Hot Air Nozzles    PCB Rework       SMT Rework Nozzles        BGA, CSP, SMD, CSP, QFN  Nozzles

SMD & QFN HOT AIR NOZZLES

For All Zephyrtronics ZT-7 Reflow Convection Systems

 

Below are the 13 most common Hot Air Nozzles used for Surface Mount Components in prototyping PCB's, reworking and repair and in low volume production runs. Please note that all of the nozzle below are open box style which means that the package and the leads heat simultaneously which is required for QFN's and BGA's, but also helps provide lower reflow temperatures even for SMD's such as QFP's, PLCC's, SOIC's, LCC's, SOL's, SOJ's and the full range of SMT chips. And if you can handle your own BGA alignment manually, then these nozzles are superb even for your BGA, CSP and even Micro BGA soldering and desoldering.

 
 

THE SMT NOZZLE CHART

Your Chip Size

Nozzle Opening Size

Component Suggestion

Order Part Number

0.40” X 0.40”
(11mm X 11mm)

0.50” X 0.50”
12.7mm X 12.7mm

PLCC 20, JEDI 20
TQFP 44, PLCC 18
Low Profile QFP 64,80

ZT-7-4001

0.49” X 0.49”
(13mm X 13mm)

0.60” X 0.60”
15.2mm X 15.2mm

PLCC 28, FLAT PACK 16
TQFP 64

ZT-7-4002

0.54” X 0.54”
(14mm X 14mm)

0.67” X 0.67”
17mm X 17mm

QFP 44, TQFP 80
CHERPACK 24

ZT-7-4003

0.69” X 0.69”
(17mm X 17mm)

0.80” X 0.80”
20.3mm X 20.3mm

PLCC 44, JEDI 44
TQFP 100, UT QFP 52

ZT-7-4005

0.79” X 0.79”
(20mm X 20mm)

0.90” X 0.90”
23mm X 23mm

PLCC 52
QFP 64, QFP 80, QFP 52

ZT-7-4010

0.99” X 0.99”
(25mm X 25mm)

1.10” X 1.10”
28mm X 28mm

PLCC 68, TFQ 144

ZT-7-4006

1.07” X 1.07”
(27mm X 27mm)

1.20” X 1.20”
30.5mm X 30.5mm

BQFP 132, QFP 132
TFQ 160, 176

ZT-7-4011

1.19” X 1.19”
(30mm X 30mm)

1.30” X 1.30”
33mm X 33mm

PLCC 84, QFP 208

ZT-7-4007

1.22” X 1.22”
(31mm X 31mm)

1.33” X 1.33”
33.7mm X 33.7mm

QFP 120, QFP 128
QFP 144, QFP 160

ZT-7-4008

0.70” X 0.95”
(18mm X 24mm)

0.79” X 1.10”
20mm X 26mm

QFP 100, QFP 64
QFP 80

ZT-7-4009

0.43” X 0.51”
(11mm X 13mm)

0.51” X 0.61”
13mm X 15.5mm

SOL 20, SOL 16J, SOL 18J, SOM 16, SOLIC 16, SILIC 20, SOIC 14, SO 14, TANT CAPS, D2PAK

ZT-7-4012

0.43” X 0.63”
(11mm X 16mm)

0.51” X 0.71”
13mm X 18mm

SOL 28, TSSOP 8, SOIC 16, SOM 16, SOL 4, TANT CAPS

ZT-7-4013

0.47” X 0.75”
(12mm X 19mm)

0.57” X 0.82”
14.5mm X 21mm

DUAL TSOP 24-28
DUAL TSOP 40-44

ZT-7-4014

 

ADDITIONAL SMT NOZZLES

Your Chip Size

Nozzle Opening Size

Component Suggestion

Order Part Number

50mm X 50mm

50mm x 50mm

EXTRA LARGE MULTI-USE NOZZLE

ZT-7-4037

 
All Zephyrtronics Nozzles feature our unique, world-first thin-wall construction permitting nozzle penetration into those densely packed PCB’s. All Nozzles are designed to work only with the ZT-7-MIL BGA, CSP & SMT System.

Choose any of the above SMT Nozzles for our amazingly affordable price of only $149.00 each.

 

A $242.00 SAVINGS! EQUIVALENT TO 3 (THREE) FREE NOZZLES:
NEW! SPECIAL 13 SMT NOZZLE VALUE PACK
13_nozzles_web_copy
Here’s the best deal going! Purchase our special Selection Pack of 13 popular SMT Nozzles* for extra versatility so that you never need to search for that special nozzle again. One item number buys them all (ZT-7-SMTPK) for use with your
ZT-7-MIL BGA, CSP & SMT System
.

If purchased individually: $1,937.00. Order ZT-7-SMTPK for only $1,695.00.
* Does not include the ZT-7-4037 Specialty Extra Large Nozzle

 
   

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Revised for July 3, 2018

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SMD NOZZLES

PCB, SMD, BGA Rework & Prototyping
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How To Work With SMD's, CSP's, BGA's & QFN's
How To - BGA Alignment: How To - SMT Rework: How To - PCB Preheating, How To - BGA  & CSP Rework: How To - Quickly Solder SMD Packages Effectively: How To - CSP Alignment; How To - Lead-Free Rework; How To - SMD Removal Economical; How To - SMD Removal Professional: How To - Hot Air Pencil / AirPencil Soldering; How To - SMD Quick Chip Removal; How To - BGA Re-Balling; How To - Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP: How To - Solder & Rework Ceramic Capacitors: How To - Solder & Rework Glass Diodes

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