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© 2004-2005 Ameritronics®. All rights reserved. The information you receive online from Ameritronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Ameritronics® is the registered trademark property of JTI, Inc.
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ORDER SECURELY ON-LINE * * * |
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ZEPHYRTRONICS ZT-7 HOT AIR REFLOW CENTER |
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Soldering & De Soldering the GPU, CPU & the Samsung
"Memory Chip" |
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Repairing the wildly popular Microsoft®
Xbox 360 printed circuit board (PCB) is now easier
than ever with the
Zephyrtronics ZT-7 Hot Air Soldering Benchtop System.
The ZT-7 System make both de-soldering and removing
the GPU, CPU and Memory Chips and /or replacing and
re-soldering them back to the PCB a breeze. And best
of all, the ZT-7 System is also very affordable and
is manufactured by Zephyrtronics.
Above you can
see the XBOX 360 printed circuit board populated
with its components including the critical GPU, CPU
and Memory Chip chips. And shown below is the XBOX
CPU component which is Ball Grid Array (BGA) styled
package (see the yellow highlighted sidebar for
further explanation, if needed).
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Because BGA's
such as this CPU chip have less metal
content than the old traditional components
with leads, these chips are more sensitive
to high temperatures requiring that the PCB
be preheated before any rework can be
performed so as not to damage them during
your rework or repair. |
The
ZT-7 BGA & SMT Hot Air
Reflow Center is a comprehensive, yet not
expensive benchtop system that incorporates both
bottom-side preheating (AirBath) and top-side hot
air for the final soldering or desoldering of the
chip (See below).
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The
ZT-7 is the
very same soldering system that was used by
NASA to place and solder the critical,
high-reliability I.C.'s on the two Mars
Rovers whose mission was so successful in
2003 and 2004. Good enough for NASA and, yet
easy enough to repair an XBox 360 PCB! |
Above: ZT-7
Benchtop System |
X-Box Repair Guide:
Zephyrtronics ships every ZT-7 with a
detailed and helpful owners manual along
with the 39-page report by NASA for its
employees which features approximately 300
photographs filled with technical tips and
techniques. In addition, for those reworking
and repairing X-Box modules, Zephyrtronics
also includes a step-by-step illustrated
guide for removing and replacing the GPU's,
CPU's and Memory Chips on the X-box 360
PCB's. The X-Box Repair Guide also is filled
with photographs and detailed technical
explanations of the process.
The
ZT-7 is
easy to operate and includes
closed-loop and
digital temperature control, plus digital
countdown timing, and industry standard
pre-heating and thermal ramping to enhance
the quality of your work. Of course, the
ZT-7 is not limited to just working on XBox
PCB's, but is ideal for prototyping tasks,
low volume production runs and rework and
repair of most all SMT and BGA tasks.
For
more specifications and product details,
click here to see the full webpage on the
ZT-7
Hot Air BGA & SMT Rework Center.
Also, feel free to call us at our factory in
Los Angeles County between 8:00 AM and 6:00
PM Monday through Friday at (909) 865-2595
or e-mail us at
david@zeph.com. We are here and happy to
help. |
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Understanding the GPU, CPU, Memory Chips
and Ball Grid Arrays (BGA's):
Q: What are these
chip packages that Microsoft®
calls the GPU, the
CPU, and the Memory Chips? And why do
they look so different from other
components?
A:
These are electronic chips that are
packaged in what are called Ball Grid
Array formats (BGA's). They are a
relatively new form of Surface Mount
Devices (SMD) and are similar to other
components in that they have an
integrated circuit (die) within the
package and that they have connections
to be soldered. However, instead of
leads at the side of the chip, the
connections are balls underneath the
chip (See Below):
Above Left: Bottom Side of a QFP Surface
Mount Chip with the leads at the side
for soldering to the PCB.
Above Right: Bottom Side of a Ball Grid
Array (BGA) Chip with solder spheres
(balls) at the bottom for soldering to
the PCB.
Many of the chips on the XBOX 360
Printed Circuit Board are packaged in
the BGA format shown above including the
GPU, CPU and Memory Chips. Indeed, most
consumer electronic PCB's today
incorporate more and more BGA style
chips as they are more robust in
construction and have faster gate speed
for processing.
Once the BGA is placed and soldered onto
the PCB, you can no longer "see" the
connections (balls) as they are
underneath the chip and no longer
visible to the eye.
Finally, the XBOX PCB's components are
all soldered to the pads with lead-free
solder, not the traditional solder that
everyone is familiar with. Lead-free
solder requires higher than traditional
temperatures which makes preheating the
PCB imperative.
Good News! Believe it or not, BGA's are
surprisingly easy to remove and replace
with the right equipment, the proper
procedures. And Zephyrtronics has built
into the popular ZT-7 System so many
great features including effective
preheating fo those lead-free solder
joints so as to make your job now much
easier to perform. |
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DESCRIPTION
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PART #
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PRICE
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The
ZT-7-XBOX System
Comprehensive BGA & SMT
Hot Air Bench Top
Reflow System
Includes:
The ZT-7-MIL (shown above)
and
The
ZT-1-BGS-DPU AirBath
The
ABC-1 Adjustable Board Cradle
ZLK-XBOX Benchtop Supply Kit
Includes the following BGA Nozzles
ZT-7-3021 (31 X 31MM), ZT-7-3007 (35 X
35MM), ZT-7-3082 (11 X 14MM) and
ZT-7-3005 (23 X 23MM)
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ZT-7-MIL
ZT-1-BGS-DPU
ABC-1
LMK3000
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$7,110
LIMITED
TIME
OFFER!
$6,399
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©1996 - 2008 Ameritronics®. All rights reserved. The
information you receive online from Ameritronics® is
protected by the copyright laws of the United States.
The copyright laws prohibit any copying, redistributing,
retransmitting, or repurposing of any
copyright-protected material. Ameritronics® is the
registered trademark property of JTI, Inc.
"Zephyrtronics" and "Zephlux" and "ZeroLead" and "Zero
Balling" and "Zero Residue" and "Post Cooling" are the
protected trademark property of JTI, Inc. |
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SMD Rework,
SMT Rework
AirBath,
SMD Rework
Stations,
Hot Air
Pencil Soldering,
BGA Rework
Stations,
CSP Rework
Stations,
Preheating
Systems,
PCB
Preheaters,
Pre-Heat
SMT / SMD,
Low Temp Rework,
SMT
DeSoldering Tools,
Vacuum
Pickup Tools,
Circuit
Board Holders,
PCB
Fixtures,
Board
Cradles,
Rework
Solder Paste, No-Clean
Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder
Wire,
Hot Air
Rework Stations,
Fume
Extractors,
SMT Dental
Probes,
SMT-SMD
Rework Kit,
BGA Rework
Kit,
LMK Kit,
BGA
Re-Balling Kit,
SMD
Tweezers,
Power Palm
Plunger
How To - SMT, CSP, BGA Rework
How To -
BGA Alignment:
How To -
SMT Rework:
How To - PCB Preheating,
How To -
BGA & CSP Rework:
How To -
Quickly Solder SMD Packages Effectively:
How To -
CSP Alignment;
How To -
Lead-Free Rework;
How To -
SMD Removal Economical;
How To -
SMD Removal Professional:
How To -
Hot Air Pencil / AirPencil Soldering;
How To -
SMD Quick Chip Removal;
How To -
BGA Re-Balling;
How To -
Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP:
How To -
Solder & Rework Ceramic Capacitors:
How To -
Solder & Rework Glass Diodes:
Soldering,
De-Soldering
Soldering
Accessories,
Solder
Wire,
No-Clean
Solder Wire,
Eutectic
Solder Wire,
Solder Wire
Dispenser,
Solder
Paste,
Lead-Free
Solder Paste,
Flux,
Solder
Paste Dispensers,
LowMelt®
DeSolder Wire,
De-Solder
Wire,
Soldering
Irons,
Digital
Soldering Station,
Digital
De-Soldering,
MIL-Spec
Soldering Station:
ESD
Soldering Station,
Soldering
Tips,
Thru-Hole
DeSoldering Tools,
Desoldering
Tip,
Tips for
Desoldering,
De-Solder
Wick,
Smoke
Extractors,
Fume
Extractor Filters,
Carbon
Activated Filters,
SolderMill™,
Pre-Heating
Systems,
Preheat
Thru-Hole,
PCB
Pre-Heating,
Flux
Solvent,
How To - Connector Rework;
How To -
PC/104 Soldering and Rework;
How To -
Thru-Hole / Through Hole Desolder / De-Solder;
How To -
Low Melt® Desolder Wire;
How To-
Stop Lifting Pads;
How To-
Desolder / De-Solder Heavy Ground Planes;
How To -
Lead-Free Soldering and De-Soldering;
Preheaters
for Lead-Free Rework and Soldering
Dispensing
Dispensing
Systems,
Dispensing
Syringes,
Dispensing
Barrels,
Tapered
Tips,
Blunt
Needles,
Stainless
Steel Needles,
Dispensing
Needles,
Industrial
Needles,
Dispensing
Tips,
Dispensing
Accessories,
Solder
Paste in Syringe,
Lead-Free
Solder Paste in Syringe,
Paste Rack™
Solder Paste Holder,
Dispensing
Supplies,
Power Palm
Plunger,
Manual
Dispensing,
Automatic
Dispensing
Benchtop Accessories,
Bench Supplies,
Benchtop Tools
SMD Solder
Paste,
Lead-Free
Solder Paste,
Solder
Wire,
LowMelt®,
No-Clean
Flux,
BGA Flux,
Rework Tack
Flux,
Non-Flammable Flux Remover,
Inspection
Equipment,
Magnification Equipment,
Magnifying
Work Light,
ESD
Magnifier,
Pen Vac,
SMT
Tweezers,
Fume
Extraction,
SMD
Tweezers,
PC Board
Fixtures,
Hot Air
Tips,
AirTips,
Replacement
Soldering Sponges,
Iron Plated
Soldering Tips,
Art
Conservation Hot Air Tools,
Foam Swabs,
Anti-Static
Foam Swabs,
Thru-Hole
Brushes,
LMK Rework
Kits
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