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909-865-2595 PHONE

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sales@ameritronics.com

 

 

 

 

 

 

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Each ZT-7-XBOX Comprehensive Hot Air Benchtop Reflow System Ships with the ZLK-XBOX Rework Kit Included at No Extra Charge!

 
 
 
 

 

XBOX REWORK and REPAIR KIT

  Solder & De-Solder BGA, GPU, 360 CPU. Rework & Repair X-Box 360 PC Board Assemblies
 

Here's our ZLK-XBOX PCB Rework Kit which comes included at no extra charge with our ZT-7-XBOX Comprehensive Hot Air Bench Top Reflow System.

The ZLK-XBOX PCB Rework Kit is packed with the essentials you need for reworking the X-Box 360 PCB's. Each kit includes the fundamental small bench top tools, high quality cleaning and preparation materials, including our popular premium ZeroLead® LowMelt® Desolder wire, along with the four most critical hot air reflow nozzles for your ZT-7 System and more all into a convenient, durable and space saving storage case. The chart below provides the itemized contents of the kit that also includes our popular ball-to-pad interface tapes to position the new chips back to the exact location before soldering!

 
   

 

The ZLK-X-Box Rework Kit Includes Four Hot Air Nozzles for the Microsoft® & Samsung® Memory Chips, the GPU & CPU Chips, Helpful Ball to Pad Interface Tapes to Position the Chip to the PCB pads, Lead-Free LowMelt® DeSolder Wire, No Clean Flux, Non-Flammable Flux Remover, Swabs & more.
   
 

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The ZLK-XBOX KIT is a great asset for other PCB Assy tasks, whether Surface Mount, Thru-Hole, soldering or desoldering. The kit provides key materials and tools at your fingertips! The  ZLK-XBOX Kit  is lead-free and RoHS Compliant. The kit  comes at no charge with the ZT-7-XBOX Bench Top Reflow System.

 

The ZLK-XBOX KIT AND ITS CONTENTS

 
DESCRIPTION

ZLK-XBOX

REWORK KIT

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DURABLE  PLASTIC STORAGE
CASE PACKED WITH ALL OF THE ITEMS BELOW!

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CLICK  ON PHOTO LINKS BELOW FOR MORE DETAILS OR TO ENLARGE PHOTO ON SPECIFIC PRODUCT

RoHS COMPLIANT LEAD-FREE ZEROLEAD® LOWMELT® DESOLDER WIRE

975 cm/ 16 ft in Tube

Included

Hot Air Nozzle for the ZT-7-XBOX Reflow System for X-Box 360 GPU Component (35mm x 35mm BGA Nozzle)

Included

Hot Air Nozzle for the ZT-7-XBOX Reflow System for X-Box 360 CPU Component (31mm x 31mm BGA Nozzle)


Included

Hot Air Nozzle for the ZT-7-XBOX Reflow System for X-Box 360 Microsoft® Memory Chip (23mm x 23mm BGA Nozzle)

Included

Hot Air Nozzle for the ZT-7-XBOX Reflow System for X-Box 360 Samsung® Memory Chip (11mm x 14mm BGA Nozzle

Included

Pad-to-Ball Interface Tape: Double-Sided Adhesive for Positioning Ball Grid Arrays to the PCB's Pads. Kit Includes the Interface Tapes for 4 of the X-Box 360's BGA's (GPU, CPU, Microsoft® Memory Chip, and the Samsung® Memory Chip. Quick and Easy to Use!

Included

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NON-FLAMMABLE FLUX
REMOVER
2 OZ. BOTTLE

Included

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BGA  FLUX - RMA SERIES
2 OZ.  BOTTLE

Included

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STAINLESS  STEEL SMT PROBES
(SET OF 4 DENTAL STYLE)

Included

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ANTI-STATIC  FOAM SWABS
(20 LARGE & 10 SMALL ESD SAFE.  20 ECONO WHITE)

Included

VARIETY PACK OF DISPENSING NEEDLES
(15 HALF-INCH AND 15 ONE-INCH BLUNT STAINLESS STEEL NEEDLES.  6 TAPERED TIPS AND 1 HUB CAP)
Included
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DESOLDERING  BRAID / WICK, Qty of 2
(152 cm / 5 ft)

Included

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INSPECTION / JEWELER’S LOOP
(10X MAGNIFICATION IN
21mm LENS, CHROME PLATED)

Included

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SMT TWEEZERS WITH
ADJUSTABLE MAGNIFIER

(4X MAGNIFIER LENS, STAINLESS
STEEL TWEEZERS)

Included

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THRU-HOLE  BRUSHES
(10  BRUSHES)

Included

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DESOLDERING  PUMP /
SOLDER SUCKER

Included

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BGA TRAINING PRACTICE TEST BOARD & CHIPS.

Included

 
 

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