a breeze. Unlike other "systems", with the ZT-7,
one need not
remove adjacent chips around
the BGA before attempting to solder or
desolder. The powerful capacity of the
AirBath Bottom-Side Preheating System is the key
element here. Learn more here about the
RoHS Lead Free Mandate.
Production Quality Profiles Right at the Bench: Because the exit air temperatures of the ZT-7 and the ZT-1 are both electronically maintained by easy-to-use digital controllers on their front panels, technicians can confidently expect the same thermal profiles at the bench that are achieved with high end, high volume production reflow equipment such as conveyor ovens, IR/Vapor
systems and wave solder machines. Now, aren't you glad you didn't buy one of those other machines that don't work? |
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The ZT-7 Selected by NASA & JPL
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Don't let the simplicity and affordability of the ZT-7 lead you to underestimate its capacity, its power, its utility or its quality performance. This is the very same ZT-7 chosen by both NASA and JPL for soldering the BGA's and SMD's on the two high-reliability and highly successful Mars Rovers. Even the largest full metal-topped BGA's used on both of the Mars Rovers were soldered with the Zephyrtronics ZT-7 Hot-Air Reflow Center!
Indeed, NASA engineers prepared a 39 page document touting the ZT-7 system in a report for its employees which includes nearly 300 color photographs of how to install and operate the Zephyrtronics ZT-7. Zephyrtronics now includes this helpful report inside of every ZT-7 that we ship to our customers along with the Zephyrtronics detailed ZT-7 Owners Manual. We don't know of any other manufacturer of SMT or BGA reflow machines that can make that claim.
Additionally, the ZT-7 is used by engineers and technicians at Raytheon® at their Tomahawk and Patriot Missile projects and is also currently in use by Boeing®, Harvard, M.I.T., Sony®, Intel®, International Rectifier®, National Semiconductor, Xilinx®, LSI Logic®, Motorola®, Agilent® and many more of the world's most prestigious commercial, academic, military, medical and electronic campuses. It may very well be the number one selling SMT & BGA benchtop system sold in North America.
Easy to use? Absolutely. Affordable? Definitely. Dependable quality in performance? Well, the solder joints that were made with the Zephyrtronics ZT-7 by JPL employees were catapulted out of the atmosphere at 4 million Newtons (900,000 pounds) of thrust, traveled over 500 million kilometers (310 million miles) at times as fast as 25,000 miles per hour, endured extreme thermal conditions coupled with exposure to gamma rays, survived the landing impact onto the red planet's surface and thereby permitting the two Rovers to perform admirably on the rugged terrain of Mars. How's that for quality solder joints?
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Launch of first
Rover, Spirit: June 10, 2003
Spirit's arrival on Mars:
Jan. 3, 2004 |
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39-Page
Rework Guide by NASA With 300 Photographs Ships With
Every ZT-7 System |
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Launch of second
Rover, Opportunity: July 7, 2003
Opportunity's arrival on Mars: January 24, 2004 |
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Photography Courtesy
of NASA & JPL |
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And don’t overlook that the ZT-7-MIL is also your
BGA Re-Balling solution.
The ZT-7 BGA, CSP & SMT Hot Air Bench Top Reflow System is available from Zephyrtronics today. The ZT-7-MIL, the ZT-1-BGS-DPU, the ZT-1-HIS-DPU, and the ABC-1 can be purchased separately or as a complete system as shown below. For more detailed information on Zephyrtronics most popular systems, see our
Zephyrtronics Systems Section.
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The BENEFITS of the ZT-7 REFLOW SYSTEM
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THE ZEPHYRTRONICS ZT-7 REFLOW SYSTEM’S CAPACITY!
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Types of Components
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Still More Applications |
Features & Benefits |
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BGA (Ball Grid Arrays) |
MLF (with Thermal Slug) |
BGA & CSP Accurate Alignment |
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Micro BGA |
RF Shields |
Low Temp Reflow |
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CSP (Chip Scale Packages) |
SMT Connectors |
Low Velocity Air Flow at Nozzle |
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Flip Chips |
Fiber Optic Components |
High Velocity Air Flow at Preheat |
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Glob Tops |
Barrel,
Plugs & Pins |
Stores Up to
31 Custom Thermal Profiles |
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Stacked Memory Chips |
Plastic Sockets |
Y Axis (Back & Forth Heat Zone) |
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LCC, QFP, PLCC |
Edge Connectors |
Z Axis (Up & Down Heat Zone) |
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SOIC, SOL, SOJ |
RF Connectors |
360° Nozzle
Control |
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LGA |
Thru-Hole Connectors |
Bottom & Top Side Post Cooling |
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QFN (with Thermal Slug) |
Conformal Coating Tasks |
Handles Up to 20 1/2” PCB’s |
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CGA, BCC, PGA |
Reballing BGA’s & CSP’s |
Duplicates Original Production Profiles |
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Full Metal Top BGA & CGA |
Redressing BGA & CSP Pads |
Digital Temp Control & Display |
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Metallic MCM |
Lead-Free Applications |
Digital Countdown Audible Timer |
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Cu Heat Sinking Power Amps |
Prototype & Design Lab Work |
Auto-Spring Chip Lift-Off in DeSoldering |
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Ceramic Capacitors (Down to 0201’s) |
Low Volume Production |
Easy Front-Loading Nozzle Docking |
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SMT Resistors |
CPU Repair |
Lead-Free Capacity |
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Lead-Free Components |
Rework & Repair BGA, CSP, SMT |
Self-Contained Air Supply (No Hookups |
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All SMT Components! |
Cell Phone Repair |
Vacuum Suction Lifting for Chips |
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Unique, Digital, Adjustable Countdown Timer with Audible Beeper Helps
Process Repeatability |
Spring Activated Vacuum for Placing & Removing Chips. Probe features 360° Full Rotation for Component Theta Control. |
Precision,
Closed Loop Digital Temp Control With
Real Time Digital Display of
Thermal Activity. Plus Set/Read Buttons. |
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Rapid, Easy Nozzle Docking! No Tools Required. Nozzle Slides In & Out of Convenient Front Access Tray. Unique Lock Prevents Nozzle Movement. |
Up to 31 Programmable Custom Profiles & Up
to 99 Segments At Front Panel With Big LED
Easy-to-Read Display. No Eye-Strain LCD. |
Unique Y Axis
for Heat Zone Permits Forward & Retractable Motion. Y Axis Allows Technician to Align, Place, Reflow, Clean and Inspect, at the Same Spot.
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360° Nozzle Rotation
for Skewed or Angled Components.
Further, the ZT-7 Has a Component Theta Probe. (Double Theta Capacity. |
Convenient and Easy to Access
Lighted Vacuum Switch Is Right
Where You Need it. No Need for Clumsy Foot Pedals. |
Z-Axis Lever for Raises
& Lowers Heat Zone To & From PCB Assy. Aligned BGA's Never
Are Move Once Placed. Onto PCB. |
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ZT-7 COMPREHENSIVE HOT AIR BENCH TOP
SYSTEMS |
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Description |
Model |
Price |
ZT-7003 System |
The ZT-7003-120
Complete System
Our
120 Volt Model for the U.S.A., Canada &
Mexico
A Comprehensive BGA & SMT Hot Air Bench Top Reflow System
Includes:
The
ZT-7-MIL
Programmable Reflow Center (Shown Above),
Plus
The
ZT-1-CLS-MIL-120
Compact, 10 CFM Analog AirBath Preheater
The
ABC-TQ Adjustable Board Cradle
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos
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ZT-7-MIL-120
ZT-1-CLS-MIL-120
ABC-TQ |
$4,100
LIMITED
TIME
OFFER!
$2,995
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ZT-7002 System |
The ZT-7002-120
Complete System
Our
120 Volt Model for the U.S.A., Canada &
Mexico
A Comprehensive BGA & SMT Hot Air Bench Top Reflow System
Includes:
The
ZT-7-MIL
Programmable Reflow Center (Shown Above),
Plus
The
ZT-1-CLS-DPU-120
Compact, 15 CFM Digital AirBath Preheater
The
ABC-TQ Adjustable Board Cradle
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos
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ZT-7-MIL-120
ZT-1-CLS-DPU-120
ABC-TQ |
$4,500
LIMITED
TIME
OFFER!
$3,250
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The ZT-7002-230
Complete System
Our
230 Volt Model for Our International
Customers
A Comprehensive BGA & SMT Hot Air Bench Top Reflow System
Includes:
The
ZT-7-MIL
Programmable Reflow Center (Shown Above),
Plus
The
ZT-1-CLS-DPU-230 Compact, 15 CFM Digital AirBath Preheater
The
ABC-TQ Adjustable Board Cradle
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos
|
ZT-7-MIL-230
ZT-1-CLS-DPU-230
ABC-TQ |
$4,500
LIMITED
TIME
OFFER!
$3,250
|
ZT-7001 System |
The
ZT-7001-120
Complete System
Our
120 Volt Model for the U.S.A., Canada &
Mexico
A Comprehensive BGA & SMT Hot Air Bench Top Reflow System
Includes:
The ZT-7-MIL Programmable Reflow Center (Shown Above),
Plus
The
ZT-1-HIS-DPU
25 CFM Digital AirBath
Preheater
The ABC-1 Adjustable Board Cradle
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos |
ZT-7-MIL-120
ZT-1-HIS-DPU-120
ABC-1 |
$5,100
LIMITED
TIME
OFFER!
$3,950
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The
ZT-7001-230
Complete System
Our
230 Volt Model for Our International
Customers
A Comprehensive BGA & SMT Hot Air Bench Top Reflow System
Includes:
The ZT-7-MIL Programmable Reflow Center (Shown Above),
Plus
The
ZT-1-HIS-DPU
25 CFM Digital AirBath
Preheater
The ABC-1 Adjustable Board Cradle
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos |
ZT-7-MIL-230
ZT-1-HIS-DPU-230
ABC-1 |
$5,100
LIMITED
TIME
OFFER!
$3,950
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ZT-7000 System |
The ZT-7000-120
Complete System
Our
120 Volt Model for the U.S.A., Canada &
Mexico
A Comprehensive BGA & SMT Hot Air Bench Top Reflow System
Includes:
The ZT-7-MIL Programmable Reflow Center (Shown Above),
Plus
The
ZT-1-BGS-DPU-120
BigGrid™ 50 CFM Digital AirBath Preheater
The
ABC-1 Adjustable Board Cradle
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos |
ZT-7-MIL-120
ZT-1-BGS-DPU-120
ABC-1 |
$5,600
LIMITED
TIME
OFFER!
$4,450
|
The ZT-7000-230
Complete System
Our
230 Volt Model for Our International
Customers
A Comprehensive BGA & SMT Hot Air Bench Top Reflow System
Includes:
The ZT-7-MIL
Programmable Reflow Center
(Shown Above), Plus
The
ZT-1-BGS-DPU-230 BigGrid™
50 CFM Digital AirBath Preheater
The
ABC-1 Adjustable Board Cradle
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos |
ZT-7-MIL-230
ZT-1-BGS-DPU-230
ABC-1 |
$5,600
LIMITED
TIME
OFFER!
$4,450 |
ZT-7MEG System
(For Monster Boards) |
The ZT-7MEG-120
Complete System
Our
120 Volt Model for the U.S.A., Canada &
Mexico
A Comprehensive BGA & SMT Hot Air Bench Top Reflow System
Includes:
The ZT-7-MIL Programmable Reflow Center (Shown Above),
Plus
The
ZT-1-MGS-DPU-120
MegaGrid™ 50 CFM Digital AirBath Preheater
The
ABC-1 Adjustable Board Cradle
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos |
ZT-7MEG-120
ZT-1-MGS-DPU-120
ABC-1 |
$6,500
LIMITED
TIME
OFFER!
$5,450 |
The ZT-7MEG-230
Complete System
Our
230 Volt Model for Our International
Customers
A Comprehensive BGA & SMT Hot Air Bench Top Reflow System
Includes:
The ZT-7-MIL
Programmable Reflow Center
(Shown Above), Plus
The
ZT-1-MGS-DPU-230
MegaGrid™
50 CFM Digital AirBath Preheater
The
ABC-1 Adjustable Board Cradle
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos |
ZT-7MEG-230
ZT-1-MGS-DPU-230
ABC-1 |
$6,500
LIMITED
TIME
OFFER!
$5,450 |
 |
The
BGA TRAINING, PRACTICE & SUPPLY KIT
Includes "Hands
On" BGA Learning Guide, Tools & Supplies:
BGA
Training Primer
With
Helpful Photos
&
Illustrations for
BGA Aligning, BGA Soldering &
DeSoldering, BGA Pad Re-Dressing &
ReBalling
BGA
Practice PCB With Daisy Chain for
Testing for Continuity & Bridges
Four Practice "Daisy Chain" BGA 225 Ball
Chips
One 27mm x 27mm Hot Air BGA Nozzle for
a BGA
225
One
Patented BGA Alignment Template for a BGA
225
Four BGA P.A.B.I.T's (225 Pad Alignment to
225 Ball Interface Tapes)
1 BGA 225 Re-Balling Stencil (Stainless)
& 1 Vial of 0.76mm Solder Spheres for
Re-Balling
1 Jar of Re-Balling Tacky Flux, 1 Bottle
of BGA Flux™, 1 Flux Dispensing Bottle
1 Solvent Pump Bottle, 1 Stainless
Non-Magnetic Tweezer, 1 ESD Wrist Strap
1 ZeroLead® Solder Paste, 1 Tube of
ZeroLead® LowMelt®
1 PPP-2000 Plunger, 2 High Flux DeSolder
Wicks, ESD-Safe Foam Swabs & Scrub
Brushes |
ZLK-5000
Comprehensive
BGA Training
&
Supply Kit |
$800
If
Purchased Individually
Only
$395 |
 |
The
ZT-7-MIL-120
BGA/SMT Reflow Unit
Our
120 Volt Model for the U.S.A., Canada &
Mexico
BGA & SMT
Programmable
Hot Air Benchtop Reflow Unit
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos |
ZT-7-MIL-120 |
ONLY
$2,750
|
The
ZT-7-MIL-230
BGA/SMT Reflow Unit
Our
230 Volt Model for International
Customers
BGA & SMT
Programmable
Hot Air Benchtop Reflow Unit
Detailed Owners Manual & 39-Page NASA
Report With Nearly 300 Photos |
ZT-7-MIL-230 |
ONLY
$2,750
|
 |
The
ZT-1-BGS-DPU-A1S
AirBath Preheater
Our
120 Volt Model for the U.S.A., Canada &
Mexico
AirBath Pre-Heating Unit & The ABC-1 Adjustable Board Cradle
|
ZT-1-BGS-DPU-120
ABC-1 |
ONLY
$2,095
|
The
ZT-1-BGS-DPU-A1S-230
AirBath Preheater
Our
230 Volt Model for International
Customers
AirBath Pre-Heating Unit & The ABC-1 Adjustable Board Cradle
|
ZT-1-BGS-DPU-230
ABC-1 |
ONLY
$2,095
|
 |
The
ZT-1-HIS-DPU-A1S
AirBath Preheater
Our
120 Volt Model for the U.S.A., Canada &
Mexico
AirBath Pre-Heating Unit & The ABC-1 Adjustable Board Cradle
|
ZT-1-HIS-DPU-120
ABC-1 |
ONLY
$1,575
|
The
ZT-1-HIS-DPU-A1S-230
AirBath Preheater
Our
230 Volt Model for International
Customers
AirBath Pre-Heating Unit & The ABC-1 Adjustable Board Cradle |
ZT-1-HIS-DPU-230
ABC-1 |
ONLY
$1,575
|
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High Temp Vacuum Cup Directory
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Vacuum Cups, High
Temp & ESD Safe
Our premium,
durable vacuum cups are molded
from high temperature, high
grade conductive silicon for use
with the ZT-7 System.
Our vacuum
cups will lift all flat surfaced
SMD's, BGA's, QFN's and SMD's.
In many cases, the cups also
will lift most concave surfaced
chips and even many glob topped
chips. |
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Threaded Insert Not Included |
| |
|
Cup Diameter |
Single |
Two Pack
Save 5% |
Five Pack
Save 10% |
Ten Pack
Save 20%! |
|
|
5mm
0.196" |
ZT-7-705-S
$9.97
|
ZT-7-705-2
$18.94
|
ZT-7-705-V
44.86
|
ZT-7-705-X
$79.76
|
|
|
7mm
0.275" |
ZT-7-707-S
$9.97
|
ZT-7-707-2
$18.94
|
ZT-7-707-V
44.86
|
ZT-7-707-X
$79.76
|
|
|
9mm
0.354" |
ZT-7-709-S
$9.97
|
ZT-7-709-2
$18.94
|
ZT-7-709-V
44.86
|
ZT-7-709-X
$79.76
|
|
|
|
|
CLICK HERE TO SEE
EVEN MORE BENCH SYSTEMS FROM ZEPHYRTRONICS |
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©1996 - 2011, 2012 Ameritronics®. All rights reserved. The
information you receive online from Ameritronics® is protected by
the copyright laws of the United States. The copyright laws prohibit
any copying, redistributing, retransmitting, or repurposing of any
copyright-protected material. Ameritronics® is the registered
trademark property of JTI, Inc. "Zephyrtronics" and "Zephlux"
and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post
Cooling" and "PostCooler" and "AirBath" and "Quatro" and "Full Metal
Jacket" are the protected trademark property of JTI, Inc. |
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Click link below
to return to the top of the page |
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ZT-7 BGA, CSP & SMT
HOT AIR REFLOW CENTER |
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| |
SMD Rework,
SMT Rework
AirBath,
SMD Rework
Stations,
Hot Air
Pencil Soldering,
BGA Rework
Stations,
CSP Rework
Stations,
Preheating
Systems,
PCB
Preheaters,
Pre-Heat
SMT / SMD,
Low Temp Rework,
SMT
DeSoldering Tools,
Vacuum
Pickup Tools,
Circuit
Board Holders,
PCB
Fixtures,
Board
Cradles,
Rework
Solder Paste,
No-Clean
Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder
Wire,
Hot Air
Rework Stations,
Fume
Extractors,
SMT Dental
Probes,
SMT-SMD
Rework Kit,
BGA Rework
Kit,
LMK Kit,
BGA
Re-Balling Kit,
SMD
Tweezers,
Power Palm
Plunger
How To - SMT, CSP, BGA Rework
How To -
BGA Alignment:
How To -
SMT Rework:
How To - PCB Preheating,
How To -
BGA & CSP Rework:
How To -
Quickly Solder SMD Packages Effectively:
How To -
CSP Alignment;
How To -
Lead-Free Rework;
How To -
SMD Removal Economical;
How To -
SMD Removal Professional:
How To -
Hot Air Pencil / AirPencil Soldering;
How To -
SMD Quick Chip Removal;
How To -
BGA Re-Balling;
How To -
Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP:
How To -
Solder & Rework Ceramic Capacitors:
How To -
Solder & Rework Glass Diodes
Soldering,
De-Soldering
Soldering
Accessories,
Solder
Wire,
No-Clean
Solder Wire,
Eutectic
Solder Wire,
Solder Wire
Dispenser,
Solder
Paste,
Lead-Free
Solder Paste,
Flux,
Solder
Paste Dispensers,
LowMelt®
DeSolder Wire,
De-Solder
Wire,
Soldering
Irons,
Digital
Soldering Station,
Digital
De-Soldering,
MIL-Spec
Soldering Station:
ESD
Soldering Station,
Soldering
Tips,
Thru-Hole
DeSoldering Tools,
Desoldering
Tip,
Tips for
Desoldering,
De-Solder
Wick,
Smoke
Extractors,
Fume
Extractor Filters,
Carbon
Activated Filters,
SolderMill™,
Pre-Heating
Systems,
Preheat
Thru-Hole,
PCB
Pre-Heating,
Flux
Solvent,
How To - Connector Rework;
How To -
PC/104 Soldering and Rework;
How To -
Thru-Hole / Through Hole Desolder / De-Solder;
How To -
Low Melt® Desolder Wire;
How To-
Stop Lifting Pads;
How To-
Desolder / De-Solder Heavy Ground Planes;
How To -
Lead-Free Soldering and De-Soldering;
Preheaters
for Lead-Free Rework and Soldering
Dispensing
Dispensing
Systems,
Dispensing
Syringes,
Dispensing
Barrels,
Tapered
Tips,
Blunt
Needles,
Stainless
Steel Needles,
Dispensing
Needles,
Industrial
Needles,
Dispensing
Tips,
Dispensing
Accessories,
Solder
Paste in Syringe,
Lead-Free
Solder Paste in Syringe,
Paste Rack™
Solder Paste Holder,
Dispensing
Supplies,
Power Palm
Plunger,
Manual
Dispensing,
Automatic
Dispensing
Benchtop Accessories,
Bench Supplies,
Benchtop Tools
SMD Solder
Paste,
Lead-Free
Solder Paste,
Solder
Wire,
LowMelt®,
No-Clean
Flux,
BGA Flux,
Rework Tack
Flux,
Non-Flammable Flux Remover,
Inspection
Equipment,
Magnification Equipment,
Magnifying
Work Light,
ESD
Magnifier,
Pen Vac,
SMT
Tweezers,
Fume
Extraction,
SMD
Tweezers,
PC Board
Fixtures,
Hot Air
Tips,
AirTips,
Replacement
Soldering Sponges,
Iron Plated
Soldering Tips,
Art
Conservation Hot Air Tools,
Foam Swabs,
Anti-Static
Foam Swabs,
Thru-Hole
Brushes,
LMK Rework
Kits |
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