BGA, CSP & SMT Alignment, Placement, Preheat & Reflow at the Bench
ZT-7 BGA, CSP and SMT HOT AIR REFLOW CENTER

 
                         ALIGNMENT                             RE-DRESSING       
   
nozzles-&-templates02

Don’t be frightened by BGA’s 
because their balls are hidden 
underneath the package! 
Aligning BGA’s to the Pads 
and Reflowing them is Easy to Do!

 
   

NASA & ZEPHYRTRONICS EXPLAIN HOW TO QUICKLY & EASILY
ALIGN & PLACE BGA’s & CSP’s PRECISELY TO PADS IN SECONDS!

 
   

In the early 1990’s, the engineers at Zephyrtronics cleverly had the foresight to resolve the issue of placing BGA’s to the PCB pads. Their patented invention and method, now used successfully and repeatedly by thousands of engineers and technicians around the world, makes aligning the BGA component to the BGA pads:

1) Easy to Perform. (Little Skill Required)
2) Quick to Perform. It takes less than one minute!
3) Accurate & Repeatable Placement
4) Inexpensive and Kind to Your Budget!

O
ur patent-protected Zephyrtronics BGA Alignment Template Cube Invention eliminates the need for expensive so-called “split-beam” vision machines, cameras and monitors, all of which (by the way) must be continuously calibrated.

Below are photographs from Zephyrtronics and from NASA in a five step process for aligning and reflowing the BGA to the PCB pads.

ZT7 Align Step 103

STEP 1:
Insert the Patented Alignment Cube into Corresponding, Non-Heated Nozzle.  Activate ZT-7’s Vacuum to Secure Cube.

ZT7 Align Step 2

STEP 2:
Lower “Z” Axis of ZT-7 To Where Alignment Cube Hovers Directly Over (NASA Recommends About 1mm Above) the Targeted BGA Pads on the PCB Below.

ZT7 Align Step 3

STEP 3:
“Align the PCB’s pads for the targeted BGA to the Alignment Tool by adjusting the ABC-1 Circuit Board Cradle as necessary.”
 ---NASA, 2004


Photo Courtesy of NASA

ZT7 Align Step 4a

STEP 4A:
Square and Mate Cube to Outside Perimeter of BGA Pads. The Nozzle’s X, Y and Theta are Now Precisely Relationed to Targeted BGA Pads! Cube Temporarily “Holds Place” for the BGA. Raise “Z” Axis, Deactivate Vacuum Releasing Cube.

ZT7 Align Step 4b

STEP 4B:
That’s right! You don’t need a ten-twenty thousand dollar “split-beam” vision alignment unit to accurately place BGA’s and CSP’s (micro BGA’s) to your PCB pads!

In fact, NASA explains the simplicity this way: “ The alignment process is completed when the solder pads are just hidden on all directions. The drawing (on the left) shows what a properly aligned 5 x 5 BGA would look like. The solder pads (red) are just contained the Alignment Tool outline (blue).”
--NASA, 2004.


Graphic Illustration Courtesy of NASA from NASA Report Describing Zephyrtronics patented BGA Alignment Invention & Method.

ZT7 Align Step 5

STEP 5:
Insert Your BGA/CSP into the Now-Aligned Nozzle Where the Cube Had Been. Activate Vacuum to secure BGA. Lower “Z” Axis and Nozzle Down to the Substrate. Release Vacuum. Your BGA is Positioned on to Corresponding Pads! You are now ready to reflow your BGA with your Zephyrtronics ZT-7 System. How easy is that?

HOW TO RE-DRESS BGA & CSP PADS WITHOUT
THE USE OF HOT IRON & WICK!

ZT7 Redress 1

STEP 1:
BGA removal requires cleanup as unequal solder deposits remain at vacated site. After IC removal, slide the “Y” Axis of ZT-7 back out of way, apply flux to pads. Preheat bottom of PCB at 150°C with AirBath.

 

ZT7 Redress 2

STEP 2 (OPTION “A”):
After a brief preheating/soaking, use a heated DeSoldering Tool with a “soft tip-pad interface” and suck up excessive solder from pads. Preheating allows a lower, safer temp for DeSoldering.

 

ZT7 Redress 2b

STEP 2 (OPTION “B”):
Melt LowMelt® DeSolder into residual solder at pads. Remove all solder with either a foam swab or a “Solder Sucker”.

ZT7 Redress 3

STEP 3:
Switch off ZT-7 and AirBath. Gently clean site with a foam swab and a Non-Flammable Flux Remover. Inspect. (Notice? No Wick!)

 

 

           
   

©1996 - 2011, 2012, 2013, 2014 Ameritronics®. All rights reserved. The information and all images you receive online from Ameritronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Ameritronics® is the registered trademark property of JTI, Inc. "Zephyrtronics" and  "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" and "PostCooler" and "AirBath" and "Quatro" and "Full Metal Jacket" are the protected trademark property of JTI, Inc.

Revised for April 18, 2016

 

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HOW TO ALIGN, PLACE AND SOLDER BGA'S?

     

PCB, SMD, BGA Rework & Prototyping
AirBath, SMD Rework Stations, Hot Air Pencil Soldering, BGA Rework Stations, CSP Rework Stations, Preheating Systems, PCB Preheaters, Pre-Heat SMT / SMD, Low Temp Rework, SMT DeSoldering Tools, Vacuum Pickup Tools, Circuit Board Holders, PCB Fixtures, Board Cradles, Rework Solder Paste,  No-Clean Solder Paste, Low Melt® De-Solder Wire, DeSolder Wire, Hot Air Rework Stations, Fume Extractors, SMT Dental Probes, SMT-SMD Rework Kit, BGA Rework Kit, LMK Kit, BGA Re-Balling Kit, SMD Tweezers, Power Palm Plunger

How To Work With SMD's, CSP's, BGA's & QFN's
How To - BGA Alignment: How To - SMT Rework: How To - PCB Preheating, How To - BGA  & CSP Rework: How To - Quickly Solder SMD Packages Effectively: How To - CSP Alignment; How To - Lead-Free Rework; How To - SMD Removal Economical; How To - SMD Removal Professional: How To - Hot Air Pencil / AirPencil Soldering; How To - SMD Quick Chip Removal; How To - BGA Re-Balling; How To - Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP: How To - Solder & Rework Ceramic Capacitors: How To - Solder & Rework Glass Diodes

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