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ZT-7 BGA, CSP & SMT HOT AIR REFLOW CENTER
Your Comprehensive Solution for BGA, SMT and CSP Rework &
Repair, Reballing,
BGA Alignment, Placement, Preheat and Reflow at the Bench |
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New! Order Securely
On-Line. |
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The Zephyrtronics ZT-7
System "makes mounting / removal of through-hole and
surface mount components easier than routine
benchtop methods" and "minimizes thermal stresses
due to temperature differentials during assembly and
rework" and "enables the mounting of Ball Grid
Arrays and other hidden pin packages on
site."
-- NASA Report, Jan. 9, 2004 |
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Zephyrtronics, winner of the prestigious 1996 Vision Award for "Best New Product of the Year" at the Surface Mount International Exposition in Silicon Valley has introduced yet still another milestone product for the global electronic bench top with the world debut of its breakthrough product, the ZT-7000 BGA, CSP & SMT Hot Air Bench Top Reflow System.
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The ZT-7000 is the very same one used
by NASA and JPL for soldering on the two successful Mars Rovers launched in 2003. NASA wrote: the Zephyrtronics system makes "mounting/removal of through-hole and surface mount components easier than routine benchtop methods" and "minimizes thermal stresses due to temperature differentials during assembly and rework" and "enables the mounting of
BGA's and other hidden pin packages on site.” |
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Meticulous
Precision
Temp Controlled Hot Air
Align, Place & Reflow
and/or Desolder and Remove |
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Uncanny Simplicity & Reliability: The amazingly easy-to-operate ZT-7-MIL was developed for prototype work, low volume production, secondary operations, and rework of electronic printed circuit board assemblies (PCBA’s) at the benchtop for BGA, CSP and/or SMT components. |
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With all of the critical process controls "built in," the Zephyrtronics ZT-7-MIL System was engineered to eliminate the worry over compressed air hook-ups, air pressure settings, external fanning equipment, external and awkward foot pedals. The ZT-7-MIL is a fully integrated system making the meticulous, temperature profiles of high volume production equipment now attainable right at the bench.
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The
Zephyrtronics ZT-7-000 BGA, SMT & CSP Comprehensive
Benchtop System Shown Above. |
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BGA Rework Video Demonstration: See
the ZT-7 in Action As It DeSolders & Removes BGA's |
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So Many Utilities: Whether the application is of
the highest reliability possible such as space and
military work or everyday rework of even commercial game
entertainment systems such as the
XBOX,
the ZT-7 is at work even as you read
this all over the world! No wonder the
ZT-'7's is now the number one
hot air rework station
in North America. |
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Here’s Just a Few of the ZT-7’s Novel Features: This remarkable benchtop system features closed loop electronic digital temperature control; a digital countdown timer with audible beeper for process and profile uniformity; a heating zone with the unique capacity of both 1.) a "Z-Axis" which raises and lowers the heating zone to the targeted component on the substrate; and 2.) a "Y-Axis" which retracts and returns the heat zone before and after reflow allowing the technician to align, flux, prep, clean, inspect without the heat zone interfering. (Both the Z and Y axis travel are made via precision linear ball bearing slides which mean smooth, accurate and repeatable performance.
Unique Retractable Heat-Zone & Single-Spot Alignment:
Most noteworthy is our exclusive and patent protected
"Single Spot Alignment, Placement and Reflow Feature"
due to the fact that the ZT-7000 System NEVER requires movement of the PCB Assy. once your BGA or CSP has been aligned and placed. The ZT-7-MIL brings the heat zone to the target unlike most other BGA "machines" which have elaborate (and expensive!) vision alignment systems that constantly need calibrating and which remotely place the BGA or CSP, only to require the board and the loose components to be moved afterwards to a distant heat zone. (Who on earth thought of that??) And what's even better, the ZT-7-MIL is universal for both BGA's & CSP's (You don't need to buy two different machines!)
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BGA's and GLOB TOPS
Align, Place & Reflow
and/or Desolder and Remove

LEADLESS CHIP CARRIERS
(LLC's) Align, Place & Reflow
and/or Desolder and Remove

QUAD FLAT PACK (QFP's) and
SOL's Align, Place & Reflow
and/or Desolder and Remove

SHIELDED COMPONENTS
Align, Place & Reflow
and/or Desolder and Remove

SMT SOCKETS Align,
Place & Reflow
and/or Desolder and Remove

PLCC'S and SOJ's
Align, Place & Reflow
and/or Desolder and Remove

CHIP SCALE PACKAGES (CSP's)
Align, Place & Reflow
and/or Desolder and Remove

RE-BALL BGA’S & CSP’S
Reball Your BGA's With Our
BGA ReBalling Kit
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Quick, Easy & Accurate BGA Alignment: To learn how to precisely align and place BGA’s & CSP’s to the substrate pads,
to see how NASA "explains" this simple
method of placing BGA's to the pads; and to learn how to redress your BGA & CSP pads
without wick, click this link:
Re-Dressing BGA
Pads.
Semi-Automatic
De-Soldering: For de-soldering and
removing components, there is a semi-automatic spring-activated vacuum probe that lifts the BGAor SMD up off the board once
the solder reflows eliminating
technician guesswork and preventing
lifting pads.
The solder reflows and the chip pops up
into the nozzle!
Witness
the actual de-soldering process as the
BGA reflows and lifts off of the PCB in
this short, helpful
Video: DeSoldering
& Removing a BGA.
The Demo is a "How To" that shows board
prep, aligning, flux application, chip
removal, cleaning and touches on
inspecting the PCB and familiarizes you
with the ZT-7 in action! |
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Patented
BGA Alignment Template Eliminates Need for Expensive
Split-Beam Vision Systems. |
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Noteworthy! Extra Low Velocity Hot Air Flow from ZT-7 Reflow Nozzles: The ZT-7-MIL has
less than 16 CFM of air velocity from its Reflow Nozzles. Why is that important? Three critical reasons: 1.) Our extra-low velocity heated air from the Reflow Nozzle prevents unwanted adjacent component reflow. It’s no problem if your targeted BGA or SMT for soldering happens to be surrounded by small caps and resistors; 2.) The extra-low velocity heated air will not blow or scatter solder around the PCB where it should not be; and 3.) Our less-than-9 CFM of air velocity at the nozzle means that unwanted hydroplaning of small chips during reflow will not occur. Your component stays put because we don’t blow it out of alignment. |
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Our Secret? The low velocity air flow at the nozzle is only possible because Zephyrtronics has ample preheating air flow from below the PCB from our AirBaths. High volume, low temp preheat air flow from below translates into easy reflow from above with only minimal air velocity at the nozzle. And this is where nearly all the other SMT & BGA machines on the market really get it wrong because they have ineffective preheating (weak IR or hot plates) and therefore must compensate with high velocity air from their nozzles to achieve solder reflow. QFN's
and E-Pads? Of course, our AirBath
preheating advantage makes working with
those pesky QFN packages easy as can be.
Yes, those "e-pads" or "thermal pads" or
"belly slugs" on the bottom side of the
chip are no problem with your ZT-7
System! And this really becomes especially important if you are thinking of using lead-free solders. |
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Extra Large
PCB's Are No Problem! The ZT-7
System easily accommodates PCB Assemblies up to
as large as 20.5 inches (52 cm) in depth (and without limitation in length).
There are no "special models"
as is required as with other
manufacturers. And of course, small
PCB's are no problem either. |
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The Modularity of Zephyrtronics: Perhaps best of all, the
ZT-7
System
was designed to work in concert with the popular
ZT-1000 Series of AirBath Bottom-Side Preheating Systems and
ABC-1 Board Cradle. Indeed, any of the ZT-1000 Series of AirBaths will nest perfectly with the ZT-7 bringing all of the many utilities of our award winning AirBaths to
your
ZT-7
System. |
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The ZT-7 Handles Large
PCB's
Up to 20 1/2" (52 cm) Deep |
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The ZT-7
features two
independent and 360° adjustments for
both the nozzle and for the chip vacuum
probe. Ideal when working with angled
and/or skewed chips. |
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A Vast and Wide Selection of
SMD & BGA Nozzles Available at Low, Low Cost:
Since we are "the
factory", we have been fabricating nozzles for the ZT-7
since 1998 and have a very large stock of
nozzles from as large as 50mm x 50mm to as tiny as 2mm x
2mm IN STOCK!! Even Custom Nozzles are no problem and
require as little as 10 days and cost no more than our
standard stock nozzle. A partial list (we have far too
many to list) of our nozzles are
provided here:
BGA/CSP Nozzles &
SMT Nozzles.
All Zephyrtronics nozzles are
permanently "stamped" with both the part
number and the size of the nozzle for
your quick reference! |
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Front-Access Nozzle Dock
Makes Changing Nozzles Quick & Easy.
Nozzles "Lock In" Securely! |
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The ZT-7 Excels with Lead-Free Solder Alloys! Because every ZT-7000 System includes the popular ZT-1-BGS-DPU "Big Grid" AirBath,
working with lead-free alloys is a breeze. Unlike other "systems", with the ZT-7,
one need not
remove adjacent chips around
the BGA before attempting to solder or
desolder. The powerful capacity of the
AirBath Bottom-Side Preheating System is the key
element here.
Critical Post-Cooling Feature:
And beyond the many benefits of bottom side convective preheating, the ZT-1 AirBath provides the essential "Post Cooling" of the PCB
assembly after reflow. Post-cooling after reflow of Ball Grid Arrays & Chip Scale Packages is an absolute requirement to insure that the molten ball/pad interface cools quickly to avoid unwanted bridging and "opens". (Note: The importance of preheating and post-cooling at the benchtop and it many benefits is taught in our technical paper:
Two Critical PCB Rework Processes: Pre-Heating and Post Cooling.)
Because the exit air temperatures of the ZT-7 and the ZT-1 are both electronically maintained by easy-to-use digital controllers on the front panels, technicians can confidently expect the same thermal profiles at the bench that are routinely achieved with high end, high volume production reflow equipment such as conveyor ovens, IR/Vapor reflow wave solder machines. Aren't you glad you did not buy one of those other machines that don't work?
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The ZT-7 Selected by NASA & JPL
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Don't let the simplicity and affordability of the ZT-7 lead you to underestimate its capacity, its power, its utility or its quality performance. This is the very same ZT-7 chosen by both NASA and JPL for soldering the BGA's and SMD's on the two high-reliability and highly successful Mars Rovers. Even the largest full metal-topped BGA's used on both of the Mars Rovers were soldered with the Zephyrtronics ZT-7 Hot-Air Reflow Center!
Indeed, NASA engineers prepared a 39 page document touting the ZT-7 system in a report for its employees which includes nearly 300 color photographs of how to install and operate the Zephyrtronics ZT-7. Zephyrtronics now includes this helpful report inside of every ZT-7 that we ship to our customers along with the Zephyrtronics detailed ZT-7 Owners Manual. We don't know of any other manufacturer of SMT or BGA reflow machines that can make that claim.
Additionally, the ZT-7 is used by engineers and technicians at Raytheon® at their Tomahawk and Patriot Missile projects and is also currently in use by Boeing®, Harvard, M.I.T., Sony®, Intel®, International Rectifier®, National Semiconductor, Xilinx®, LSI Logic®, Motorola®,
Agilent®
and many more of the world's most
prestigious commercial, academic,
military, medical and electronic
campuses. It may very well be the number
one selling SMT & BGA benchtop system
sold in North America.
Easy to use? Absolutely. Affordable? Definitely. Dependable quality in performance? Well, the solder joints that were made with the Zephyrtronics ZT-7 by JPL employees were catapulted out of the atmosphere at 4 million Newtons (900,000 pounds) of thrust, traveled over 500 million kilometers (310 million miles) at times as fast as 25,000 miles per hour, endured extreme thermal conditions coupled with exposure to gamma rays, survived the landing impact onto the red planet's surface and thereby permitting the two Rovers to perform admirably on the rugged terrain of Mars. How's that for quality solder joints?
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Launch of first
Rover, Spirit: June 10, 2003 Spirit's arrival on Mars: Jan. 3, 2004 |
39-Page
Rework Guide by NASA With 300 Photographs Ships With
Every ZT-7 System |
Launch of second
Rover, Opportunity: July 7, 2003 Opportunity's arrival on Mars:
January 24, 2004 |
Photography Courtesy of NASA & JPL |
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And don’t overlook that the ZT-7-MIL is also your
BGA Re-Balling solution.
The ZT-7 BGA, CSP & SMT Hot Air Bench Top Reflow System is available from Zephyrtronics today. The ZT-7-MIL, the ZT-1-BGS-DPU, the ZT-1-HIS-DPU, and the ABC-1 can be purchased separately or as a complete system as shown below. For more detailed information on Zephyrtronics most popular systems, see our
Zephyrtronics Systems Section.
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The BENEFITS of the ZT-7 REFLOW SYSTEM |
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Unique, Digital, Adjustable Countdown Timer with Audible Beeper Helps Process Repeatability |
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Spring Activated Vacuum for Placing & Removing Chips. Probe features 360° Full Rotation for Component Theta Control. |
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Precision, Digital Temp Control Featuring Full Closed Loop Microprocessor Control With Set/Read Adjustments. |
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Rapid, Easy Nozzle Docking!
No Tools Required. Nozzle Slides In & Out of Convenient Front Access Tray.
Unique Lock Prevents Nozzle Movement. |
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Unique Y Axis
for Heat Zone Permits Forward & Retractable Motion. Y Axis Allows Technician to Align, Place, Reflow, Clean and Inspect, at the Same Spot. |
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360° Nozzle Rotation
for Skewed or Angled Components.
Further, the ZT-7 Has a Component Theta Probe. (Double Theta Capacity. |
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Convenient and Easy to Access Lighted Vacuum Switch Is Right Where You Need it. No Need for Clumsy Foot Pedals. |
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Z-Axis Lever for Raises
& Lowers Heat Zone To & From PCB Assy. Aligned BGA's Never
Are Move Once Placed. Onto PCB. |
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THE ZEPHYRTRONICS ZT-7 REFLOW SYSTEM’S CAPACITY!
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Types of Components
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Still More Applications |
Features & Benefits |
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BGA (Ball Grid Arrays) |
MLF (with Thermal Slug) |
BGA & CSP Accurate Alignment |
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Micro BGA |
RF Shields |
Low Temp Reflow |
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CSP (Chip Scale Packages) |
SMT Connectors |
Low Velocity Air Flow at Nozzle |
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Flip Chips |
Fiber Optic Components |
High Velocity Air Flow at Preheat |
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Glob Tops |
Barrel,
Plugs & Pins |
Closed Loop Temp Control |
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Stacked Memory Chips |
Plastic Sockets |
Y Axis (Back & Forth Heat Zone) |
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LCC, QFP, PLCC |
Edge Connectors |
Z Axis (Up & Down Heat Zone) |
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SOIC, SOL, SOJ |
RF Connectors |
360° Nozzle
Control |
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LGA |
Thru-Hole Connectors |
Bottom & Top Side Post Cooling |
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QFN (with Thermal Slug) |
Conformal Coating Tasks |
Handles Up to 20 1/2” PCB’s |
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CGA, BCC, PGA |
Reballing BGA’s & CSP’s |
Duplicates Original Production Profiles |
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Full Metal Top BGA & CGA |
Redressing BGA & CSP Pads |
Digital Temp Control & Display |
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Metalic MCM |
Lead-Free Applications |
Digital Countdown Audible Timer |
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Cu Heat Sinking Power Amps |
Prototype & Design Lab Work |
Auto-Spring Chip Lift-Off in DeSoldering |
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Ceramic Capacitors (Down to 0201’s |
Low Volume Production |
Easy Front-Loading Nozzle Docking |
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SMT Resistors |
CPU Repair |
Lead-Free Capacity |
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Lead-Free Components |
Rework & Repair BGA, CSP, SMT |
Self-Contained Air Supply (No Hookups |
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All SMT Components! |
Cell Phone Repair |
Vacuum Suction Lifting for Chips |
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DESCRIPTION |
PART # |
PRICE |
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The
ZT-7000-120 System
Our 120 Volt Model for the U.S.A.,
Canada & Mexico
A Comprehensive BGA & SMT
Hot Air Bench Top Reflow System
Includes: The ZT-7-MIL (Shown
Above), Plus
The
ZT-1-BGS-DPU-120
BigGrid™ AirBath
Preheater The
ABC-1 Adjustable Board Cradle
LMK3000 Benchtop Supply Kit
AT-3-ECO Lighted Rectangular Magnifier |
ZT-7-MIL-120 ZT-1-BGS-DPU-120
ABC-1 LMK3000 AT-3-ECO |
$6,579
LIMITED TIME OFFER!
$5,995
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The
ZT-7000-230 System
Our 230 Volt Model for International
Customers
A Comprehensive BGA & SMT
Hot Air Bench Top Reflow System
Includes: The ZT-7-MIL (Shown Above),
Plus
The
ZT-1-BGS-DPU-230 BigGrid™ AirBath
Preheater
The
ABC-1 Adjustable Board Cradle
LMK3000 Benchtop Supply Kit |
ZT-7-MIL-230 ZT-1-BGS-DPU-230
ABC-1 LMK3000 |
$6,579
LIMITED TIME OFFER!
$5,995 |
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The
ZT-7001-120 System
Our 120
Volt Model for the U.S.A., Canada &
Mexico
A Comprehensive BGA & SMT
Hot Air Bench Top Reflow System
Includes: The ZT-7-MIL (Shown
Above), Plus
The
ZT-1-HIS-DPU AirBath Preheater
The
ABC-1 Adjustable Board Cradle
LMK3000 Benchtop Supply Kit
AT-3-ECO Lighted Rectangular Magnifier |
ZT-7-MIL-120 ZT-1-HIS-DPU-120
ABC-1 LMK3000 AT-3-ECO |
$5,979
LIMITED TIME OFFER!
$5,495
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The
ZT-7001-230 System
Our 230 Volt Model for International
Customers
A Comprehensive BGA & SMT
Hot Air Bench Top Reflow System
Includes: The ZT-7-MIL (Shown Above),
Plus
The
ZT-1-HIS-DPU-230 AirBath Preheater
The
ABC-1 Adjustable Board Cradle
LMK3000 Benchtop Supply Kit |
ZT-7-MIL-230 ZT-1-HIS-DPU-230
ABC-1 LMK3000 |
$5,979
LIMITED TIME OFFER!
$5,495 |
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The
ZT-7-MIL-120
BGA/SMT Reflow Unit
Our 120 Volt Model for the U.S.A.,
Canada & Mexico
BGA & SMT Hot Air Benchtop Reflow Unit |
ZT-7-MIL-120 |
ONLY
$3,995
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The
ZT-7-MIL-230
BGA/SMT Reflow Unit
Our 230 Volt Model for International
Customers
BGA & SMT Hot Air Benchtop Reflow Unit |
ZT-7-MIL-230 |
ONLY
$3,995
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The
ZT-1-BGS-DPU-A1S
AirBath Preheater
Our 120
Volt Model for the U.S.A., Canada &
Mexico
AirBath Pre-Heating Unit &
The ABC-1 Adjustable Board Cradle
|
ZT-1-BGS-DPU-120 ABC-1 |
ONLY
$2,095
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The
ZT-1-BGS-DPU-A1S-230
AirBath Preheater
Our 230
Volt Model for International Customers
AirBath Pre-Heating Unit &
The ABC-1 Adjustable Board Cradle
|
ZT-1-BGS-DPU-230 ABC-1 |
ONLY
$2,095
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The
ZT-1-HIS-DPU-A1S
AirBath Preheater
Our 120 Volt Model for the U.S.A.,
Canada & Mexico
AirBath Pre-Heating Unit &
The ABC-1 Adjustable Board Cradle
|
ZT-1-HIS-DPU-120 ABC-1 |
ONLY
$1,575
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The
ZT-1-HIS-DPU-A1S-230
AirBath Preheater
Our 230 Volt Model for International
Customers
AirBath Pre-Heating Unit &
The ABC-1 Adjustable Board Cradle |
ZT-1-HIS-DPU-230 ABC-1 |
ONLY
$1,575
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©1996 - 2007 Ameritronics®. All rights reserved. The
information you receive online from Ameritronics® is
protected by the copyright laws of the United States.
The copyright laws prohibit any copying, redistributing,
retransmitting, or repurposing of any
copyright-protected material. Ameritronics® is the
registered trademark property of JTI, Inc.
"Zephyrtronics" and "Zephlux" and "ZeroLead" and "Zero
Balling" and "Zero Residue" and "Post Cooling" are the
protected trademark property of JTI, Inc. |
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SMD Rework,
SMT Rework
AirBath,
SMD Rework
Stations,
Hot Air
Pencil Soldering,
BGA Rework
Stations,
CSP Rework
Stations,
Preheating
Systems,
PCB
Preheaters,
Pre-Heat
SMT / SMD,
Low Temp Rework,
SMT
DeSoldering Tools,
Vacuum
Pickup Tools,
Circuit
Board Holders,
PCB
Fixtures,
Board
Cradles,
Rework
Solder Paste, No-Clean
Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder
Wire,
Hot Air
Rework Stations,
Fume
Extractors,
SMT Dental
Probes,
SMT-SMD
Rework Kit,
BGA Rework
Kit,
LMK Kit,
BGA
Re-Balling Kit,
SMD
Tweezers,
Power Palm
Plunger
How To - SMT, CSP, BGA Rework
How To -
BGA Alignment:
How To -
SMT Rework:
How To - PCB Preheating,
How To -
BGA & CSP Rework:
How To -
Quickly Solder SMD Packages Effectively:
How To -
CSP Alignment;
How To -
Lead-Free Rework;
How To -
SMD Removal Economical;
How To -
SMD Removal Professional:
How To -
Hot Air Pencil / AirPencil Soldering;
How To -
SMD Quick Chip Removal;
How To -
BGA Re-Balling;
How To -
Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP:
How To -
Solder & Rework Ceramic Capacitors:
How To -
Solder & Rework Glass Diodes:
Soldering,
De-Soldering
Soldering
Accessories,
Solder
Wire,
No-Clean
Solder Wire,
Eutectic
Solder Wire,
Solder Wire
Dispenser,
Solder
Paste,
Lead-Free
Solder Paste,
Flux,
Solder
Paste Dispensers,
LowMelt®
DeSolder Wire,
De-Solder
Wire,
Soldering
Irons,
Digital
Soldering Station,
Digital
De-Soldering,
MIL-Spec
Soldering Station:
ESD
Soldering Station,
Soldering
Tips,
Thru-Hole
DeSoldering Tools,
Desoldering
Tip,
Tips for
Desoldering,
De-Solder
Wick,
Smoke
Extractors,
Fume
Extractor Filters,
Carbon
Activated Filters,
SolderMill™,
Pre-Heating
Systems,
Preheat
Thru-Hole,
PCB
Pre-Heating,
Flux
Solvent,
How To - Connector Rework;
How To -
PC/104 Soldering and Rework;
How To -
Thru-Hole / Through Hole Desolder / De-Solder;
How To -
Low Melt® Desolder Wire;
How To-
Stop Lifting Pads;
How To-
Desolder / De-Solder Heavy Ground Planes;
How To -
Lead-Free Soldering and De-Soldering;
Preheaters
for Lead-Free Rework and Soldering
Dispensing
Dispensing
Systems,
Dispensing
Syringes,
Dispensing
Barrels,
Tapered
Tips,
Blunt
Needles,
Stainless
Steel Needles,
Dispensing
Needles,
Industrial
Needles,
Dispensing
Tips,
Dispensing
Accessories,
Solder
Paste in Syringe,
Lead-Free
Solder Paste in Syringe,
Paste Rack™
Solder Paste Holder,
Dispensing
Supplies,
Power Palm
Plunger,
Manual
Dispensing,
Automatic
Dispensing
Benchtop Accessories,
Bench Supplies,
Benchtop Tools
SMD Solder
Paste,
Lead-Free
Solder Paste,
Solder
Wire,
LowMelt®,
No-Clean
Flux,
BGA Flux,
Rework Tack
Flux,
Non-Flammable Flux Remover,
Inspection
Equipment,
Magnification Equipment,
Magnifying
Work Light,
ESD
Magnifier,
Pen Vac,
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