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EXTRA LARGE PREHEATING GRID: 16 Sq. In (110 Sq.
cm) |
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ZT-1-BGS
BIG-GRID™
PRE-HEATER
AIRBATH
Bottom-Side Convection Pre-Heating for PCB, Through-Hole,
SMD, SMT,
QFN & BGA Rework and Repair |
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Order
Securely
On-Line. |
Order
Securely
On-Line. |
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WITH 1,500 WATT POWER, 50 CFM AIR SUPPLY (1,415
Liters/Minute) |
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The
Zephyrtronics' AirBath “bathes the circuit board in warm air to
reduce thermal stresses to the board and its components.”-- NASA
Report, January 9, 2004 |
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The
ZT-1-BGS-DPU
BigGrid™
AirBath
features an ample 16-square inch (110 sq.
cm) pre-heating grid with 1,500 watts of power and 50 CFM
(1,415 liters per minute) of air supply of pre-heating and cooling
at the bench. This is our second largest AirBath™ and was first
introduced in 1998 by Zephyrtronics, the recognized pioneer and
world leader in
PCB pre-heating technology
for the benchtop.
Indeed, this is the
very same
BigGrid™
AirBath
used by NASA and JPL for dependable
preheating of the PCB's on the two Mars Rovers that were so
successful on the Red Planet!
The
BigGrid™
AirBath, manufactured in our state-of-art factory in
California,
is available to all our customers around the world with large PCB's in size or with high copper content, heat-sinks, large ground
or back planes. What a workhorse! |
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The BigGrid™
AirBath (Shown Above)
Was
Chosen By NASA & JPL for Processing PCB's on the Successful
Mars Rovers Program. |
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The
patented protected technology within the
BigGrid™
AirBath™
presents the most effective solution for PCB pre-heating during
prototyping or rework at the bench for thru-hole and surface mount
technology including Ball Grid Arrays. Far more than just a
preheater, this is a Zephyrtronics AirBath™. |
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More Details:
Preheat Power:
Our
BigGrid™
AirBath with its
powerful 50 CFM (1,415
liters/min)
of air supply and its 4.13" x 3.81" (12.2cm x 9.7cm)
extra-large heating grid delivers its forced-convection
preheating power as needed for those "boards from hell" --
as many engineers like to say.
Beware of imitative pre-heaters with less than 13CFM (360
liters/minute) that crudely attempt to compensate for their
lack of preheat air volume with higher temp settings.
Remember: the glass transition of a FR-4 PCB is only
170°C. You don't want higher preheat temps, you want
a higher volume of safe preheated (100°C to 170°C) air for
your PCB's.
Loaded With Premium Features:
The
BigGrid™
gets into all the nooks and crannies of the PCB
assembly where hot plates and IR pre-heaters can't go (more
below). It is ESD-safe; features illuminated indicator
lights (blue: cooling; red: preheating); it is
self-contained with an internal air supply (no hookups); all
inside a durable, steel housing for industrial use and
long life.
Critical Thermal
Ramping: The
BigGrid™
AirBath
has the
the critically important industry standard, built-in temperature ramping
of
2° to 4°C per second preventing thermal shock to sensitive
chips, delicate ceramic caps and glass diodes. The ramp is "built in"
by design into every Zephyrtronics AirBath™
Preheating System. Beware of other "preheating devices"
where temp ramping is not controlled and too fast. |
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ZT-1-BGS BIG-GRID™ DIGITAL AIRBATH |
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DESCRIPTION |
ITEM # |
PRICE |
BUY
NOW |
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BIG-GRID™
DIGITAL
AIRBATH
50 CFM Air Power
(1,415 Liter/Min)
1,500 Watt Power
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ZT-1-BGS-DPU-120
(120 Volt for the U.S., Canada & Mexico) |
$1,985
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ZT-1-BGS-DPU-230
(230 Volt For All
Int'l Customers) |
$1,985 |
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BIG-GRID™
ANALOG
AIRBATH
50 CFM Air Power
(1,415 Liter/Min)
1,500 Watt Power
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ZT-1-BGS-MIL-120
(120 Volt for the U.S., Canada & Mexico) |
$1,450 |
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ZT-1-BGS-MIL-230
(230 Volt For All
Int'l Customers) |
$1,450 |
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*
We manufacture many other sizes of AirBaths.
Please note that The MegaGrid™ is our largest
AirBath Preheater and may be too big for your
applications. Please check out our entire
AirBath Catalog Directory
where we are certain that we have an AirBath Preheater tailored to your
company's PCB needs. |
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ABC SERIES OF ADJUSTABLE BOARD CRADLES |
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DESCRIPTION |
ITEM # |
PRICE |
BUY
NOW |
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ADJUSTABLE BOARD CRADLE
3-RAIL (10” X 18” MAX) |
ABC-1 |
$195 |
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ADJUSTABLE BOARD CRADLE
3-RAIL (20” X 18” MAX) |
ABC-2 |
$235 |
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ADJUSTABLE BOARD CRADLE
QUATRO (10” X 18” MAX) |
ABC-1-Q |
$235 |
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ADJUSTABLE BOARD CRADLE
QUATRO (20” X 18” MAX) |
ABC-2-Q |
$275 |
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The Many Benefits of
Preheating Your PCB: The benefits from preheating are
multiple and compounding. 1.) Preheating or "soaking" the
assembly prior to initiating reflow helps to activate the
flux, removing oxides and surface films from the leads and
pads to be soldered, thereby enhancing the wetting process
and solder joint quality. 2.) Preheating the board
permits lower soldering reflow temperatures. 3.)
Preheating reduces the final "dwell time" during the final
reflow stage. 4.) Preheating reduces thermal stresses
to the PCB substrate and its components when localized
reflow is made with soldering irons, de-soldering tools and
hot air systems. 5.) Preheating provides the thermal boost
needed when working with RoHS lead-free solders without
damaging the work!
For Thru-Hole, SMT & BGA Preheating Tasks: The
BigGrid™
AirBath
is ideal for all PCB challenges from low-volume production
runs, prototyping during design or during rework with all
component packages such as
BGA, CSP, QFP, QFN, TSOP, PLCC, SOIC,
SOL, LCC, Flip Chip and Glob Top components. And it easily
handles all substrates including FR-4, polyimide,
composites, flex circuits and ceramic boards.
Two
BigGrid™ AirBath
Models: Our
BigGrid™ AirBath
is available in two models: analog and digital. Both models
feature variable temperature selection between ambient (room
temp) and up to 205°C. Both models feature closed-loop
feedback temperature sensing control. The analog model has a
dial for temp selection on the front panel. The digital
model incorporates a digital set/read lighted display that
permits single digit/degree incremental temperature
selection in the "set" mode and tracks real time temperature
at the air exit point above the grids. |
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Your Lead-Free Solution: Working with the newer lead-free,
RoHS compliant solder alloys --- all having higher melting
points --- makes preheating more essential to any PCB work at
the bench. Don't raise temperatures higher on your soldering
irons, desoldering tools, hot air nozzles, thermal tweezers, or
hot air pencils! If you just briefly preheat the bottom of
your PCB before reflow, can perform your soldering or
desoldering on the top side of the board at traditional, lower
temperatures. |
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About the RoHS Lead-Free Solder Mandate:
Learn more here about the
European Lead-Free
Mandate & Preheating.
Zephyrtronics AirBath™ preheating systems are your Lead-Free,
RoHS soldering solutions radically reducing
the elevated solder reflow temps that
without preheat are needed with lead-free
alloys. |
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All Preheaters Are Not Created Equally:
Here are a few of the helpful applications and utilities of the
ZT-1-BigGrid AirBath™ |
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1.
Achieve High-End Superb
Thermal Profiles at the Bench with
the required industry standard 2°-4°C ramping to preheat!
The 2°-4°C ramp is "built in" to every
BigGrid™ AirBath
and prevents thermal shock of ceramic capacitors, glass
diodes and temperature sensitive components, plus ramping
helps prevent "pop-corning" of moisture within I.C.'s.
Importantly, preheating allows flux activation and the
ability to work at lower temps on the topside of the
PCB with your soldering tools. Effective preheating prevents
scorching substrates, damaging pads and components during
rework or prototyping.
2. A New Rework
Paradigm: Another benefit of preheating is that
it allows you the option to remove your SMD's below 150°C
with only the
BigGrid™ AirBath
and our
LOWMELT®
De-Solder through the proven process of co-metalization. No
nozzles! No lifting pads! No more burning PCB's! Your
BigGrid™
BigGrid
puts this option for rework at your fingertips even if you
think you'd never need it..
3. Non-Contact Hot Air Soldering:
One of the more popular benefits of the
BigGrid™ AirBath
is that you can now also use solder "paste" -- as well as
solder wire --- as is used in high volume soldering
production with a
Hot AirPencil
just your
BigGrid.
This is a 100% non-contact (NASA calls it "non-touch")
method of soldering at the bench and is, without a doubt,
the closest mirror to conveyor oven reflow yielding showcase solder joints
complete with fillets at both the toe and the
heel of the component, but preheating is mandatory.
4. Thru-Hole Rework:
Heavy ground planes? High copper content? Big heat sinks? No
problem! Your
BigGrid™ AirBath
makes desoldering thru-hole chips a breeze! Place your PCB over the AirBath™,
turn down temp settings on your desoldering tools and stop
lifting pads. This
is your preheat boost! You'll never de-solder thru-hole
without preheat again.
5. BGA Pad Redressing:
Stop using desoldering wick and soldering irons to clean up
after removing BGA's during rework. Stop lifting those
delicate BGA pads! Simply preheat your PCB with the AirBath, add flux and
LOWMELT® and swab your pads back to new.
Works on both the PCB's array of pads and the BGA's pads.
6. BGA, CSP Soldering &
DeSoldering. The
BigGrid™ AirBath
is also a modular component to to our comprehensive
ZT-7-ML BGA HOT AIR REFLOW SYSTEM.
So even if you are not yet working with BGA's, should
you do so in the future, your
Mega-Grid™
will already have you half the way there! Because, the your
BigGrid™
has all the essential features for BGA processing
incorporated in its design: industry standard ramp rate to
preheat; "post-cooling" for rapid cool-down which is
critical to the BGA reflow process; a large and generous
preheating grid with a powerful 50 CFM (1,415 liters/minute) of preheat power
which allows a lower final reflow temperature from your
nozzles above.
Digital Illuminated Temperature Display:
The ZT-1-BGS-DPU,
features all of the award winning attributes of the our
popular analog AirBath and takes process control one step
further...full digital, variable temperature control. A
convenient microprocessor control permits variable
temperature selection with an easy-to-use "set/read" digital
display function. |
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Preheating PCB at Benchtop
Mimics High Quality Thermal Profiles on Production Floor |
Remove Chip Quickly at Less Than 150°C with AirBath &
LOWMELT®
"Never Lift A Pad" |
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100% Non Contact , SMT Hot Air Solder Reflow With
the AirBath and a
Hot AirPencil.
Yields Highest Quality Joints. |
Thru-Hole Desoldering Made Easier & At Lower Temps With The AirBath Preheat Heavy Ground Planes? No Problem! |
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The
BigGrid™
&
LOWMELT®
Are Ideal for BGA Pad Redressing Below
150°C Without Wick or a Solder Iron. |
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The BigGrid™ Works Perfectly with the
ZT-7-MIL
BGA, CSP, SMT & Thru-Hole Hot Air Reflow Center. |
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Our Digital
Model Features
Lighted Temp Display With
Temp Set
& Read Functions |
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Comparing The 4 Methods of Preheating:
Pre-heating PCB assemblies falls into
four categories:
Use of hot plates, use of ovens, IR systems, and the use
of forced convection (warm air) up under the PCB:. While any preheating of
your PCB's prior to solder reflow is certainly better than none,
an objective analysis of the various methods of
preheating quickly reveals that
all preheating
methods are not equally effective or beneficial: |
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The
Oven: The use of an oven to pre-heat the substrate
before reworking and initiating solder reflow for either
removal and/or replacement of components can yield the
most uniform temperature profile as it warms both the
top and bottom of the PCB assembly as ovens also do in
high volume production equipment such as conveyor ovens
and wave solder machines. It's just a little problematic
to crawl inside an oven with your PCB to preheat while
your perform selective soldering or de-soldering tasks on
one side of the board. Of course, one can preheat in an
oven and then race with it in your high-gloved hands
back to the bench, but it's hardly a solution either.
The
Hot Plate: The
obvious limitation to the hot plate is that not all PCB
assemblies are single sided. In fact, in today's world
of hybrid and mixed technologies, the PCB that is
entirely flat or plane on one side is an exotic and rare
creature indeed. PCB's typically can carry heat sinks,
connectors, jumpers and transformers on both sides of
the substrate. These uneven surfaces on the board
present an indirect path of heat conduction from the hot
plate to the board assembly.
The IR
Plate Preheater: There are many drawbacks to IR
which is why it really never completely caught on. That
is not to say that, as with hot plates, there are
some applications that work with IR pre-heaters.
Some of drawbacks which have been enumerated in articles
in SMT Magazine, Circuits Assembly and in white papers
at electronic conventions are the difficulty in ramping
temps (some are better than others); shadowing caused by
high profile components on PCB's; and if the IR preheat
grid is very large it can make working on small PCB's
very uncomfortable for the technician (this is a very
common complaint). Still another great disadvantage to
IR preheaters is that they can not ever truly be
"temperature controlled" without the technician having
to always pre-assemble an external thermocouple into
every board before working on it. And that's a
continuous hassle and headache replete with quality
pitfalls and problems with inconsistent results. There are more, but these are
some of the key
setbacks. |
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The
Picture Tells the Story:
A Comparison of Two Popular
PCB
Preheating Methods |
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Forced
Convection Preheat, The AirBath™: The
market has long spoken with regards to the distinct
advantages and superiority of a
warm air bath in the pre-heating
process. Forced convection completely disregards the
topography (or bottomography) of the PCB, allowing
immediate, direct access of the warm air into all of the
nooks and crannies of the PCB assembly. And much like
the newer, popular forced
convection commercial ovens, the circulating warmed air
is far more effective than static warm air. |
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Post-Cooling™ By The AirBath™:
Further, an another clear advantage of a
Zephyrtronics AirBath™ is that with the flip of
a switch the unit immediately becomes a
post-cooler™ cooling down your PCB and its
components and most importantly, your solder
joints. Post-Cooling™ is essential to any
soldering of BGA's because hot air nozzles must
not be lifted from above the BGA until all the
balled joints have cooled so as not to cause
unwanted bridging. It's important to point out
the obvious: hot plates, static ovens and IR
plates do not provide the critical post-cooling™
feature standard on every Zephyrtronics
AirBath™. Again, our engineers introduced the
concept of post-cooling™ to the benchtop clear
back in 1994.
Typically, our AirBaths™ can cool BGA's after
reflow within only 8 second permitting the hot
air nozzle to be lifted without fear of
bridging. Without post-cooling™ the technician
has to wait for the ball/pad
interface to solidify completely before lifting
the nozzle to inspect or to move on to another
chip. The Post-Cooling™ feature remedies this
problem allowing rapid lifting of your hot air
nozzles from over the BGA after soldering. |
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The Post-Cooling™ Mode of the AirBath™
Cools Down BGA's After Soldering Within 8
Seconds Allowing Quicker Lifting Hot Air Nozzles
Preventing Bridging. |
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Zephyrtronics Led and Leads the World in Preheating PCB's: Judged "Best New Product of the Year" and winner of the prestigious "Vision Award" at the Surface Mount International Expo in Silicon Valley
in 1996 for its milestone contribution to the global production
of printed circuit cards , Zephyrtronics' AirBath™
was
recognized and spotlighted by SMT Magazine in 1997 as a "safer and simpler method for removing and repairing sensitive devices."
True, our AirBaths™
have inspired a lot of cheesy imitations which are little more
than hair dryers in a box, but that aside, we are still the
pioneers and understand the thermodynamics of preheating better
than anyone else. Our
AirBaths™
are the intelligent solution to stop burning up your printed circuit board assemblies by preventing thermal degradation, thermal shock, lifting pads & traces, substrate delamination, measling and warping of your boards.
It is no wonder
for over a decade now, these Zephyrtronics AirBaths™ have become the pre-heater of choice of nearly every major aerospace and semiconductor manufacturer. It truly is the one single tool that belongs on every bench. This is the "Science of Zephyrtronics." We have an AirBath™ for you. |
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The BigGrid™
AirBath, One of Our Larger, More Powerful AirBaths™ is Surprisingly
Compact in Size& Delivers 50CFM (1,415 Liters/Minute) & 1,500 Watts of Preheat
Power |
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Fully MIL-Spec Compliant and Approved for Space
Applications! |
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TECHNICAL DATA & SPECS |
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Models:
ZT-1-BGS-DPU-120:
120 VAC (U.S., Canada & Mexico)
Digital Model
ZT-1-BGS-DPU-230:
230 VAC International Digital Mode
ZT-1-BGS-MIL-120:
120 VAC (U.S., Canada & Mexico)
Analog
Model
ZT-1-BGS-MIL-230:
230 VAC International
Analog Model
Other: (All Models)
Power:
1,500
Watts
Electrical Construction: 3-Wire
Input with Earth Safety Ground
W x H x D:
12" x 4.5" x 7.2" (30 cm x 11 cm
x 18 cm)
Weight:
5.3 lbs (2.41 Kg)
Air
Volume: 50CFM or 1,415 Liters per
Minute
Preheating & Cooling
Air Grid: 16 sq. inches (110 Sq. Cm)
Temperature Modes:
Preheating & Cooling
Preheat
Temp Range: Ambient (Room Temp) to 205°C
(400°F)
Preheat Ramp Rate:
2-4° C per second
Cooling Temp:
Ambient
(Room Temp)
Temperature Stability:
± 3°C
(± 5 °F) at Idle.
Absolute Temperature Stability:
Meets
or Exceeds ANSI-J-STD
Air
Supply: Self-Contained Internal Supply
(No Air Hookups)
Construction: All Metal ESD Safe Construction
Warranty: All
One Year Limited Warranty Parts & Labor
Recommended: Use With ABC Series of
Board Cradles / Fixtures |
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FEATURES & BENEFITS |
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Our
BigGrid™ AirBath Was Used by NASA on Both Mars Rovers
Prevents Thermal Shock of Components
Permits Lower Soldering & DeSoldering Reflow Temperatures
Ideal for the Heaviest PCB's & Lead-Free Applications
Helps Prevent Warping Substrates & Damaging Pads
Superior Forced Convection Preheating
1,500 Watts of Preheat Power
16 Square Inch (110 sq. cm) Preheat Grid
Powerful 50 CFM (1,415 Liters/Minute) Air Volume
Digital & Analog Models
Preheating Mode With Red Lighted Indicator
Preheating Mode: Ambient (Room Temp) to 205°C
Post-Cooling™ Mode with Blue Lighted Indicator
Preheating Ramp Rate at Industry Standard 2°-4°C Per Second
Self-Contained (No Air Hook-Ups Required)
Small, Compact Construction Respects Benchtop Space
ESD Safe
One Year Limited Warranty Parts & Labor
Every Unit is
Individually Calibrated at the Zephyrtronics Factory |
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ZT-1-BGS BIG-GRID™ DIGITAL AIRBATH PREHEATER |
|
DESCRIPTION |
ITEM # |
PRICE |
BUY
NOW |
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BIG-GRID™
DIGITAL
AIRBATH
50
CFM Air Power
(1,415 Liter/Min)
1,500 Watt Power
|
ZT-1-BGS-DPU-120
(120 Volt for the U.S., Canada & Mexico) |
$1,985
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ZT-1-BGS-DPU-230
(230 Volt For All
Int'l Customers) |
$1,985 |
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BIG-GRID™
ANALOG
AIRBATH
50
CFM Air Power
(1,415 Liter/Min)
1,500 Watt Power
|
ZT-1-BGS-MIL-120
(120 Volt for the U.S., Canada & Mexico) |
$1,450 |
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ZT-1-BGS-MIL-230
(230 Volt For All
Int'l Customers) |
$1,450 |
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*
We manufacture many other sizes of AirBaths.
Please note that The MegaGrid™ is our largest
AirBath Preheater and may be too big for your
applications. Please check out our entire
AirBath Catalog Directory
where we are certain that we have an AirBath Preheater tailored to your
company's PCB needs. |
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ABC SERIES OF ADJUSTABLE BOARD CRADLES |
|
DESCRIPTION |
ITEM # |
PRICE |
BUY
NOW |
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ADJUSTABLE BOARD CRADLE
3-RAIL (10” X 18” MAX) |
ABC-1 |
$195 |
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ADJUSTABLE BOARD CRADLE
3-RAIL (20” X 18” MAX) |
ABC-2 |
$235 |
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ADJUSTABLE BOARD CRADLE
QUATRO (10” X 18” MAX) |
ABC-1-Q |
$235 |
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ADJUSTABLE BOARD CRADLE
QUATRO (20” X 18” MAX) |
ABC-2-Q |
$275 |
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OPTIONAL ACCESSORIES |
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DESCRIPTION
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ITEM #
|
PRICE
|
BUY NOW |
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EXTRA/REPLACEMENT POSTS (SET OF 4)
2-POST AND 8-POST POSITIONING
(8 POSTS ALLOW PCB INSIDE OF ABC TO BE FLIPPED UP & DOWN DURING THRU-HOLE DESOLDERING)
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ABC-LG
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$49.85
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“Z” HEIGHT ADJUSTMENT POSTS
(SET OF 4)
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ABC-ZP
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$100.00
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©1996 - 2008 Ameritronics®. All rights reserved. The
information you receive online from Ameritronics® is
protected by the copyright laws of the United States.
The copyright laws prohibit any copying, redistributing,
retransmitting, or repurposing of any
copyright-protected material. Ameritronics® is the
registered trademark property of JTI, Inc.
"Zephyrtronics" and "Zephlux" and "ZeroLead" and "Zero
Balling" and "Zero Residue" and "Post Cooling" are the
protected trademark property of JTI, Inc. |
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SMD Rework,
SMT Rework
AirBath,
SMD Rework
Stations,
Hot Air
Pencil Soldering,
BGA Rework
Stations,
CSP Rework
Stations,
Preheating
Systems,
PCB
Preheaters,
Pre-Heat
SMT / SMD,
Low Temp Rework,
SMT
DeSoldering Tools,
Vacuum
Pickup Tools,
Circuit
Board Holders,
PCB
Fixtures,
Board
Cradles,
Rework
Solder Paste, No-Clean
Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder
Wire,
Hot Air
Rework Stations,
Fume
Extractors,
SMT Dental
Probes,
SMT-SMD
Rework Kit,
BGA Rework
Kit,
LMK Kit,
BGA
Re-Balling Kit,
SMD
Tweezers,
Power Palm
Plunger
How To - SMT, CSP, BGA Rework
How To -
BGA Alignment:
How To -
SMT Rework:
How To - PCB Preheating,
How To -
BGA & CSP Rework:
How To -
Quickly Solder SMD Packages Effectively:
How To -
CSP Alignment;
How To -
Lead-Free Rework;
How To -
SMD Removal Economical;
How To -
SMD Removal Professional:
How To -
Hot Air Pencil / AirPencil Soldering;
How To -
SMD Quick Chip Removal;
How To -
BGA Re-Balling;
How To -
Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP:
How To -
Solder & Rework Ceramic Capacitors:
How To -
Solder & Rework Glass Diodes:
Soldering,
De-Soldering
Soldering
Accessories,
Solder
Wire,
No-Clean
Solder Wire,
Eutectic
Solder Wire,
Solder Wire
Dispenser,
Solder
Paste,
Lead-Free
Solder Paste,
Flux,
Solder
Paste Dispensers,
LowMelt®
DeSolder Wire,
De-Solder
Wire,
Soldering
Irons,
Digital
Soldering Station,
Digital
De-Soldering,
MIL-Spec
Soldering Station:
ESD
Soldering Station,
Soldering
Tips,
Thru-Hole
DeSoldering Tools,
Desoldering
Tip,
Tips for
Desoldering,
De-Solder
Wick,
Smoke
Extractors,
Fume
Extractor Filters,
Carbon
Activated Filters,
SolderMill™,
Pre-Heating
Systems,
Preheat
Thru-Hole,
PCB
Pre-Heating,
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