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How to ReBall BGA's ReBalling Stencils BGA
Spheres and Solder Balls. Helpful Tecniques. |
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BGA
RE-BALLING QUALITY METHOD |
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Originally Pioneered By Zephyrtronics® |
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How To Re-Ball Your BGA's in Ten Quick
Steps: |
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Reballing requires only a little patience and lots of quality.
Here are ten simples steps! The words "stencil" and "screen" are
interchanged here. |
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2.
Choose the appropriate Re-Balling Screen for
your BGA pattern and solder sphere count. Place your fluxed component on the underside of
the Re-Balling Screen. Square up your component and the Screen.. |
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Make Your Own ReBalling Kit
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3.
Ideally, position
a Re-Balling Pan beneath the Re-Balling
stencil and place your chip into the Re-Balling Pan so that the handles of the Re-Balling
stencil are directly above those of the Re-Balling Pan.
Shown at left. |
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4.
Remove lid from a Re-Balling Tank. Place Re-Balling Pan unit into the grooves of your Re-Balling Tank. Pour
the appropriate Solder Spheres onto Re-Balling Screen. Holding both handles, rotate left & right dumping any excess spheres into the Tank. |
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5.
Turn on your
ZT-3 AirPick, place a Re-Balling Needle Tip (our popular ZT-5-VPAK variety tip pack is included in the kit!) of a smaller size then your Solder Spheres on the end of the AirPick™. |
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6.
Now, use your ZT-3-AirPick to remove any extra
Solder Spheres that you have left. Also use
your AirPick to fill in any holes on your
Re-Balling Screen as shown here. |
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7.
Place aRe-Balling Platform (make
from non-flammable G-7 material into your
ABC-1
Board Cradle. Position the Cradle in front of your
ZT-7-MIL. Next, place the Re-Balling Pan and Re-Balling Screen on top of the ReBalling
Platform using the convenient handles.
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A Decent BGA Re-Balling Set-Up or Station Should Include the
Following:
•
ZT-3 AirPick
•
ABC-1
Board Cradle
• Solder Spheres
for Re-Balling
Vial of 10K -30 Mil Diameter
Vial of 10K -25 Mil
Diameter
Vial of 10K -20 Mil Diameter
Vial of 10K -12 Mil
Diameter
•
ZT-7-MIL
• ReBalling Stencil
• ReBalling Pan
• ReBalling Platform
• ReBalling Tank
• ReBalling
Needle Tip Pack (ZT-5-VPAK)
•
LowMelt® DeSolder Wire 487
•
Solder Wick
• Zephlux™
Tacky Flux
•
Non-Flammable
Flux Remover
• Thru-Hole
Brushes
•
Foam Swabs, ESD Safe
• Set of Two Stainless Steel
Tweezers
Lead-Free Solder Spheres
Are Available for Your RoHS Compliant Needs, Too!
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8.
Next lower the Z-axis heating zone of the ZT-7-MIL down
to where the hot air nozzle is approximately 1/8" or 3mm above
the Re-Balling unit. Set the countdown timer to 1:20. Set your
top temperature to 230ºC. Start the timer and the begin the heating from
above.
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9.
When the timer begins to beep, turn off top heater. As
the Re-Balling unit cools, carefully separate the component out from the screen
as shown in the photograph at the left. (Caution: The Re-Balling unit
may still be hot.) Inspect your component and you are ready for
final cleaning. |
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©1996 - 2011, 2012, 2013, 2014-2016-2018 Ameritronics®. All rights
reserved. The information and all images you receive online from
Ameritronics® is protected by the copyright laws of the United
States. The copyright laws prohibit any copying, redistributing,
retransmitting, or repurposing of any copyright-protected material.
Ameritronics® is the registered trademark property of JTI, Inc. "Zephyrtronics"
and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero
Residue" and "Post Cooling" and "PostCooler" and "AirBath" and "Quatro"
and "Full Metal Jacket" are the protected trademark property of JTI,
Inc.
Revised for
February 1, 2018 |
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Click link below to return to the top of the page |
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BGA
RE-BALLING KIT |
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PCB,
SMD, BGA Rework & Prototyping
AirBath,
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Stations,
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Pencil Soldering,
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DeSoldering Tools,
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PCB
Fixtures,
Board
Cradles,
Rework
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Rework Stations,
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Probes,
SMT-SMD
Rework Kit,
BGA Rework
Kit,
LMK Kit,
BGA
Re-Balling Kit,
SMD
Tweezers,
Power Palm
Plunger
How To Work With SMD's, CSP's,
BGA's & QFN's
How To - BGA
Alignment:
How To -
SMT Rework:
How To - PCB Preheating,
How To -
BGA & CSP Rework:
How To -
Quickly Solder SMD Packages Effectively:
How To -
CSP Alignment;
How To -
Lead-Free Rework;
How To -
SMD Removal Economical;
How To -
SMD Removal Professional:
How To -
Hot Air Pencil / AirPencil Soldering;
How To -
SMD Quick Chip Removal;
How To -
BGA Re-Balling;
How To -
Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP:
How To -
Solder & Rework Ceramic Capacitors:
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SolderMill™,
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Flux
Solvent,
How To - Connector Rework;
How To -
PC/104 Soldering and Rework;
How To -
Thru-Hole / Through Hole Desolder / De-Solder;
How To -
Low Melt® Desolder Wire;
How To-
Stop Lifting Pads;
How To-
Desolder / De-Solder Heavy Ground Planes;
How To -
Lead-Free Soldering and De-Soldering;
Preheaters for Lead-Free Rework and
Soldering
Dispensing, Solder Paste, Liquids
& Fluids
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Tweezers,
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Tips,
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Conservation Hot Air Tools,
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Foam Swabs,
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Brushes,
LMK Rework Kits
Laboratory &
Bench Supplies & Tools
SMD Solder
Paste,
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Solder Paste,
Solder
Wire,
LowMelt®,
No-Clean
Flux,
BGA Flux,
Rework Tack
Flux,
Non-Flammable Flux Remover,
Inspection
Equipment,
Magnification Equipment,
Magnifying
Work Light,
ESD
Magnifier,
Pen Vac,
SMT
Tweezers,
Fume
Extraction,
SMD
Tweezers,
PC Board
Fixtures,
Hot Air
Tips,
AirTips,
Replacement
Soldering Sponges,
Iron Plated
Soldering Tips,
Art
Conservation Hot Air Tools,
Foam Swabs,
Anti-Static
Foam Swabs,
Thru-Hole
Brushes,
LMK Rework
Kits |
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