How to ReBall BGA's   ReBalling Stencils   BGA Spheres and Solder Balls. Helpful Tecniques.

BGA RE-BALLING QUALITY METHOD

Originally Pioneered By Zephyrtronics®

How To Re-Ball Your BGA's in Ten Quick Steps:

  Reballing requires only a little patience and lots of quality.  Here are ten simples steps! The words "stencil" and "screen" are interchanged here.  
 
 

1.  Apply a thin film of tacky Zephlux (NCF-00114  over the grid area of the Ball Grid Array or Chip Scale Package using an anti-static foam swab as shown at left.

 
 
 

2. Choose the appropriate Re-Balling Screen for your BGA pattern and solder sphere count. Place your fluxed component on the underside of the Re-Balling Screen. Square up your component and the Screen..

 

Make Your Own ReBalling Kit

 

3. Ideally, position a Re-Balling Pan  beneath  the Re-Balling stencil and place your chip into the Re-Balling Pan so that the handles of the Re-Balling stencil are directly above those of the Re-Balling Pan. Shown at left.

 
 

4. Remove lid from a Re-Balling Tank. Place Re-Balling Pan unit into the grooves of your Re-Balling Tank. Pour the appropriate Solder Spheres onto Re-Balling Screen. Holding both handles, rotate left & right dumping any excess spheres into the Tank.

 

5. Turn on your ZT-3 AirPick, place a Re-Balling Needle Tip (our popular ZT-5-VPAK variety tip pack is included in the kit!) of a smaller size then your Solder Spheres on the end of the AirPick™.

 
 

6. Now, use your ZT-3-AirPick to remove any extra Solder Spheres that you have left. Also use your AirPick to fill in any holes on your Re-Balling Screen as shown here.

 
 

7. Place aRe-Balling Platform (make from non-flammable G-7 material into your ABC-1 Board Cradle. Position the Cradle in front of your ZT-7-MIL. Next, place the Re-Balling Pan and Re-Balling Screen on top of the ReBalling Platform using the convenient handles.

 

A Decent BGA Re-Balling Set-Up or Station Should Include the Following:

ZT-3 AirPick
ABC-1 Board Cradle
• Solder Spheres for Re-Balling
   Vial of 10K -30 Mil Diameter
   Vial of 10K -25 Mil Diameter
   Vial of 10K -20 Mil Diameter
   Vial of 10K -12 Mil Diameter

ZT-7-MIL
• ReBalling Stencil
• ReBalling Pan
• ReBalling Platform
• ReBalling Tank
• ReBalling Needle Tip Pack (ZT-5-VPAK)
LowMelt® DeSolder Wire 487
Solder Wick
• Zephlux™ Tacky Flux
• Non-Flammable Flux Remover
• Thru-Hole Brushes
Foam Swabs, ESD Safe
• Set of Two Stainless Steel Tweezers

Lead-Free Solder Spheres Are Available for Your RoHS Compliant Needs, Too!
 

 
   

8. Next lower the Z-axis heating zone of the ZT-7-MIL down to where the hot air nozzle is approximately 1/8" or 3mm above the Re-Balling unit. Set the countdown timer to 1:20. Set your top temperature to 230ºC. Start the timer and the begin the heating from above.

   

9. When the timer begins to beep, turn off top heater. As the Re-Balling unit cools, carefully separate the component out from the screen as shown in the photograph at the left. (Caution: The Re-Balling unit may still be hot.) Inspect your component and you are ready for final cleaning.

   

10. Final Cleaning: Dip a PCB Scrub Brush into the non-flammable flux remover (NFR-0056). Generously apply the flux-remover throughout the component until all of the old flux has been stripped away. Inspect.

Back to the Main ZT-7 Page

   
 

©1996 - 2011, 2012, 2013, 2014-2016-2019, 2020-2023 Ameritronics®. All rights reserved. The information and all images you receive online from Ameritronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Ameritronics® is the registered trademark property of JTI, Inc. "Zephyrtronics" and  "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" and "PostCooler" and "AirBath" and "Quatro" and "Full Metal Jacket" are the protected trademark property of JTI, Inc.

Revised for May 1, 2023

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BGA RE-BALLING KIT

 

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