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Hot
Air Nozzles
Rework Nozzles BGA, CSP, SMD, CSP, QFN Nozzles |
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The LMK-4000 Is
Your Comprehensive Solution to Reballing Your BGA's |
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How To Re-Ball Your BGA's in Ten Quick
Steps: |
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It's easy it is to
re-ball BGA's yourself. Our LMK-4000 Kit is used around the globe
everyday to repair BGA's. Here are Ten Simple Steps! |
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1. First apply a thin film of tacky Zephlux (NCF-0014 included in
the Kit!) over the grid area of the Ball Grid Array or Chip Scale Package using
an anti-static foam swab (SFS-A-0050 included in kit!) shown at left. |
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2.
Choose the appropriate Re-Balling Screen (from
the Kit) for your BGA pattern and solder sphere count. Place your fluxed component on the underside of your Re-Balling Screen. Make sure that your component and the Screen are perfectly square. |
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LMK-4000 . . . . . . . . ONLY $495
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3.
Now, position your Re-Balling Pan (included in kit!) under the Re-Balling Screen. Place the component into the Re-Balling Pan so that the handles of the Re-Balling Screen lie directly above those of the Re-Balling Pan.
Shown at left. |
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4.
Remove lid from Re-Balling Tank (included in your
Kit). Place Re-Balling Pan unit into the grooves of your Re-Balling Tank. Pour
the appropriate Solder Spheres (included in kit!) onto Re-Balling Screen. Holding both handles, rotate left & right dumping any excess spheres into the Tank. |
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5.
Either turn on your
ZT-3 Air Pick, place a Re-Balling Needle Tip (our popular ZT-5-VPAK variety tip pack is included in the kit!) of a smaller size then your Solder Spheres on the end of the AirPick™. |
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6.
Now, use your ZT-3-AirPick to remove any extra
Solder Spheres that you have left. Also use
your AirPick to fill in any holes on your
Re-Balling Screen as shown here. |
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7.
Place the Re-Balling Platform (included in Kit!) into your
ABC-1
Board Cradle. Position the the Cradle in front of your
ZT-7-MIL. Now, simply place the Re-Balling Pan and Re-Balling Screen on top of the ReBalling Platform using the convenient handles
as shown at the left. |
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Every LMK-4000 BGA Re-Balling Kit Includes All of the Following:
• Solder Spheres
for Re-Balling
Vial of 10K -30 Mil Diameter
Vial of 10K -25 Mil
Diameter
Vial of 10K -20 Mil Diameter
Vial of 10K -12 Mil
Diameter
• Re-Balling Stencil
• Re-Balling Pan
• Re-Balling Platform
• Re-Balling Tank
• Re-Balling
Needle Tip Pack (ZT-5-VPAK)
•
LowMelt® DeSolder Wire 487
• Solder Wick
• Zephlux™
Tacky Flux
•
Non-Flammable
Flux Remover
• Thru-Hole
Brushes
•
Foam Swabs, ESD Safe
• Set of Two Stainless Steel
Tweezers
Lead-Free Solder Spheres
Are Available for Your RoHS Compliant Needs, Too!
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8.
Next lower the Z-axis heating zone of the ZT-7-MIL down
to where the hot air nozzle is approximately 1/8" or 3mm above
the Re-Balling unit. Set the countdown timer to 1:20. Set your
top temperature to 230ºC. Start the timer and the begin the heating from
above. |
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9.
When the timer begins to beep, turn off top heater. As
the Re-Balling unit cools, carefully separate the component out from the screen
as shown in the photograph at the left. (Caution: The Re-Balling unit
may still be hot.) Inspect your component and you are ready for
final cleaning. |
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10.
Final Cleaning: Dip one of your Thru-Hole Brushes (included in
Kit!) into the non-flammable flux remover (NFR-0056, also included in
the Kit!). Generously apply the flux-remover throughout the component
until all of the old flux has been stripped away. Inspect. |
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Back to the Main ZT-7 Page |
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©1996 - 2011, 2012 Ameritronics®. All rights reserved. The
information you receive online from Ameritronics® is protected by
the copyright laws of the United States. The copyright laws prohibit
any copying, redistributing, retransmitting, or repurposing of any
copyright-protected material. Ameritronics® is the registered
trademark property of JTI, Inc. "Zephyrtronics" and "Zephlux"
and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post
Cooling" and "PostCooler" and "AirBath" and "Quatro" and "Full Metal
Jacket" are the protected trademark property of JTI, Inc. |
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Click link below
to return to the top of the page |
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BGA RE-BALLING KIT |
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SMD Rework,
SMT Rework
AirBath,
SMD Rework
Stations,
Hot Air
Pencil Soldering,
BGA Rework
Stations,
CSP Rework
Stations,
Preheating
Systems,
PCB
Preheaters,
Pre-Heat
SMT / SMD,
Low Temp Rework,
SMT
DeSoldering Tools,
Vacuum
Pickup Tools,
Circuit
Board Holders,
PCB
Fixtures,
Board
Cradles,
Rework
Solder Paste,
No-Clean
Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder
Wire,
Hot Air
Rework Stations,
Fume
Extractors,
SMT Dental
Probes,
SMT-SMD
Rework Kit,
BGA Rework
Kit,
LMK Kit,
BGA
Re-Balling Kit,
SMD
Tweezers,
Power Palm
Plunger
How To - SMT, CSP, BGA Rework
How To -
BGA Alignment:
How To -
SMT Rework:
How To - PCB Preheating,
How To -
BGA & CSP Rework:
How To -
Quickly Solder SMD Packages Effectively:
How To -
CSP Alignment;
How To -
Lead-Free Rework;
How To -
SMD Removal Economical;
How To -
SMD Removal Professional:
How To -
Hot Air Pencil / AirPencil Soldering;
How To -
SMD Quick Chip Removal;
How To -
BGA Re-Balling;
How To -
Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP:
How To -
Solder & Rework Ceramic Capacitors:
How To -
Solder & Rework Glass Diodes
Soldering,
De-Soldering
Soldering
Accessories,
Solder
Wire,
No-Clean
Solder Wire,
Eutectic
Solder Wire,
Solder Wire
Dispenser,
Solder
Paste,
Lead-Free
Solder Paste,
Flux,
Solder
Paste Dispensers,
LowMelt®
DeSolder Wire,
De-Solder
Wire,
Soldering
Irons,
Digital
Soldering Station,
Digital
De-Soldering,
MIL-Spec
Soldering Station:
ESD
Soldering Station,
Soldering
Tips,
Thru-Hole
DeSoldering Tools,
Desoldering
Tip,
Tips for
Desoldering,
De-Solder
Wick,
Smoke
Extractors,
Fume
Extractor Filters,
Carbon
Activated Filters,
SolderMill™,
Pre-Heating
Systems,
Preheat
Thru-Hole,
PCB
Pre-Heating,
Flux
Solvent,
How To - Connector Rework;
How To -
PC/104 Soldering and Rework;
How To -
Thru-Hole / Through Hole Desolder / De-Solder;
How To -
Low Melt® Desolder Wire;
How To-
Stop Lifting Pads;
How To-
Desolder / De-Solder Heavy Ground Planes;
How To -
Lead-Free Soldering and De-Soldering;
Preheaters
for Lead-Free Rework and Soldering
Dispensing
Dispensing
Systems,
Dispensing
Syringes,
Dispensing
Barrels,
Tapered
Tips,
Blunt
Needles,
Stainless
Steel Needles,
Dispensing
Needles,
Industrial
Needles,
Dispensing
Tips,
Dispensing
Accessories,
Solder
Paste in Syringe,
Lead-Free
Solder Paste in Syringe,
Paste Rack™
Solder Paste Holder,
Dispensing
Supplies,
Power Palm
Plunger,
Manual
Dispensing,
Automatic
Dispensing
Benchtop Accessories,
Bench Supplies,
Benchtop Tools
SMD Solder
Paste,
Lead-Free
Solder Paste,
Solder
Wire,
LowMelt®,
No-Clean
Flux,
BGA Flux,
Rework Tack
Flux,
Non-Flammable Flux Remover,
Inspection
Equipment,
Magnification Equipment,
Magnifying
Work Light,
ESD
Magnifier,
Pen Vac,
SMT
Tweezers,
Fume
Extraction,
SMD
Tweezers,
PC Board
Fixtures,
Hot Air
Tips,
AirTips,
Replacement
Soldering Sponges,
Iron Plated
Soldering Tips,
Art
Conservation Hot Air Tools,
Foam Swabs,
Anti-Static
Foam Swabs,
Thru-Hole
Brushes,
LMK Rework
Kits |
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