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XBOX REWORK and REPAIR KIT |
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Solder
& De-Solder BGA, GPU, 360 CPU. Rework & Repair X-Box
360 PC Board Assemblies |
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Here's our
ZLK-XBOX PCB Rework Kit
which comes included at no extra charge with our
ZT-7-XBOX
Comprehensive Hot Air Bench Top Reflow System.
The
ZLK-XBOX PCB Rework Kit
is packed with the essentials you need for reworking the
X-Box 360 PCB's. Each kit includes the fundamental small
bench top tools, high quality cleaning and preparation
materials, including our popular premium ZeroLead®
LowMelt® Desolder wire, along with the four most
critical hot air reflow nozzles for your
ZT-7 System
and more all into a convenient, durable and space saving
storage case. The chart below provides the itemized
contents of the kit that also includes our popular
ball-to-pad interface tapes to position the new chips
back to the exact location before soldering! |
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The ZLK-X-Box
Rework Kit Includes Four Hot Air Nozzles for the
Microsoft® & Samsung® Memory Chips, the GPU & CPU Chips,
Helpful Ball to Pad Interface Tapes to Position the Chip
to the PCB pads, Lead-Free LowMelt® DeSolder Wire, No
Clean Flux, Non-Flammable Flux Remover, Swabs & more. |
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The
ZLK-XBOX KIT
is a great asset for other PCB Assy tasks, whether
Surface Mount, Thru-Hole, soldering or desoldering. The
kit provides key materials and tools at your fingertips!
The ZLK-XBOX Kit
is lead-free and RoHS Compliant. The kit comes at
no charge with the
ZT-7-XBOX
Bench Top Reflow System. |
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The ZLK-XBOX
KIT AND ITS CONTENTS |
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DESCRIPTION |
ZLK-XBOX |
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REWORK KIT |
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DURABLE PLASTIC STORAGE
CASE PACKED WITH ALL OF THE ITEMS
BELOW! |
YES |
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CLICK ON PHOTO LINKS BELOW FOR
MORE DETAILS OR TO ENLARGE PHOTO ON
SPECIFIC PRODUCT |
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RoHS COMPLIANT LEAD-FREE ZEROLEAD®
LOWMELT® DESOLDER WIRE
975
cm/ 16 ft in Tube |
Included |
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Hot
Air Nozzle for the ZT-7-XBOX Reflow
System for
X-Box 360 GPU Component (35mm x 35mm
BGA Nozzle) |
Included |
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Hot
Air Nozzle for the ZT-7-XBOX Reflow
System for
X-Box 360 CPU Component (31mm x 31mm
BGA Nozzle) |
Included |
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Hot
Air Nozzle for the ZT-7-XBOX Reflow
System for
X-Box 360 Microsoft® Memory Chip
(23mm x 23mm BGA Nozzle) |
Included |
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Hot
Air Nozzle for the ZT-7-XBOX Reflow
System for
X-Box 360 Samsung® Memory Chip (11mm
x 14mm BGA Nozzle |
Included |
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Pad-to-Ball Interface Tape: Double-Sided Adhesive for
Positioning Ball Grid Arrays to the
PCB's Pads. Kit Includes the
Interface Tapes for 4 of the X-Box
360's BGA's (GPU, CPU,
Microsoft® Memory Chip, and the
Samsung® Memory Chip. Quick and Easy
to Use! |
Included |
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NON-FLAMMABLE FLUX
REMOVER
2 OZ.
BOTTLE |
Included |
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BGA
FLUX - RMA SERIES
2 OZ.
BOTTLE |
Included |
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STAINLESS STEEL SMT PROBES
(SET OF
4 DENTAL STYLE) |
Included |
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ANTI-STATIC FOAM SWABS
(20
LARGE & 10 SMALL ESD SAFE. 20
ECONO WHITE) |
Included |
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VARIETY PACK OF DISPENSING NEEDLES
(15
HALF-INCH AND 15 ONE-INCH BLUNT
STAINLESS STEEL NEEDLES. 6
TAPERED TIPS AND 1 HUB CAP) |
Included |
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DESOLDERING BRAID / WICK, Qty
of 2
(152 cm
/ 5 ft) |
Included |
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INSPECTION / JEWELER’S LOOP
(10X
MAGNIFICATION IN
21mm LENS, CHROME PLATED) |
Included |
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SMT TWEEZERS WITH
ADJUSTABLE MAGNIFIER
(4X MAGNIFIER LENS, STAINLESS
STEEL TWEEZERS) |
Included |
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THRU-HOLE BRUSHES
(10
BRUSHES) |
Included |
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DESOLDERING PUMP /
SOLDER SUCKER |
Included |
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BGA TRAINING PRACTICE TEST BOARD &
CHIPS. |
Included |
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Back to the
Top of Page |
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Back to the ZT-7 XBOX Hot Air Reflow
System |
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©1996 - 2008 Ameritronics®. All rights reserved. The
information you receive online from Ameritronics® is
protected by the copyright laws of the United States.
The copyright laws prohibit any copying, redistributing,
retransmitting, or repurposing of any
copyright-protected material. Ameritronics® is the
registered trademark property of JTI, Inc.
"Zephyrtronics" and "Zephlux" and "ZeroLead" and "Zero
Balling" and "Zero Residue" and "Post Cooling" are the
protected trademark property of JTI, Inc. |
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