Through Hole De-Soldering Finally Made Really Easy!
Thru-Hole De-Soldering Without Lifting Pads & Traces!


What's the best way to desolder with PC Boards? With preheat! Remember, David Jacks, the President of Zephyrtronics pointed out way back in 1994: "if a PCB Assembly can be made under 300°C in initial production, then it can also be unmade and remade at similar temps!"  Regardless of copper content, number of layers & heavy ground planes? Yes. But you need a PCB fixture, an AirBath preheater, a non-clogging desoldering tool and you're there.


STEP 1: Secure your PCB within the ABC-1 Board Cradle above the ZT-1 AirBath (not powered) as shown. Generously dip your brush into flux. (Recommended: No Clean Flux NCF-0014 & THB-0144 Thru-Hole Brush)


STEP 4b:  Heat the pin. Position the DeSoldering Tip’s orifice over the joint’s lead/stud.  As solder melts, start a rotating motion with tip until you “sense” the pin moving freely.


STEP 2a:  Apply your flux to targeted solder joint's individual leads and land interface that corresponds to the Thru-Hole device, connector or chip on the opposite side of your PCB assembly you wish to desolder and remove.


STEP 4c: Activate Vacuum! Sensing the pin loose in the hole and solder is molten, lower tip to pad & begin vacuum. Rotating on pin prevents “sweating” of “plated thru-holes”. Do not exert pressure on pads.


STEP 2b: Begin Preheating! Next,  begin the pre-heating process by flipping the rocker switch found on the AirBath to "Warm". (Typically preheat is at 150°C).


STEP 4d:  After extracting solder from hole, lift tip up off the pad and continue vacuum 3-4 extra seconds. Proceed to next joint. Turn off power when done.


STEP 3a: Apply LowMelt®. Note: The preheat advantage permits skipping to Step 4. Still with extremely heavy ground planes, high copper content PCB’s,  a "boost" option is to use a strand of certified LowMelt® DeSolder Wire as shown.


STEP 5a:  Cool down & Clean.  Flip AirBath rocker switch to “Cool” mode to cool down the PCB. Next, dip a through-hole cleaning brush into non-flammable flux remover. We recommend: NFR-0056.


STEP 3b: Melt LowMelt®. directly onto existing joints as needed. Co-metalization has begun! Because no two PCB’s are alike, some joints will require more LowMelt® (Note: Only use certified Zephyrtronics alloy).


STEP 5b: Clean PCB by brush with Non-Flammable Flux Remover as PCB cools under the AirBath.  Inspect.  Turn off ZT-1 AirBath.  Flip PCB over; carefully extract device.


STEP 4a:
Ready for DeSoldering! Using a MIL-Spec, Temp-Controlled Thru-Hole DeSoldering Tool (We recommend: the AT-915ESD Digital DeSoldering Station) and with the Digital Temp Set at no more than 300°C, take the Desoldering Pistol and lower the Desoldering Tip onto the solder joint stud.  Be Careful and do not lower tip to the pad at this point.

©1996 - 2011, 2012, 2013, 2014 Ameritronics®. All rights reserved. The information and all images you receive online from Ameritronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Ameritronics® is the registered trademark property of JTI, Inc. "Zephyrtronics" and  "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" and "PostCooler" and "AirBath" and "Quatro" and "Full Metal Jacket" are the protected trademark property of JTI, Inc.

Revised for April 18, 2016

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