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XBox 360 Ring of Death Repair: Your Solution for BGA, SMT
& CSP
Rework, Reflow, Repair & Reballing Made Easy for
You
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ZEPHYRTRONICS
ZT-7 PROFESSIONAL HOT AIR
REFLOW CENTER |
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Soldering and De-Soldering the GPU, CPU & the Samsung
"Memory Chip"
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Red rings? Error codes? Ring of Death?
Repairing the wildly popular Microsoft®
Xbox 360 printed circuit board (PCB) is now easier
than ever with the
Zephyrtronics ZT-7 Hot Air Soldering Benchtop System.
The ZT-7 System makes either 1.) just reflowing
the chips; or 2.) de-soldering and removing the GPU, CPU and Memory Chips and then replacing and
re-soldering them back to the printed circuit boards
(PCB's) to correct the
error codes a breeze. And best
of all, the ZT-7 System is also very affordable and
is manufactured by Zephyrtronics in the U.S. and has
a two year limited warranty.
First,
don't be
fooled by IR systems that might repair the PCB
temporarily, but that can actually do more harm than
good to the board and chips. You want complete
reflow of the entire ball of solder (inside and
outside) on every
connection, and not what is called "tangential reflow"
that will later open
up again if the board flexes, especially when the XBox® is being
used again. To learn more about
the many pitfalls, drawback and limitations with IR
systems, please you will want to watch the
Video Comparisons & Demonstrations: 4 Methods of Preheating
& Solder Reflow which
illustrates the advantages of heated air or forced convection and why
it has long been the "industry standard" in PCB work worldwide.
Second, make
sure that the PCB holding fixture is independent
from both the lower pre-heater and from the upper
reflow heater.
If one is
trying to repair or reflow a large quantity of
PCB's, then speed is important. So having to wait
for a large PCB (like the XBox 360) to first
preheat, and then later to cool down for a long time
before moving on to the next PCB wastes a lot of
time and money and profit. Check out this short
video so you will understand why this is so
important. You'll be glad you did:
Video: The ABC's of PCB
Holding Fixtures.
By the
way, the ZT-7 System is equally
effective for repairing the PlayStation® which you can
learn about at this direct link:
PlayStation Rework Station.
Now, let's get back to the XBox360.
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Understanding the GPU, CPU, Memory Chips
and Ball Grid Arrays (BGA's):
Q: What are these
chip packages that Microsoft®
and Sony®
call the GPU, the
CPU, and the Memory Chips? And why do
they look so different from other
components?
A:
These are electronic chips that are
packaged in what are called Ball Grid
Array formats (BGA's). They are a
relatively new form of Surface Mount
Devices (SMD) and are similar to other
components in that they have an
integrated circuit (die) within the
package and that they have connections
to be soldered. However, instead of
leads at the side of the chip, the
connections are balls underneath the
chip (See Below):
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Above Left: Bottom Side of a QFP Surface
Mount Chip with the leads at the side
for soldering to the PCB.
Above Right: Bottom Side of a Ball Grid
Array (BGA) Chip with solder spheres
(balls) at the bottom for soldering to
the PCB.
Many of the chips on the XBOX 360®
and PlayStation®
Printed Circuit Boards are packaged in
the BGA format shown above including the GPU, CPU and Memory Chips. Indeed, most
consumer electronic PCB's today
incorporate more and more BGA style
chips as they are more robust in
construction and have faster gate speed
for processing.
Once the BGA is placed and soldered onto
the PCB, you can no longer "see" the
connections (balls) as they are
underneath the chip and no longer
visible to the eye.
Finally, the XBOX and PlayStation®
PCB's components are
all soldered to the pads with lead-free
solder, not the traditional solder that
everyone is familiar with. Lead-free
solder requires higher than traditional
temperatures which makes preheating the
PCB imperative.
Good News! Believe it or not, BGA's are
surprisingly easy to remove and replace
with the right equipment, the proper
procedures. And Zephyrtronics has built
into the popular ZT-7 System so many
great features including effective
preheating of those lead-free solder
joints so as to make your job now much
easier to perform. |
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At the
left, you can
see the XBOX 360 printed circuit board populated
with its components including the critical GPU, CPU
and Memory Chip chips. And shown below is the XBOX
CPU component which is Ball Grid Array (BGA) styled
package (see the yellow highlighted sidebar for
further explanation). |
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Because BGA's such as the chip shown below have less metal
content than the old traditional components
with leads,
these chips are
far more sensitive
to high temperatures requiring that the PCB
be preheated before any rework can be
performed so as not to damage them during
your rework or repair. |
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Effective, PCB pre-heating is a critical
requirement for
success and quality soldering during rework
of the XBox 360
chips and boards. And this is where many systems
"repair stations" fail miserably
because they have ineffective IR preheating
below the PCB and therefore require
unacceptable higher final solder reflow
temperatures from above which permanently
damage the chip itself. And if the chip is
damaged, it then will have to be completely
removed, replaced and re-soldered. |
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XBox
360 GPU BGA
Shown Above |
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Even worse,
there are still other "repair stations" where the upper heat is so
ineffective, that the machines require that the entire PCB be heated
underneath to over 200°C for over twenty minutes! Worse, the manufacturers
of these "machines" advise the user to cover the chips with foil during the
process. Are they crazy? Of course, this nonsense would never be permitted
in any reputable PCB manufacturing or repair company. Never. |
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ZT-7 Benchtop System |
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The
ZT-7 is the
very same soldering system that was used by
NASA to place and solder the critical,
high-reliability I.C.'s on the two Mars
Rovers whose mission was so successful in
2003 and 2004.
Good enough for NASA and, yet
easy enough to repair an XBox 360 PCB! And
at a great price! Click here to learn more
detail about the
ZT-7 Hot Air Station. |
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Helpful Rework
Guide:
Zephyrtronics ships every ZT-7 with a
detailed and helpful owners manual along
with the 39-page report by NASA for its
employees which features approximately 300
photographs filled with technical tips and
techniques. In addition, for those reworking
and repairing XBox360® modules, Zephyrtronics
also includes a step-by-step illustrated
guide for removing and replacing the
components and even practice printed circuit
boards and chips!
A
Word of Warning from NASA About IR Rework
Systems:
"Hot
plates and infrared pre-heaters are not recommended...The
reason that they should not be used is that
the thermal reaction times, energy transfer
rates and efficiency are never consistent."
The Zephyrtronics ZT-7 System uses no IR
whatsoever, but the decades-long proven
industry standard of forced convection hot
air.
The
ZT-7 is
easy to operate and includes
closed-loop and digital, programmable temperature control,
plus digital countdown timing, bottom-side
pre-heating and thermal ramping to enhance
the quality of your work. Of course, the
ZT-7 is not limited to just working on XBox
PCB's, but is ideal for reworking laptops,
plasma television PCB's, prototyping tasks,
small production runs and rework/repair
of your SMT and BGA tasks.
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For more specifications, technical
information and product details regarding
our popular XBox or PlayStation repair
stations, click here
to see the full, webpage on the
ZT-7 Hot Air BGA & SMT Rework Center.
Also, feel free to call us at our factory in
Los Angeles County between 8:00 AM and 6:00
PM (Pacific Standard Time) Monday through Friday at (909) 865-2595
or e-mail us at
sales@ameritronics.com. We are
here and happy to help. |
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ZT-7-XBOX REWORK COMPREHENSIVE SYSTEM |
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Description
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Item |
Price |
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The
ZT-7-XBOX
System
Comprehensive BGA & SMT
Hot Air Bench Top
Reflow System
Includes:
The
ZT-7-MIL BGA & SMD
Hot Air Repair Center (shown above)
Plus
The
ZT-1-BGS-DPU
BigGrid™ AirBath Preheating System
The
ABC-1 Adjustable Board Cradle
The
ZLK-XBOX Benchtop Supply Kit
Note: The ZLK-XBOX Kit Includes the
ZeroFlex™ PC Board Brace
Plus All of the Following XBox Hot Air Nozzles:
ZT-7-3021 (31 X 31MM), ZT-7-3007 (35 X
35MM),
ZT-7-3082 (11 X 14MM) and
ZT-7-3005 (23 X 23MM)
Plus All the Essential XBox
Repair Supplies & Tools
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ZT-7-MIL
ZT-1-BGS-DPU
ABC-1
ZLK-XBOX
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$6,010
LIMITED
TIME
OFFER!
$4,995
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The
ZT-7-XBOX-ZF
System
Comprehensive BGA & SMT
Hot Air Bench Top
Reflow System
Includes:
The
ZT-7-MIL BGA & SMD
Hot Air Repair Center (shown above)
Plus
The
ZT-1-BGS-DPU
BigGrid™ AirBath Preheating System
The
ABC-XYZ Adjustable
Board Cradle
The
ZLK-XBOX Benchtop Supply Kit
Note: The ZLK-XBOX Kit Includes the
ZeroFlex™ PC Board Template
Plus All of the Following XBox Hot Air Nozzles:
ZT-7-3021 (31 X 31MM), ZT-7-3007 (35 X
35MM),
ZT-7-3082 (11 X 14MM) and
ZT-7-3005 (23 X 23MM)
Plus All the Essential XBox
Repair Supplies & Tools
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ZT-7-MIL
ZT-1-BGS-DPU
ABC-XYZ
ZLK-XBOX
|
$6,510
LIMITED
TIME
OFFER!
$5,495
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XBOX Zero Flex Template
Thick, Machined Metal Plate With
Reciprocal Studs for PCB Holes
Thick Metal Plate Prevents PC Board
Flexing During Rework
Openings Permit PCB Quicker & More
Uniform Preheat From Below
Works With
ABC-XYZ Board
Cradle
(Note: ZeroFlex™ Template is Included
In ZLK-XBOX Kit)
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ZT-7-ZF-XB |
$125 |
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©1996 - 2011, 2012 Ameritronics®. All rights reserved. The
information you receive online from Ameritronics® is protected by
the copyright laws of the United States. The copyright laws prohibit
any copying, redistributing, retransmitting, or repurposing of any
copyright-protected material. Ameritronics® is the registered
trademark property of JTI, Inc. "Zephyrtronics" and "Zephlux"
and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post
Cooling" and "PostCooler" and "AirBath" and "Quatro" and "Full Metal
Jacket" are the protected trademark property of JTI, Inc. |
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Click link below to return
to the top of the page |
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XBOX 360 System Header |
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SMD Rework,
SMT Rework
AirBath,
SMD Rework
Stations,
Hot Air
Pencil Soldering,
BGA Rework
Stations,
CSP Rework
Stations,
Preheating
Systems,
PCB
Preheaters,
Pre-Heat
SMT / SMD,
Low Temp Rework,
SMT
DeSoldering Tools,
Vacuum
Pickup Tools,
Circuit
Board Holders,
PCB
Fixtures,
Board
Cradles,
Rework
Solder Paste,
No-Clean
Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder
Wire,
Hot Air
Rework Stations,
Fume
Extractors,
SMT Dental
Probes,
SMT-SMD
Rework Kit,
BGA Rework
Kit,
LMK Kit,
BGA
Re-Balling Kit,
SMD
Tweezers,
Power Palm
Plunger
How To - SMT, CSP, BGA Rework
How To -
BGA Alignment:
How To -
SMT Rework:
How To - PCB Preheating,
How To -
BGA & CSP Rework:
How To -
Quickly Solder SMD Packages Effectively:
How To -
CSP Alignment;
How To -
Lead-Free Rework;
How To -
SMD Removal Economical;
How To -
SMD Removal Professional:
How To -
Hot Air Pencil / AirPencil Soldering;
How To -
SMD Quick Chip Removal;
How To -
BGA Re-Balling;
How To -
Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP:
How To -
Solder & Rework Ceramic Capacitors:
How To -
Solder & Rework Glass Diodes
Soldering,
De-Soldering
Soldering
Accessories,
Solder
Wire,
No-Clean
Solder Wire,
Eutectic
Solder Wire,
Solder Wire
Dispenser,
Solder
Paste,
Lead-Free
Solder Paste,
Flux,
Solder
Paste Dispensers,
LowMelt®
DeSolder Wire,
De-Solder
Wire,
Soldering
Irons,
Digital
Soldering Station,
Digital
De-Soldering,
MIL-Spec
Soldering Station:
ESD
Soldering Station,
Soldering
Tips,
Thru-Hole
DeSoldering Tools,
Desoldering
Tip,
Tips for
Desoldering,
De-Solder
Wick,
Smoke
Extractors,
Fume
Extractor Filters,
Carbon
Activated Filters,
SolderMill™,
Pre-Heating
Systems,
Preheat
Thru-Hole,
PCB
Pre-Heating,
Flux
Solvent,
How To - Connector Rework;
How To -
PC/104 Soldering and Rework;
How To -
Thru-Hole / Through Hole Desolder / De-Solder;
How To -
Low Melt® Desolder Wire;
How To-
Stop Lifting Pads;
How To-
Desolder / De-Solder Heavy Ground Planes;
How To -
Lead-Free Soldering and De-Soldering;
Preheaters
for Lead-Free Rework and Soldering
Dispensing
Dispensing
Systems,
Dispensing
Syringes,
Dispensing
Barrels,
Tapered
Tips,
Blunt
Needles,
Stainless
Steel Needles,
Dispensing
Needles,
Industrial
Needles,
Dispensing
Tips,
Dispensing
Accessories,
Solder
Paste in Syringe,
Lead-Free
Solder Paste in Syringe,
Paste Rack™
Solder Paste Holder,
Dispensing
Supplies,
Power Palm
Plunger,
Manual
Dispensing,
Automatic
Dispensing
Benchtop Accessories,
Bench Supplies,
Benchtop Tools
SMD Solder
Paste,
Lead-Free
Solder Paste,
Solder
Wire,
LowMelt®,
No-Clean
Flux,
BGA Flux,
Rework Tack
Flux,
Non-Flammable Flux Remover,
Inspection
Equipment,
Magnification Equipment,
Magnifying
Work Light,
ESD
Magnifier,
Pen Vac,
SMT
Tweezers,
Fume
Extraction,
SMD
Tweezers,
PC Board
Fixtures,
Hot Air
Tips,
AirTips,
Replacement
Soldering Sponges,
Iron Plated
Soldering Tips,
Art
Conservation Hot Air Tools,
Foam Swabs,
Anti-Static
Foam Swabs,
Thru-Hole
Brushes,
LMK Rework
Kits |
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