BIG PCB PREHEATER? IT'S THE BIG GRID™
Bottom-Side Forced Convection PCB PreheatThru-Hole, SMD, QFN & BGA Rework & Repair

 

16 Sq. Inch Preheating Grid (110 sq. cm) & 1,500 Watt Power, 50 CFM Air Supply (1,415 Liters/Minute)

  The Zephyrtronics' AirBath “bathes the circuit board in warm air to reduce thermal stresses
to the board and its components.”-- NASA Report, January 9, 2004
 

Powerful bottom-side preheat, smd, bga, hot air preheater, smt rework

The  BigGrid
AirBath (Shown Above) Was Used By NASA & JPL for Processing PCB's on the Successful Mars Rovers Program.

 

The BigGrid AirBath has a very large 16-square inch (110 sq. cm) pre-heating grid, 1,500 watts of power and 50 CFM (1,415 liters per minute) of air supply for PCB preheating and cooling at the bench. With over 15 years on the market with an impeccable pedigree, this is the same BigGrid AirBath used by NASA and JPL for dependable preheating during the Mars Rover programs.

The BigGrid is manufactured in the U.S.A and has and has a one-year limited warranty. Powerful and so effective for large PCB's, high copper content substrates, heat-sinks, large ground planes.

Beware of imitative pre-heaters with less than 10CFM (276 liters/minute). They are ineffective and compensate by higher temp settings, but the glass transition for FR-4 PCB's is only 170°C. Higher preheat temps are not the solution, but greater volume of forced convection is.

 


Loaded With Premium Features:
The BigGrid gets into all the nooks and crannies of the PCB assembly where hot plates and IR pre-heaters can't go (more below).  It is ESD-safe; features illuminated indicator lights (blue: cooling; red: preheating); it is self-contained with an internal air supply (no hookups); all inside a  durable, steel housing for industrial use.

Critical Thermal Ramping: The BigGrid has the the critically important industry standard, built-in temperature ramping of 2° to 4°C per second preventing thermal shock to sensitive chips, delicate ceramic caps and glass diodes. The ramp is "built in" by design into every Zephyrtronics AirBath™ Preheating System. Beware of other "preheating devices" where temp ramping is not controlled and too fast.

For Thru-Hole, SMT & BGA Preheat Tasks: The BigGrid AirBath is ideal for all PCB tasks from low-volume prototype/design builds to rework and repair for all chip packages like BGA, CSP, QFP, QFN, TSOP, PLCC, SOIC, SOL, LCC, Flip Chip and Glob Top. And it easily handles all substrates including FR-4, polyimide, composites, flex circuits and ceramic boards.

   

ZT-1-BGS BIG-GRID™ DIGITAL AIRBATH

Description

Model

Price

Buy

BGS-AIRBATH-SMALL

BIG-GRID
 DIGITAL
AIRBATH
 50 CFM Air Power
(1,415 Liter/Min)
1,500 Watt Power

 

ZT-1-BGS-DPU-120
(120 Volt for the U.S., Canada & Mexico)

$1,985

ZT-1-BGS-DPU-230
(230 Volt For All
Int'l Customers)

$1,985

BGS mil SMALL02

BIG-GRID
 ANALOG
AIRBATH
 50 CFM Air Power
(1,415 Liter/Min)
1,500 Watt Power

 

ZT-1-BGS-MIL-120
(120 Volt for the U.S., Canada & Mexico)

$1,850

ZT-1-BGS-MIL-230
(230 Volt For All
Int'l Customers)

$1,850
     
   

* We manufacture many other sizes of AirBaths.  Please note that the BigGrid™ is one of our larger AirBath Preheaters and may be too big for your applications. Check out our entire AirBath Preheat Directory where we are certain we have an AirBath Preheater tailored to your company's PCB needs.

   

ABC SERIES OF ADJUSTABLE BOARD CRADLES

Description

Model

Price

Buy

pcb holding fixture ADJUSTABLE BOARD CRADLE
3-RAIL (10” X 18” MAX)
ABC-1 $265
ADJUSTABLE BOARD CRADLE
3-RAIL (20” X 18” MAX)
ABC-2 $315
pcb holder ADJUSTABLE BOARD CRADLE
QUATRO (10” X 18” MAX)
ABC-1-Q $325
ADJUSTABLE BOARD CRADLE
QUATRO (20” X 18” MAX)
ABC-2-Q $375
     
 

The Many Benefits of Preheating Your PCB: The benefits from preheating are multiple and compounding. 1.) Preheating or "soaking" the assembly prior to initiating reflow helps to activate the flux, removing oxides and surface films from the leads and pads to be soldered, thereby enhancing the wetting process and solder joint quality.  2.) Preheating the board permits lower soldering reflow temperatures.  3.) Preheating reduces the final "dwell time" during the final reflow stage.  4.) Preheating reduces thermal stresses to the PCB substrate and its components when localized reflow is made with soldering irons, de-soldering tools and hot air systems. 5.) Preheating provides the thermal boost needed when working with RoHS lead-free solders without damaging the work!

Two BigGrid AirBath Models: Our BigGrid AirBath is available in two models: analog and digital. Both models feature variable temperature selection between ambient (room temp) and up to 205°C. Both models feature closed-loop feedback temperature sensing control. The analog model has a dial for temp selection on the front panel. The digital model incorporates a digital set/read lighted display that permits single digit/degree incremental temperature selection in the "set" mode and tracks real time temperature at the air exit point above the grids.

   

Your Lead-Free Solution: Working with the newer lead-free, RoHS compliant solder alloys --- all having higher melting points --- makes preheating more essential to any PCB work at the bench. Don't raise temperatures higher on your soldering irons, desoldering tools, hot air nozzles, thermal tweezers, or hot air pencils! If you just briefly preheat the bottom  of your PCB before reflow, can perform your soldering or desoldering on the top side of the board at traditional, lower temperatures.

About the RoHS Lead-Free Solder Mandate: Learn more here about the European Lead-Free Mandate & Preheating. Zephyrtronics AirBath™ preheating systems are your Lead-Free, RoHS soldering solutions radically reducing the elevated solder reflow temps that without preheat are needed with lead-free alloys.

     
  All Preheaters Are Not Created Equally:
Here are a few of the helpful applications and utilities of the ZT-1-BigGrid AirBath
     

1.  Achieve High-End Superb Thermal Profiles at the Bench with the required industry standard 2°-4°C ramping to preheat!  The 2°-4°C ramp is "built in" to every BigGrid AirBath and prevents thermal shock of ceramic capacitors, glass diodes and temperature sensitive components, plus ramping helps prevent "pop-corning" of moisture within I.C.'s. Importantly, preheating allows flux activation and the ability to work at lower temps on the  topside of the PCB with your soldering tools. Effective preheating prevents scorching substrates, damaging pads and components during rework or prototyping.

2.  A New Rework Paradigm:   Another benefit of preheating is that it allows you the option to remove your SMD's below 150°C with only the BigGrid AirBath and  our LOWMELT® De-Solder through the proven process of co-metalization. No nozzles! No lifting pads! No more burning PCB's! Your BigGrid BigGrid puts this option for rework at your fingertips even if you think you'd never need it..

3.  Non-Contact Hot Air Soldering: One of the more popular benefits of the BigGrid AirBath is that you can now also use solder "paste" -- as well as solder wire --- as is used in high volume soldering production with a Hot AirPencil just your BigGrid. This is a 100% non-contact (NASA calls it "non-touch") method of soldering at the bench and is, without a doubt, the closest mirror to conveyor oven reflow yielding showcase solder joints complete with fillets at both the toe and the heel of the component, but preheating is mandatory.

4. Thru-Hole Rework: Heavy ground planes? High copper content? Big heat sinks? No problem! Your BigGrid makes desoldering thru-hole chips a breeze! Place your PCB over the AirBath, turn down temp settings on your desoldering tools and stop lifting pads. This is your preheat boost! You'll never de-solder thru-hole without preheat again.

5. BGA Pad Redressing: Stop using desoldering wick and soldering irons to clean up after removing BGA's during rework. Stop lifting those delicate BGA pads!  Simply preheat your PCB with the AirBath, add flux and LOWMELT® and swab your pads back to new. Works on both the PCB's array of pads and the BGA's pads.

6.  BGA, CSP Soldering & DeSoldering.  The BigGrid AirBath is also a modular component to to our comprehensive  ZT-7-ML BGA HOT AIR REFLOW SYSTEM. So even if you are not yet working with BGA's, should you do so in the future, your Mega-Grid  will already have you half the way there! Because, the your BigGrid has all the essential features for BGA processing incorporated in its design: industry standard ramp rate to preheat; "post-cooling" for rapid cool-down which is critical to the BGA reflow process; a large and generous preheating grid with a powerful 50 CFM (1,415 liters/minute) of preheat power which allows a lower final reflow temperature from your nozzles above.

Digital Illuminated Temperature Display:
The ZT-1-BGS-DPU, features all of the award winning attributes of the our popular analog AirBath and takes process control one step further...full digital, variable temperature control. A convenient microprocessor control permits variable temperature selection with an easy-to-use "set/read" digital display function.

    BGS-1x   BGS-2
   

Preheating PCB at Benchtop  Mimics High Quality Thermal Profiles on Production Floor

 

Remove Chip Quickly at Less Than 150°C with  AirBath & LOWMELT® "Never Lift A Pad"

             
    BGS-3   BGS-4
   

100% Non Contact , SMT Hot Air Solder Reflow With the AirBath and a  Hot AirPencil. Yields Highest Quality  Joints.

 

Thru-Hole  Desoldering Made Easier & At Lower Temps With The AirBath Preheat Heavy Ground Planes? No Problem!

             
    BGS-5  

BGS-6

     

 The BigGrid & LOWMELT® Are  Ideal for BGA Pad Redressing Below 150°C Without Wick or a Solder Iron.

 

The  BigGrid Works Perfectly with the
 
ZT-7-MIL BGA, CSP, SMT &  Thru-Hole Hot Air Reflow Center.

     



Our Digital Model Features
Lighted Temp Display With
 Temp Set & Read Functions

Comparing The 4 Methods of Preheating:

Pre-heating PCB assemblies falls into four categories: Use of hot plates, use of ovens, IR systems, and the use of forced convection (warm air) under the PCB:
The short video at the right breaks down these four methods with video comparative demonstrations. While any preheating of your PCB prior to solder reflow is certainly better than none, an objective analysis of the various methods of preheating quickly reveals that all preheating methods are not equally effective or beneficial:

1.) The Oven:
Using ovens to pre-heat the substrate before reworking and initiating solder reflow for either removal and/or replacement of components can yield the most uniform temperature profile as it warms both the top and bottom of the PCB assembly as ovens also do in high volume production equipment such as conveyor ovens and wave solder machines. It's just a little problematic to crawl inside an oven with your PCB to preheat while you perform selective soldering or desoldering tasks on one side of the board. Of course, one could preheat a PCB within an oven, and then afterward, rush it back to your bench, but it's hardly practical solution either.

 

2.) The Hot Plate: The obvious limitation to the hot plate is that not all PCB assemblies are single sided. In fact, in today's world of hybrid and mixed technologies, the PCB that is entirely flat or plane on one side is an exotic and rare creature indeed. PCB's typically can carry heat sinks, connectors, jumpers and transformers on both sides of the substrate. These uneven surfaces on the board present an indirect path of heat conduction from the hot plate to the board assembly.

3.) The IR Preheater: There are many drawbacks to infrared which is why it has really never completely caught on.  Some of drawbacks which have been enumerated in articles in SMT Magazine, Circuits Assembly and in white papers at electronic conventions are the difficulty in ramping temps (some are better than others); shadowing caused by high profile components on PCB's; and if the IR preheat grid is very large it can make working on small PCB's very uncomfortable for the technician (this is a very common complaint). Still another great disadvantage to IR preheaters is that they can not ever truly be "temperature controlled" without the technician having to always pre-assemble an external thermocouple into every board before working on it. And that's a continuous hassle and headache replete with quality pitfalls and problems with inconsistent results. There are more, but these are some of the key setbacks.


NASA & JPL: 'IR Preheaters Are Risky':
Addressing the critical preheating process during rework of plastic and other heat sensitive components in their 49-page published report, two JPL engineers, Dr. Rajenshuni Ramesham and Dr. R. David Gerke, wrote "Hot plates and infrared preheaters are not recommended for this type of rework. The reason that they should not be used is that the thermal reaction times, energy transfer rates and efficiency are never consistent. However, they can be used for large metal and ground-plane boards in limited applications, e.g., where the size of the board matches that of the preheater in area." Continuing and also citing the late William Scheu, the authors pointed out the superiority of preheating by bottom-side forced convection systems. Moreover, the NASA Survey by JPL spotlighted still more of the deficiencies of IR preheating devices: "They have little capacity to ramp and soak to perform properly engineered repair scenarios or to support the creation and application of complicated thermal profiles. They also are limited in their ability to preheat beyond the physical dimensions of the heating surface. Hot-air preheating can be ramped, soaked and, on some systems, synchronized with the reflow process, permitting duplication of the actual profile used in manufacturing the assemblies. BGAs and photoelectrical parts are sensitive to higher temperatures and any attempt to preheat with marginally controllable sources is risky." ---' NASA & JPL: Survey of Rework Methods & Equipment for Various Packaging Technologies." -- August 2005.

4.) Superior, Forced Convection Preheat, The AirBath:  The market has long spoken with regards to the distinct advantages and superiority of a warm air bath in the pre-heating process. Forced convection completely disregards the topography (or bottomography) of the PCB, allowing immediate, direct access of the warm air into all of the nooks and crannies of the PCB assembly. And much like the newer, popular forced convection commercial ovens, the circulating warmed air is far more effective than static warm air.

 
 

"Hot air is more versatile than a hot plate due to the non-uniform parts on the bottom of the board." -- Glen Dody,  Manager Motorola's SMT Lab National Journal of SMT, 1996

nozzle_theta_copy

Post-Cooling™ By The AirBath™:  Further, an another clear advantage of a Zephyrtronics AirBath™ is that with the flip of a switch the unit immediately becomes a post-cooler™ cooling down your PCB and its components and most importantly, your solder joints. Post-Cooling™ is essential to any soldering of BGA's because hot air nozzles must not be lifted from above the BGA until all the balled joints have cooled so as not to cause unwanted bridging. It's important to point out the obvious: hot plates, static ovens and IR plates do not provide the critical post-cooling™ feature standard on every Zephyrtronics AirBath™. Again, our engineers introduced the concept of post-cooling™ to the benchtop clear back in 1994.

Typically, our AirBaths™ can cool BGA's after reflow within only 8 second permitting the hot air nozzle to be lifted without fear of bridging. Without post-cooling™ the technician has to wait for the ball/pad interface to solidify completely before lifting the nozzle to inspect or to move on to another chip. The Post-Cooling™ feature remedies this problem allowing rapid lifting of your hot air nozzles from over the BGA after soldering.

 

The AirBath™ Cools Down Within 8 Seconds Allowing Quicker Lifting Hot Air Nozzles Preventing Bridging.

 

Zephyrtronics Led and Leads the World in Preheating PCB's: Judged "Best New Product of the Year" and winner of the prestigious "Vision Award" at the Surface Mount International Expo in Silicon Valley in 1996 for its milestone contribution to the global production of printed circuit cards , Zephyrtronics' AirBath was recognized and spotlighted by SMT Magazine in 1997 as a "safer and simpler method for removing and repairing sensitive devices."

True, our AirBaths have inspired a lot of cheesy imitations which are little more than hair dryers in a box, but that aside, we are still the original pioneers and understand the thermodynamics of preheating better than anyone else.  Our AirBaths are the intelligent solution to stop burning up your printed circuit board assemblies by preventing thermal degradation, thermal  shock, lifting pads & traces, substrate delamination, measling and warping of your boards.

I
t is no wonder that for over fifteen years now, these Zephyrtronics AirBaths have become the pre-heater of choice of nearly every major aerospace and semiconductor manufacturer. It truly is the one single tool that belongs on every bench.  This is the "Science of Zephyrtronics."  We have an AirBath for you.

 
     
 

The BigGrid™ AirBath, One of Our Larger, More Powerful AirBaths™ is Surprisingly Compact in Size& Delivers 50CFM (1,415 Liters/Minute) & 1,500 Watts of Preheat Power

     

Fully MIL-Spec Compliant and Approved for Space Applications!

 

TECHNICAL DATA & SPECS

  Models:
  ZT-1-BGS-DPU-120:
120 VAC (U.S., Canada & Mexico) Digital Model
  ZT-1-BGS-DPU-230:
230 VAC International Digital Mode
  ZT-1-BGS-MIL-120:  120 VAC (U.S., Canada & Mexico) Analog Model
  ZT-1-BGS-MIL-230:
 230 VAC International Analog Model

  Other: (All Models)
  Power:  1,500 Watts
  Electrical Construction:  3-Wire Input with Earth Safety Ground

 
 W x H x D:
  12" x 4.5" x 7.2" (30 cm x 11 cm x 18 cm)
  Weight:   5.3 lbs (2.41 Kg)
  Air Volume:   50CFM or 1,415 Liters per Minute
  Preheating & Cooling Air Grid:   16 sq. inches (110 Sq. Cm)
  Temperature Modes:   Preheating & Cooling
  Preheat Temp Range: Ambient (Room Temp) to 205°C (400°F)

 
Preheat Ramp Rate:   2-4° C per second
 
Cooling Temp:  Ambient (Room Temp)
  Temperature Stability:  
± 3°C (± 5 °F) at Idle.
  Absolute Temperature Stability:  
Meets or Exceeds ANSI-J-STD
  Air Supply:  Self-Contained Internal Supply (No Air Hookups)
  Construction:   All Metal ESD Safe Construction
 
Warranty All One Year Limited Warranty Parts & Labor
 
Recommended:  
Use With ABC Series of Board Cradles / Fixtures

 

FEATURES & BENEFITS


Our BigGrid™ AirBath Was Used by NASA on Both Mars Rovers
Prevents Thermal Shock of Components
Permits Lower Soldering & DeSoldering Reflow Temperatures
Ideal for the Heaviest PCB's & Lead-Free Applications
Helps Prevent Warping Substrates & Damaging Pads
Superior Forced Convection Preheating
1,500 Watts of Preheat Power
16 Square Inch (110 sq. cm) Preheat Grid
Powerful 50 CFM (1,415 Liters/Minute
) Air Volume
Digital & Analog Models
Preheating Mode With Red Lighted Indicator
Preheating Mode: Ambient (Room Temp) to 205°C
Post-Cooling™ Mode with Blue Lighted Indicator
Preheating Ramp Rate at Industry Standard 2°-4°C Per Second
Self-Contained (No Air Hook-Ups Required)
Small, Compact Construction Respects Benchtop Space
ESD Safe
One Year Limited Warranty Parts & Labor

Every Unit is Individually Calibrated at the Zephyrtronics Factory
 

ZT-1-BGS BIG-GRID™ DIGITAL AIRBATH PREHEATER

Description

Model

Price

Buy Now

BGS-AIRBATH-SMALL

BIG-GRID
 DIGITAL
AIRBATH
 50 CFM Air Power
(1,415 Liter/Min)
1,500 Watt Power

 

ZT-1-BGS-DPU-120
(120 Volt for the U.S., Canada & Mexico)

$1,985

ZT-1-BGS-DPU-230
(230 Volt For All
Int'l Customers)

$1,985

BGS mil SMALL02

BIG-GRID
 ANALOG
AIRBATH
 50 CFM Air Power
(1,415 Liter/Min)
1,500 Watt Power

 

ZT-1-BGS-MIL-120
(120 Volt for the U.S., Canada & Mexico)

$1,850

ZT-1-BGS-MIL-230
(230 Volt For All
Int'l Customers)

$1,850
  * We manufacture many other sizes of AirBaths.  Please note that the BigGrid™ is one of our larger AirBath Preheaters and may be too big for your applications. Please check out our entire AirBath Catalog Directory where we are certain that we have an AirBath Preheater tailored to your company's PCB needs.
 

ABC SERIES OF ADJUSTABLE BOARD CRADLES

Description

Model

Price

Buy Now

pcb holding fixture ADJUSTABLE BOARD CRADLE
3-RAIL (10” X 18” MAX)
ABC-1 $265
ADJUSTABLE BOARD CRADLE
3-RAIL (20” X 18” MAX)
ABC-2 $315
pcb holder ADJUSTABLE BOARD CRADLE
QUATRO (10” X 18” MAX)
ABC-1-Q $325
ADJUSTABLE BOARD CRADLE
QUATRO (20” X 18” MAX)
ABC-2-Q $375
 
OPTIONAL ACCESSORIES

Description

Model

Price

Buy Now

EXTRA/REPLACEMENT POSTS (SET OF 4)
2-POST AND 8-POST POSITIONING
(8 POSTS ALLOW PCB INSIDE OF ABC TO BE FLIPPED UP & DOWN DURING THRU-HOLE DESOLDERING)

ABC-LG

$49.85

“Z” HEIGHT ADJUSTMENT POSTS
 (SET OF 4)

ABC-ZP

$100.00

©1996 - 2011, 2012, 2013, 2014 Ameritronics®. All rights reserved. The information and all images you receive online from Ameritronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Ameritronics® is the registered trademark property of JTI, Inc. "Zephyrtronics" and  "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" and "PostCooler" and "AirBath" and "Quatro" and "Full Metal Jacket" are the protected trademark property of JTI, Inc.

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ZT-1-BGS BIG-GRID™ PRE-HEATER AIRBATH

PCB, SMD, BGA Rework & Prototyping
AirBath, SMD Rework Stations, Hot Air Pencil Soldering, BGA Rework Stations, CSP Rework Stations, Preheating Systems, PCB Preheaters, Pre-Heat SMT / SMD, Low Temp Rework, SMT DeSoldering Tools, Vacuum Pickup Tools, Circuit Board Holders, PCB Fixtures, Board Cradles, Rework Solder Paste,  No-Clean Solder Paste, Low Melt® De-Solder Wire, DeSolder Wire, Hot Air Rework Stations, Fume Extractors, SMT Dental Probes, SMT-SMD Rework Kit, BGA Rework Kit, LMK Kit, BGA Re-Balling Kit, SMD Tweezers, Power Palm Plunger

How To Work With SMD's, CSP's, BGA's & QFN's
How To - BGA Alignment: How To - SMT Rework: How To - PCB Preheating, How To - BGA  & CSP Rework: How To - Quickly Solder SMD Packages Effectively: How To - CSP Alignment; How To - Lead-Free Rework; How To - SMD Removal Economical; How To - SMD Removal Professional: How To - Hot Air Pencil / AirPencil Soldering; How To - SMD Quick Chip Removal; How To - BGA Re-Balling; How To - Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP: How To - Solder & Rework Ceramic Capacitors: How To - Solder & Rework Glass Diodes

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SMD Solder Paste, Lead-Free Solder Paste, Solder Wire, LowMelt®, No-Clean Flux, BGA Flux, Rework Tack Flux, Non-Flammable Flux Remover, Inspection Equipment, Magnification Equipment, Magnifying Work Light, ESD Magnifier, Pen Vac, SMT Tweezers, Fume Extraction, SMD Tweezers, PC Board Fixtures, Hot Air Tips, AirTips, Replacement Soldering Sponges, Iron Plated Soldering Tips, Art Conservation Hot Air Tools, Foam Swabs, Anti-Static Foam Swabs, Thru-Hole Brushes, LMK Rework Kits