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PlayStation ® Repair: Your Solution for GPU, CPU, BGA, SMT & CSP Rework, Reflow, Repair & Reballing
PlayStation® Repair Made Easy
PlayStation Repair System
Soldering, De-Soldering & ReBalling the GPU, CPU on the PlayStation® Console Boards
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Understanding the GPU, CPU, Memory Chips
and Ball Grid Arrays (BGA's):
Q: What are
these chip packages that Microsoft®
and Sony®
call the GPU, the CPU, and the Memory
Chips? And why do they look so different
from other components?
A: These are electronic chips that are
packaged in what are called Ball Grid
Array formats (BGA's). They are a
relatively new form of Surface Mount
Devices (SMD) and are similar to other
components in that they have an
integrated circuit (die) within the
package and that they have connections
to be soldered. However, instead of
leads at the side of the chip, the
connections are balls underneath the
chip (See Below):
Above Left: Bottom Side of a QFP Surface
Mount Chip with the leads at the side
for soldering to the PCB.
Above Right: Bottom Side of a Ball Grid
Array (BGA) Chip with solder spheres
(balls) at the bottom for soldering to
the PCB.
Many of the chips on the XBOX 360® and
PlayStation® Printed Circuit Boards are
packaged in the BGA format shown above
including the GPU, CPU and Memory Chips.
Indeed, most consumer electronic PCB's
today incorporate more and more BGA
style chips as they are more robust in
construction and have faster gate speed
for processing.
Once the BGA is placed and soldered onto
the PCB, you can no longer "see" the
connections (balls) as they are
underneath the chip and no longer
visible to the eye.
Finally, the XBOX and PlayStation® PCB's
components are all soldered to the pads
with lead-free solder, not the
traditional solder that everyone is
familiar with. Lead-free solder requires
higher than traditional temperatures
which makes preheating the PCB
imperative.
Good News! Believe it or not, BGA's are
surprisingly easy to remove and replace
with the right equipment, the proper
procedures. And Zephyrtronics has built
into the popular ZT-7 System so many
great features including effective
preheating of those lead-free solder
joints so as to make your job now much
easier to perform.
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Repairing
the wildly popular Sony®
PlayStation®
printed circuit board (PCB) is now
easier than ever with the
ZT-7 Soldering
Benchtop System.
The ZT-7 System makes either 1.) just
re-soldering chips; or 2.) de-soldering
and removing a GPU, CPU or Memory Chips
and then replacing and re-soldering them
back to the PCB.
The ZT-7 is affordable, has 15 years of
proven performance, is made in the U.S.
with a 2-year limited warranty.
Don't be fooled by IR systems that
might repair the PCB temporarily, but
can actually do more harm than good to
the board and chips. You want complete
reflow of the entire ball of solder
(inside and outside) on every
connection, and not what is called
"tangential reflow" that will reopen
when the board flexes, especially when
the XBox® is being used again.
Video Comparisons
& Demonstrations: 4 Methods of
Preheating & Solder Reflow
illustrates the advantages of forced
convection and why it is the PCB
industry standard worldwide. |
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PCB Fixtures Must Be Independent
from both lower preheaters and from
upper reflow heaters.
If
one is repairing a lot of PCB's, speed
is important. Waiting for big PCB's
(XBox 360) to preheat and later to cool
down for a long time before moving on to
another PCB wastes time, money and
profit.
An
Independent PCB Holding Fixture
is simply essential for reworking PCB.
Save time and money. Learn why:
Video: The ABC's
of PCB Holding Fixtures. By
the way, the ZT-7 System is equally
effective for repairing the
XBox 360.
Below is a
PlayStation®
PCB populated with large GPU and CPU
chips with metal tops and lead-free
solder balls that require effective,
forced convection (hot air) preheat to
achieve proper soldering of all balls
and pads under the chips.
Not Just for Game Consoles, the
ZT-7 can be a moneymaker for repairing
smartphones, tablets, laptops, plasma
TV's, lab prototyping and rework/repair. |
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At
left is one of the two large
processors used on the PlayStation®.
The high metal content on top of the
chip makes it very difficult to
remove, reball, replace and
re-solder without damaging the chip.
It is imperative that both the PCB
and chip are carefully preheated
first, preferably with hot air, so
soldering is not made at excessively
high temps. Preheat temps should
never exceed 170°C.
This is where IR systems fail. |
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One of the PlayStation®
BGA's Shown Above |
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Beware! Some "repair stations" have very
ineffective upper heaters requiring the entire
PCB be preheated underneath to over 200°C for
over twenty minutes! Worse, the
manufacturers of these "machines" advise users
to cover chips with foil when using them. Are
they crazy? This nonsense is prohibited by
reputable PCB labs and repair companies.
PCB
repair done on the cheap or with high
temperatures will fail, if not immediately, not
long afterwards. Semiconductors begin to degrade
at 260°C and they degrade permanently.
Helpful Rework
Guide:
Good enough for NASA and easy enough for
PlayStation®
repair! Click for more details on the
ZT-7 Hot Air Station.
Each ZT-7 ships with a helpful, detailed owners
manual plus a 39-page report by NASA with nearly
300 photographs filled with technical tips and
techniques, and a step-by-step illustrated
process guide. Easy to operate with
digital closed-loop programmable (31 storable
profiles) temperature control, digital countdown
timing, bottom-side preheat and thermal ramping
for high quality. |
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Used by NASA to place and solde
high-reliability I.C.'s on the two successful
Mars Rovers and Curiosity missions, the
ZT-7 is used by
Fortune 500 electronic campuses around the world
since 1998.Why is this important? Because our
so-called competitors have introduced machine
after machine only to obsolete them and then
re-introduce another machine leaving their poor
customers without service or replacement parts!
The ZT-7, on
the market for 16 years has a 2-year limited
warranty.
A
Warning from NASA About IR Rework Systems:
"Hot
plates and infrared pre-heaters are not
recommended...The reason that they should
not be used is that the thermal reaction times,
energy transfer rates and efficiency are never
consistent."
For more specs, technical info and product
details about our popular XBox® or PlayStation®
hot air repair stations, click the full webpage
for the
ZT-7 Hot Air BGA & SMT PCB
Center. Or call us at
our Los Angeles factory Mon-Fri 8-6PM (Pacific)
at (909) 865-2595 or e-mail
sales@ameritronics.com.
Let us help. |
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ZT-7-PSR REWORK COMPREHENSIVE SYSTEM
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Description
|
Item |
Price |
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The
ZT-7-PSR
System
Comprehensive BGA &
SMT
Hot Air Bench Top
Reflow
System
Includes:
The
ZT-7-MIL (shown above)
and
The
ZT-1-BGS-DPU
AirBath
The
ABC-1 Adjustable
Board Cradle
ZT-7-PSK Benchtop
Supply Kit Includes the
42.5mm X 42.5mm BGA Nozzle for the GPU &
CPU and Your Soldering & DeSoldering
Supplies
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ZT-7-MIL
ZT-1-BGS-DPU
ABC-1
ZLK-PS
|
$5,950
LIMITED
TIME
OFFER!
$4,905
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The
ZT-7-PSR-ZF
System
Comprehensive BGA & SMT
Hot Air Bench Top
Reflow System
Includes:
The ZT-7-MIL (shown
above)
and
The
ZT-1-BGS-DPU
AirBath
The
ABC-XYZ Adjustable
Board Cradle
ZT-7-PSK Benchtop
Supply Kit Includes the
42.5mm X 42.5mm BGA Nozzle for the GPU &
CPU and Your Soldering & DeSoldering
Supplies
|
ZT-7-MIL
ZT-1-BGS-DPU
ABC-1
ZLK-PS
|
$6,300
LIMITED
TIME
OFFER!
$5,285
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Playstation ZeroFlex™ Template
Thick, Machined Metal Plate With
Reciprocal Studs for PCB Holes
Thick Metal Plate Prevents PC Board
Flexing During Rework
Openings Permit PCB Quicker & More
Uniform Preheat From Below
Works With
ABC-XYZ Board
Cradle
(Note: ZeroFlex™ Template is Included
In ZT-7-PSK Kit)
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ZT-7-ZF-PS |
$125
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©1996 - 2011, 2012, 2013, 2014 Ameritronics®. All rights reserved. The
information you receive online from Ameritronics® is protected by
the copyright laws of the United States. The copyright laws prohibit
any copying, redistributing, retransmitting, or repurposing of any
copyright-protected material. Ameritronics® is the registered
trademark property of JTI, Inc. "Zephyrtronics" and "Zephlux"
and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post
Cooling" and "PostCooler" and "AirBath" and "Quatro" and "Full Metal
Jacket" are the protected trademark property of JTI, Inc.
Revised for
November 21, 2016 |
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PCB,
SMD, BGA Rework & Prototyping
AirBath,
SMD Rework
Stations,
Hot Air
Pencil Soldering,
BGA Rework
Stations,
CSP Rework
Stations,
Preheating
Systems,
PCB
Preheaters,
Pre-Heat
SMT / SMD,
Low Temp Rework,
SMT
DeSoldering Tools,
Vacuum
Pickup Tools,
Circuit
Board Holders,
PCB
Fixtures,
Board
Cradles,
Rework
Solder Paste,
No-Clean
Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder
Wire,
Hot Air
Rework Stations,
Fume
Extractors,
SMT Dental
Probes,
SMT-SMD
Rework Kit,
BGA Rework
Kit,
LMK Kit,
BGA
Re-Balling Kit,
SMD
Tweezers,
Power Palm
Plunger
How To Work With SMD's, CSP's, BGA's &
QFN's
How To -
BGA Alignment:
How To -
SMT Rework:
How To - PCB Preheating,
How To -
BGA & CSP Rework:
How To -
Quickly Solder SMD Packages Effectively:
How To -
CSP Alignment;
How To -
Lead-Free Rework;
How To -
SMD Removal Economical;
How To -
SMD Removal Professional:
How To -
Hot Air Pencil / AirPencil Soldering;
How To -
SMD Quick Chip Removal;
How To -
BGA Re-Balling;
How To -
Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP:
How To -
Solder & Rework Ceramic Capacitors:
How To -
Solder & Rework Glass Diodes
PCB
Soldering,
De-Soldering
Soldering
Accessories,
Solder
Wire,
No-Clean
Solder Wire,
Soldering Wire
Dispenser,
Solder
Paste,
Lead-Free
Solder Paste,
Flux,
Solder
Paste Dispensers,
LowMelt®
DeSolder Wire,
De-Solder
Wire,
Soldering
Irons,
Digital
De-Soldering,
Soldering
Tips,
Thru-Hole
DeSoldering Tools,
Desoldering
Tip,
Tips for
Desoldering,
De-Solder
Wick,
Smoke
Extractors,
Fume
Extractor Filters,
Carbon
Activated Filters,
SolderMill™,
Pre-Heating Systems,
Preheat
Thru-Hole,
PCB
Pre-Heating,
Flux
Solvent,
How To - Connector Rework;
How To -
PC/104 Soldering and Rework;
How To -
Thru-Hole / Through Hole Desolder / De-Solder;
How To -
Low Melt® Desolder Wire;
How To-
Stop Lifting Pads;
How To-
Desolder / De-Solder Heavy Ground Planes;
How To -
Lead-Free Soldering and De-Soldering;
Preheaters
for Lead-Free Rework and Soldering
Dispensing, Solder Paste, Liquids & Fluids
Dispensing
Systems,
Dispensing
Syringes,
Dispensing
Barrels,
Tapered
Tips,
Blunt
Needles,
Stainless
Steel Needles,
Dispensing
Needles,
Industrial
Needles,
Dispensing
Tips,
Dispensing
Accessories,
Solder
Paste in Syringe,
Lead-Free
Solder Paste in Syringe,
Paste Rack™
Solder Paste Holder,
Dispensing
Supplies,
Power Palm
Plunger,
Manual
Dispensing,
Automatic
Dispensing
Laboratory &
Bench Supplies & Tools
SMD Solder
Paste,
Lead-Free
Solder Paste,
Solder
Wire,
LowMelt®,
No-Clean
Flux,
BGA Flux,
Rework Tack
Flux,
Non-Flammable Flux Remover,
Inspection
Equipment,
Magnification Equipment,
Magnifying
Work Light,
ESD
Magnifier,
Pen Vac,
SMT
Tweezers,
Fume
Extraction,
SMD
Tweezers,
PC Board
Fixtures,
Hot Air
Tips,
AirTips,
Replacement
Soldering Sponges,
Iron Plated
Soldering Tips,
Art
Conservation Hot Air Tools,
Foam Swabs,
Anti-Static
Foam Swabs,
Thru-Hole
Brushes,
LMK Rework
Kits |
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