Cleaner Solder Joints After Reflow:  The great advantage of our No Clean Solder Wire is the visibly cleaner appearance after solder reflow is made. In fact, cleaning is not even required for most applications. And where stringent cleaning or cosmetic cleaning is required, the No Clean residue is easily removed with most all flux solvents or flux removers (We do recommend our Non-Flammable Flux Remover).

Inert Property Requires No Cleaning:  Residue removal? Because of the "no clean" nature of the cored flux within the solder wire, once the solder joint has cooled and the residual flux is "dry," it is virtually inert after solder reflow, and removal of the flux is not even required. The residual rosin is nonconductive and non-corrosive. Moreover, the no clean flux within the core  is moisture and fungus resistant. Indeed, any dried rosin residue can actually insulate the surface from atmospheric corrosion. Still, the residue is easily removed with most flux removers.

Shown: 1-Pound Spool Perches On Top of Digital Solder Station

Popular No-Clean Flux Core: Our solder wire has become a "first-choice" with  commercial, military, industrial and medical electronic customers who refuse compromise when it comes to quality. Here's a helpful tip: No-clean formulations present a superior soldering solution to that of the well established, problematic water-soluble solders which can set up white residue conditions on printed circuit substrates and pads.

Drop In Replacement for No Clean Soldering Applications: Finally, our No Clean Solder Wire is a drop-in replacement for your no-clean operations. And whether you are working with the traditional, classic tin/lead solder alloys or with the newer RoHS compliant lead-free solder alloys, our no clean solder wire products deliver quality solder joints, excellent wetting properties, superb thermal transfer during soldering and enhanced cosmetics.