|
|
|
|
|
|
|
 |
|
 |
|
|
|
| |
|
 |
|
|
|
 |
|
|
|
|
|
|
|
|
OUR
HEAVY INDUSTRIAL PRE-HEATING SERIES |
|
|
 |
|
|
|
|
|
ZT-1 HIS PRE-HEATING
AIRBATHS™
Bottom-Side Convection Pre-Heating for PCB, Thru-Hole,
SMD, SMT,
QFN & BGA Rework & Repair |
|
|
Order
Securely
On-Line. |
Order
Securely
On-Line. |
|
|
|
|
|
Powerful 800 Watts With Ample 25 CFM AIR SUPPLY
(710 Liters per Minute) |
|
|
|
|
|
The
Zephyrtronics' AirBath “bathes the circuit board in warm air to
reduce thermal stresses to the board and its components.”-- NASA
Report, January 9, 2004 |
|
|
|
|
|
|
 |
Here are our award-winning and patent protected ZT-1-HIS (Heavy Industrial) AirBath™
Pre-heating Systems, your effective solution to
preheat
printed circuit board assemblies during low-volume or prototyping tasks, and in rework and repair.
Two Models: Digital & Analog! Our
ZT-1-HIS AirBaths™
are available in two popular models: Digital and Analog. Both
models feature a powerful 25 CFM (710 Liters/Minute) of air supply.
And because of our
greater volume of air supply, you can pre-heat at far lower
temps than with other ineffective preheating devices
limited by their low air volume outputs and which require higher
temps and which will burn your boards. Not an imitative,
"preheating toy", this is your preheating tool.
800 Watts of Power: Coupled with our ample air output is
our 800 Watts of preheating capacity. This is effective
preheating by design! |
|
|
|
|
|
|
The ZT-1-HIS
AirBath Chosen By Boeing for the International Space Station
Project. |
|
|
|
|
|
|
More Details: |
|
|
Preheat Power:
Our
ZT-1-HIS
AirBath™
Systems, with a generous and powerful 25
CFM (710 Liters/Minute) of air supply from the AirCone™ delivers its forced-convection preheating power for even the
most challenging PCB's.
Beware of imitative
pre-heaters with less than 13CFM (360 liters/minute) that
crudely attempt to compensate for their lack of preheat air
volume
with higher temp settings.
Remember: the glass transition of a FR-4 PCB is only
170°C. You don't want higher preheat temps, you want
a higher volume of safe preheated (100°C to 170°C) air for
your PCB's.
Loaded With Premium Features:
The
ZT-1-HIS
AirBaths™
get into all the nooks and crannies of the PCB assembly
where hot plates and IR pre-heaters can't go (more below).
It is ESD-safe; features illuminated indicator lights (blue:
cooling; red: preheating); it is self-contained with an
internal air supply (no hookups); all inside a
durable, steel housing for industrial use and long
production life.
Critical Thermal
Ramping: The
ZT-1-HIS
AirBaths™
have the industry standard, built-in temperature ramping at
2° to 4°C per second preventing thermal shock to sensitive
chips, ceramic caps and glass diodes. The ramp is "built in"
by design into every Zephyrtronics AirBath™
Preheating System. Our ramping was essential to Motorola®
and Boeing with their space applications. |
|
|
ZT-1-HIS HEAVY INDUSTRIAL AIRBATH PREHEATERS |
|
DESCRIPTION |
ITEM # |
PRICE |
BUY
NOW |
 |
DIGITAL
AIRBATH
25 CFM Air Power
(710 Liter/Min)
800 Watt Power
|
ZT-1-HIS-DPU-120
120 Volt for the U.S., Canada & Mexico) |
$1,395
|
|
|
ZT-1-HIS-DPU-230
230 Volt for Our
International Customers |
$1395 |
|
 |
ANALOG
AIRBATH
25 CFM Air Power
(710 Liter/Min)
800 Watt Power
|
ZT-1-HIS-MIL-120
120 Volt for the
U.S., Canada & Mexico |
$999 |
|
|
|
|
*
We manufacture many other sizes of AirBaths.
Please note that The MegaGrid™ is our largest
AirBath Pre-heater and may be too big for your
applications. Please check out our entire
AirBath Catalog Directory
where we are certain that we have an AirBath Pre-heater tailored to your
company's PCB needs. |
|
|
|
ABC SERIES OF ADJUSTABLE BOARD CRADLES |
|
DESCRIPTION |
ITEM # |
PRICE |
BUY
NOW |
 |
ADJUSTABLE BOARD CRADLE
3-RAIL (10” X 18” MAX) |
ABC-1 |
$195 |
|
ADJUSTABLE BOARD CRADLE
3-RAIL (20” X 18” MAX) |
ABC-2 |
$235 |
|
 |
ADJUSTABLE BOARD CRADLE
QUATRO (10” X 18” MAX) |
ABC-1-Q |
$235 |
|
ADJUSTABLE BOARD CRADLE
QUATRO (20” X 18” MAX) |
ABC-2-Q |
$275 |
|
|
|
|
|
|
|
The Many Benefits of
Preheating Your PCB: The benefits from preheating are
multiple and compounding. 1.) Preheating or "soaking" the
assembly prior to initiating reflow helps to activate the
flux, removing oxides and surface films from the leads and
pads to be soldered, thereby enhancing the wetting process
and solder joint quality. 2.) Preheating the board
permits lower soldering reflow temperatures. 3.)
Preheating reduces the final "dwell time" during the final
reflow stage. 4.) Preheating reduces thermal stresses
to the PCB substrate and its components when localized
reflow is made with soldering irons, de-soldering tools and
hot air systems. 5.) Preheating provides the thermal boost
needed when working with RoHS lead-free solders without
damaging the work!
For Thru-Hole, SMT & BGA Preheating Tasks: The
HIS Series
AirBath Preheating Systems
is ideal for all PCB challenges from low-volume production
runs, prototyping during design or during rework with all
component packages such as
BGA, CSP, QFP, QFN, TSOP, PLCC, SOIC,
SOL, LCC, Flip Chip and Glob Top components. And it easily
handles all substrates including FR-4, polyimide,
composites, flex circuits and ceramic boards. |
|
|
|
|
|
|
|
|
|
|
|
|
Two AirBath™ HIS Models: Our
HIS Series of
AirBaths™
are available in two models: Analog and Digital.
Both models feature variable temperature selection
between ambient (room temp) and up to 205°C. Both
models feature closed-loop feedback temperature
sensing control. The analog model has a dial for
temp selection on the front panel. The digital model
incorporates a digital set/read lighted display that
permits single digit/degree incremental temperature
selection in the "set" mode and tracks real time
temperature at the air exit point above the grids.
Our Analog Model provides the two most common
preheat settings: 100°C and 150°C. |
|
 |
 |
|
|
|
|
Model ZT-1-HIS-DPU
Features Digital Temp Display With Temp
Set
& Read Functions
on Front Panel. |
|
|
Model ZT-1-HIS-MIL
Features the Two Most Common Preheat Temps:
100°C & 150°C By Rocker Switch.
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
|
Your Lead-Free Solution: Working with the newer lead-free,
RoHS compliant solder alloys --- all having higher melting
points --- makes preheating more essential to any PCB work at
the bench. Don't raise temperatures higher on your soldering
irons, desoldering tools, hot air nozzles, thermal tweezers, or
hot air pencils! If you just briefly preheat the bottom of
your PCB before reflow, can perform your soldering or
desoldering on the top side of the board at traditional, lower
temperatures. |
|
|
|
|
|
|
|
|
|
|
About the RoHS Lead-Free Solder Mandate:
Learn more here about the
European Lead-Free
Mandate & Preheating.
Zephyrtronics AirBath™ preheating systems are your Lead-Free,
RoHS soldering solutions radically reducing
the elevated solder reflow temps that
without preheat are needed with lead-free
alloys. No need to burn your PCB's when you
have an AirBath™. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
All Preheaters Are Not Created Equally:
Here are a few of the helpful applications and utilities of the
ZT-1-HIS
AirBaths™ |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1.
Achieve High-End Superb
Thermal Profiles at the Bench with
the required industry standard 2°-4°C ramping to preheat!
The 2°-4°C ramp is "built in" to every
Zephyrtronics AirBath™
and prevents thermal shock of ceramic capacitors, glass
diodes and temperature sensitive components, plus ramping
helps prevent "pop-corning" of moisture within I.C.'s.
Importantly, preheating allows flux activation and the
ability to work at lower temps on the topside of the
PCB with your soldering tools. Effective preheating prevents
scorching substrates, damaging pads and components during
rework or prototyping.
2. A New Rework
Paradigm: Another benefit of preheating is that
it allows you the option to remove your SMD's below 150°C
with only an AirBath™ and our
LOWMELT®
De-Solder through the proven process of co-metalization. No
nozzles! No lifting pads! No more burning PCB's! Your AirBath™
puts this extra rework option right at your fingertips.
3. Non-Contact Hot Air Soldering:
One of the more popular benefits of the AirBath™ is that you can now also use solder "paste" -- as well as
solder wire --- as is used in high volume soldering
production with a
Hot AirPencil
just your AirBath™.
This is a 100% non-contact (NASA calls it "non-touch")
method of soldering at the bench and is, without a doubt,
the closest mirror to conveyor oven reflow yielding showcase solder joints
complete with fillets at both the toe and the
heel of the component, but preheating is mandatory.
4. Thru-Hole Rework:
Heavy ground planes? High copper content? Big heat sinks? No
problem! Your AirBath™
makes desoldering thru-hole chips a breeze! Place your PCB over the AirBath™,
turn down temp settings on your desoldering tools and stop
lifting pads. This
is your preheat boost! You'll never de-solder thru-hole
without preheat again.
5. Heat Shrink Tubing: The AirBath™ is ideal for your shrink tubing. Superior to heat guns that can burn and tear your
wire insulation or heat-shrink tubing, the AirBath™ is temperature controlled.
6. BGA, CSP Soldering &
DeSoldering. Your AirBath™
is also a modular component to to our comprehensive
ZT-7-ML BGA HOT AIR REFLOW SYSTEM.
So even if you are not yet working with BGA's, should
you do so in the future, your AirBath™
will already have you half the way there! Because, the
AirBath™
has all the essential features for BGA processing
incorporated in its design: industry standard ramp rate to
preheat; "post-cooling" for rapid cool-down which is
critical to the BGA reflow process; a generous and powerful
25CFM
(710
Liters/Minute)
of preheat power
from the AirCone™ which allows a lower final reflow temperature from your
nozzles above. |
|
|
|
|
|
|
|
|
|
 |
 |
|
|
|
Preheating PCB at Benchtop
Mimics High Quality Thermal Profiles on Production Floor |
Remove Chip Quickly at Less Than 150°C with AirBath &
LOWMELT®
"Never Lift A Pad" |
|
|
|
|
|
|
|
|
|
|
 |
 |
|
|
|
|
|
|
|
|
|
|
100% Non Contact , SMT Hot Air Solder Reflow With
the AirBath and a
Hot AirPencil.
Yields Highest Quality Joints. |
Thru-Hole Desoldering Made Easier & At Lower Temps With The AirBath Preheat Heavy Ground Planes? No Problem! |
|
|
|
|
|
|
|
|
|
|
 |
 |
|
|
|
|
|
|
|
|
|
|
Ideal For Heat Shrink Tube Applications...Far Superior To Uncontrolled Heat Guns! |
|
The BigGrid™ Works Perfectly with the
ZT-7-MIL
BGA, CSP, SMT & Thru-Hole Hot Air Reflow Center. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Comparing The 4 Methods of Preheating:
Pre-heating PCB assemblies falls into
four categories:
Use of hot plates, use of ovens, IR systems, and the use
of forced convection (warm air) up under the PCB:. While any preheating of
your PCB's prior to solder reflow is certainly better than none,
an objective analysis of the various methods of
preheating quickly reveals that
all preheating
methods are not equally effective or beneficial: |
|
|
|
|
 |
|
|
The
Oven: The use of an oven to pre-heat the substrate
before reworking and initiating solder reflow for either
removal and/or replacement of components can yield the
most uniform temperature profile as it warms both the
top and bottom of the PCB assembly as ovens also do in
high volume production equipment such as conveyor ovens
and wave solder machines. It's just a little problematic
to crawl inside an oven with your PCB to preheat while
your perform selective soldering or desoldering tasks on
one side of the board. Of course, one can preheat in an
oven and then race with it in your high-gloved hands
back to the bench, but it's hardly a solution either.
The
Hot Plate: The
obvious limitation to the hot plate is that not all PCB
assemblies are single sided. In fact, in today's world
of hybrid and mixed technologies, the PCB that is
entirely flat or plane on one side is an exotic and rare
creature indeed. PCB's typically can carry heat sinks,
connectors, jumpers and transformers on both sides of
the substrate. These uneven surfaces on the board
present an indirect path of heat conduction from the hot
plate to the board assembly.
The IR
Plate Preheater: There are many drawbacks to IR
which is why it really never completely caught on. That
is not to say that, as with hot plates, there are
some applications that work with IR pre-heaters.
Some of drawbacks which have been enumerated in articles
in SMT Magazine, Circuits Assembly and in white papers
at electronic conventions are the difficulty in ramping
temps (some are better than others); shadowing caused by
high profile components on PCB's; and if the IR preheat
grid is very large it can make working on small PCB's
very uncomfortable for the technician (this is a very
common complaint). Still another great disadvantage to
IR preheaters is that they can not ever truly be
"temperature controlled" without the technician having
to always pre-assemble an external thermocouple into
every board before working on it. And that's a
continuous hassle and headache replete with quality
pitfalls and problems with inconsistent results. There are more, but these are
some of the key
setbacks. |
|
|
|
|
|
The
Picture Tells the Story:
A Comparison of Two Popular PCB
Preheating Methods |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Forced
Convection Preheat, The AirBath™: The
market has long spoken with regards to the distinct
advantages and superiority of a
warm air bath in the pre-heating
process. Forced convection completely disregards the
topography (or bottomography) of the PCB, allowing
immediate, direct access of the warm air into all of the
nooks and crannies of the PCB assembly. And much like
the newer, popular forced
convection commercial ovens, the circulating warmed air
is far more effective than static warm air. |
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
Post-Cooling™ By The AirBath™:
Further, an another clear advantage of a
Zephyrtronics AirBath™ is that with the flip of
a switch the unit immediately becomes a
post-cooler™ cooling down your PCB and its
components and most importantly, your solder
joints. Post-Cooling™ is essential to any
soldering of BGA's because hot air nozzles must
not be lifted from above the BGA until all the
balled joints have cooled so as not to cause
unwanted bridging. It's important to point out
the obvious: hot plates, static ovens and IR
plates do not provide the critical post-cooling™
feature standard on every Zephyrtronics
AirBath™. Again, our engineers introduced the
concept of post-cooling™ to the benchtop clear
back in 1994.
Typically, our AirBaths™ can cool BGA's after
reflow within only 8 second permitting the hot
air nozzle to be lifted without fear of
bridging. Without post-cooling™ the technician
has to wait for the ball/pad
interface to solidify completely before lifting
the nozzle to inspect or to move on to another
chip. The Post-Cooling™ feature remedies this
problem allowing rapid lifting of your hot air
nozzles from over the BGA after soldering. |
|
|
The Post-Cooling™ Mode of the AirBath™
Cools Down BGA's After Soldering Within 8
Seconds Allowing Quicker Lifting Hot Air Nozzles
Preventing Bridging. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Zephyrtronics Led and Leads the World in Preheating PCB's: Judged "Best New Product of the Year" and winner of the prestigious "Vision Award" at the Surface Mount International Expo in Silicon Valley
in 1996 for its milestone contribution to the global production
of printed circuit cards , Zephyrtronics' AirBath™
was
recognized and spotlighted by SMT Magazine in 1997 as a "safer and simpler method for removing and repairing sensitive devices."
True, our AirBaths™
have inspired a lot of cheesy imitations which are little more
than hair dryers in a box, but that aside, we are still the
pioneers and understand the thermodynamics of preheating better
than anyone else. Our
AirBaths™
are the intelligent solution to stop burning up your printed circuit board assemblies by preventing thermal degradation, thermal shock, lifting pads & traces, substrate delamination, measling and warping of your boards.
It is no wonder
for over a decade now, these Zephyrtronics AirBaths™ have become the pre-heater of choice of nearly every major aerospace and semiconductor manufacturer. It truly is the one single tool that belongs on every bench. This is the "Science of Zephyrtronics." We have an AirBath™ for you. |
|
|
 |
|
|
|
|
|
|
|
|
|
|
|
|
|
The ZT-HIS-DPU
Digital AirBath™, Established the Standard for Preheating.
Suprisingly Compact in Footprint, It Delivers 25CFM (710
Liters/Minute) and 800 Watts of Pre-heat
Power. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Fully MIL-Spec Compliant and Approved for Space
Applications! |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
TECHNICAL DATA & SPECS |
|
|
Models:
ZT-1-HIS-DPU-120:
120 VAC (U.S., Canada & Mexico)
Digital Model
ZT-1-HIS-DPU-230:
230 VAC International Digital Mode
ZT-1-HIS-MIL-120:
120 VAC (U.S., Canada & Mexico)
Analog
Model
Other: (All Models)
Power:
800
Watts
Electrical Construction: 3-Wire
Input with Earth Safety Ground
W x H x D:
12" x 4.5" x 7.2" (30 cm x 11 cm
x 18 cm)
Weight:
5.3 lbs (2.41 Kg)
Air
Volume: 25CFM or 710 Liters/Minute
Temperature Modes:
Preheating & Cooling from AirCone™
Preheat
Temp Range: Ambient (Room Temp) to 205°C
(400°F)
Preheat Ramp Rate:
2-4° C per second
Cooling Temp:
Ambient
(Room Temp)
Temperature Stability:
± 3°C
(± 5 °F) at Idle.
Absolute Temperature Stability:
Meets
or Exceeds ANSI-J-STD
Air
Supply: Self-Contained Internal Supply
(No Air Hookups)
Construction: All Metal ESD Safe Construction
Warranty:
One Year Limited Warranty Parts & Labor
Recommended: Use With ABC Series of
Board Cradles / Fixtures |
|
|
FEATURES & BENEFITS |
|
The
Preheating System Used By Boeing on International Space
Station
Prevents Thermal Shock of Components
Permits Lower Soldering & DeSoldering Reflow Temperatures
Ideal for the Heaviest PCB's & Lead-Free Applications
Helps Prevent Warping Substrates & Damaging Pads
Superior Forced Convection Preheating
800
Watts of Preheat Power
Powerful 25 CFM (710
Liters/Minute) Air Volume
Digital & Analog Models
Illuminated Indicator Lights. Pre-Heating: Red.
Cooling: Blue.
Analog Preheating Model: Dual Settings 100°C & 150°C
Digital Preheating Model: Variable Temp From Room Temp to
205°C
Preheating Ramp Rate at Industry Standard 2°-4°C Per Second
Self-Contained (No Air Hook-Ups Required)
Small, Compact Construction Respects Bench Top Space
One Year Limited Warranty Parts & Labor
ESD Safe Each Unit is
Calibrated at the Zephyrtronics California Factory |
|
|
|
|
|
|
|
|
|
|
ZT-1-BGS BIG-GRID™ DIGITAL AIRBATH PREHEATER |
|
DESCRIPTION |
ITEM # |
PRICE |
BUY
NOW |
|
|
DIGITAL
AIRBATH PREHEATING SYSTEM
25 CFM Air Power
800 Watt Power
|
ZT-1-HIS-DPU-120
(120 Volt for the U.S., Canada & Mexico) |
$1,395
|
|
|
ZT-1-HIS-DPU-230
(230 Volt For All
Int'l Customers) |
$1,395 |
|
|
|
ANALOG
AIRBATH PREHEATING
SYSTEM
25 CFM Air Power
800 Watt Power
|
ZT-1-HIS-MIL-120
(120 Volt for the U.S., Canada & Mexico) |
$999 |
|
|
|
|
|
|
|
*
We manufacture many other sizes of AirBaths.
Please note that The MegaGrid™ is our largest
AirBath Preheater and may be too big for your
applications. Please check out our entire
AirBath Catalog Directory
where we are certain that we have an AirBath Preheater tailored to your
company's PCB needs. |
|
|
ABC SERIES OF ADJUSTABLE BOARD CRADLES |
|
DESCRIPTION |
ITEM # |
PRICE |
BUY
NOW |
|
|
ADJUSTABLE BOARD CRADLE
3-RAIL (10” X 18” MAX) |
ABC-1 |
$195 |
|
ADJUSTABLE BOARD CRADLE
3-RAIL (20” X 18” MAX) |
ABC-2 |
$235 |
|
|
|
ADJUSTABLE BOARD CRADLE
QUATRO (10” X 18” MAX) |
ABC-1-Q |
$235 |
|
ADJUSTABLE BOARD CRADLE
QUATRO (20” X 18” MAX) |
ABC-2-Q |
$275 |
|
|
|
OPTIONAL ACCESSORIES |
|
DESCRIPTION
|
ITEM #
|
PRICE
|
BUY NOW |
|
EXTRA/REPLACEMENT POSTS (SET OF 4)
2-POST AND 8-POST POSITIONING
(8 POSTS ALLOW PCB INSIDE OF ABC TO BE FLIPPED UP & DOWN DURING THRU-HOLE DESOLDERING)
|
ABC-LG
|
$49.85
|
|
|
“Z” HEIGHT ADJUSTMENT POSTS
(SET OF 4)
|
ABC-ZP
|
$100.00
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
|
©1996 - 2008 Ameritronics®. All rights reserved. The
information you receive online from Ameritronics® is
protected by the copyright laws of the United States.
The copyright laws prohibit any copying, redistributing,
retransmitting, or repurposing of any
copyright-protected material. Ameritronics® is the
registered trademark property of JTI, Inc.
"Zephyrtronics" and "Zephlux" and "ZeroLead" and "Zero
Balling" and "Zero Residue" and "Post Cooling" are the
protected trademark property of JTI, Inc. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
|
SMD Rework,
SMT Rework
AirBath,
SMD Rework
Stations,
Hot Air
Pencil Soldering,
BGA Rework
Stations,
CSP Rework
Stations,
Preheating
Systems,
PCB
Preheaters,
Pre-Heat
SMT / SMD,
Low Temp Rework,
SMT
DeSoldering Tools,
Vacuum
Pickup Tools,
Circuit
Board Holders,
PCB
Fixtures,
Board
Cradles,
Rework
Solder Paste, No-Clean
Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder
Wire,
Hot Air
Rework Stations,
Fume
Extractors,
SMT Dental
Probes,
SMT-SMD
Rework Kit,
BGA Rework
Kit,
LMK Kit,
BGA
Re-Balling Kit,
SMD
Tweezers,
Power Palm
Plunger
How To - SMT, CSP, BGA Rework
How To -
BGA Alignment:
How To -
SMT Rework:
How To - PCB Preheating,
How To -
BGA & CSP Rework:
How To -
Quickly Solder SMD Packages Effectively:
How To -
CSP Alignment;
How To -
Lead-Free Rework;
How To -
SMD Removal Economical;
How To -
SMD Removal Professional:
How To -
Hot Air Pencil / AirPencil Soldering;
How To -
SMD Quick Chip Removal;
How To -
BGA Re-Balling;
How To -
Rework PLCC - QFP, QFN, LCC, SOIC, Sub Shielded SMD, TSOP:
How To -
Solder & Rework Ceramic Capacitors:
How To -
Solder & Rework Glass Diodes:
Soldering,
De-Soldering
Soldering
Accessories,
Solder
Wire,
No-Clean
Solder Wire,
Eutectic
Solder Wire,
Solder Wire
Dispenser,
Solder
Paste,
Lead-Free
Solder Paste,
Flux,
Solder
Paste Dispensers,
LowMelt®
DeSolder Wire,
De-Solder
Wire,
Soldering
Irons,
Digital
Soldering Station,
Digital
De-Soldering,
MIL-Spec
Soldering Station:
ESD
Soldering Station,
Soldering
Tips,
Thru-Hole
DeSoldering Tools,
Desoldering
Tip,
Tips for
Desoldering,
De-Solder
Wick,
Smoke
Extractors,
Fume
Extractor Filters,
Carbon
Activated Filters,
SolderMill™,
Pre-Heating
Systems,
Preheat
Thru-Hole,
PCB
Pre-Heating,
Flux
Solvent,
How To - Connector Rework;
How To -
PC/104 Soldering and Rework;
How To -
Thru-Hole / Through Hole Desolder / De-Solder;
How To -
Low Melt® Desolder Wire;
How To-
Stop Lifting Pads;
How To-
Desolder / De-Solder Heavy Ground Planes;
How To -
Lead-Free Soldering and De-Soldering;
Preheaters
for Lead-Free Rework and Soldering
Dispensing
Dispensing
Systems,
Dispensing
Syringes,
Dispensing
Barrels,
Tapered
Tips,
Blunt
Needles,
Stainless
Steel Needles,
Dispensing
Needles,
Industrial
Needles,
Dispensing
Tips,
Dispensing
Accessories,
Solder
Paste in Syringe,
Lead-Free
Solder Paste in Syringe,
Paste Rack™
Solder Paste Holder,
Dispensing
Supplies,
Power Palm
Plunger,
Manual
Dispensing,
Automatic
Dispensing
Benchtop Accessories,
Bench Supplies,
Benchtop Tools
SMD Solder
Paste,
Lead-Free
Solder Paste,
Solder
Wire,
LowMelt®,
No-Clean
Flux,
BGA Flux,
Rework Tack
Flux,
Non-Flammable Flux Remover,
Inspection
Equipment,
Magnification Equipment,
Magnifying
Work Light,
ESD
Magnifier,
Pen Vac,
SMT
Tweezers,
| |
